Metsä Board To Open Packaging Studio In Milan This Summer Norwalk, Connecticut based Metsä Board, part of Metsä Group, will open a new Packaging Design Studio in Milan in summer 2026, a significant step in accelerating pack- aging innovation and strengthening collaboration with European brand owners, converters, and packaging de- velopers. “Located in one of Europe’s leading design capitals, the Milan studio gives us a perfect setting to work even more closely with our customers. The studio makes it easy to connect, test ideas and move towards solutions that keep pace with the fast-evolving packaging landscape,“ says Erja Hyrsky, SVP, Commercial Operations. Equipped with modern tools and advanced AI-sup- ported design and simulation technologies, the studio will enhance the way workshops, design sprints, and co-cre- ation sessions are carried out more effectively, especially in projects where sustainability targets, performance re- quirements or regulatory changes drive the need for new solutions. Bringing packaging design, product development, and technical competence into one location enables greater cooperation across the packaging value chain. The studio provides a place where insights, materials, and manufac- turing requirements can be considered holistically, sup-
porting customers in developing solutions that are both functional and ready for implementation. “With the new studio in Milan, we are creating a space where innovation, design, and technical excellence meet,” says Ilkka Harju, Director, Packaging Design Services.
The Milan studio complements Metsä Board’s existing Excellence Centre in Äänekoski, Finland, which focuses on material research, packaging performance testing, and holistic packaging development, as well as the company’s Packaging Design Studio in Norwalk, CT, which supports customers in North America. Opening in summer 2026, the Milan Packaging Design Studio will welcome customers, partners, and industry stakeholders to explore and develop new packaging solu- tions together.
18 March 16, 2026
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