ECOC 2023 MARKET FOCUS
functions can be deployed and replaced with a reasonable effort. The benefit of an SDN architecture must outweigh the effort for deploying it. 5G Convergence and Future Challenges for Optical Networks Telecom Italia: Andrea Di Giglio 5G enables innovative use cases in different fields: Industry 4.0, eHealth, Smart Energy, smart Cities, Media & Entertainment, Automotive. Each of this use cases generates traffic with different requirements in terms of e.g. throughput, latency, jitter, security, reliability. In 5G RAN and core slices are adopted to segregate traffic and to guarantee different requirements for different clients. 3-D Structured Light and sensing Ommatidia LiDAR: Gregory Pandraud Accurate three-dimensional (3D) imaging is essential for machines and vehicles to map and interact with the physical world. Although numerous 3D imaging technologies exist, each addressing niche applications with varying degrees of success, none has achieved the breadth of applicability and impact that digital image sensors have in the two- dimensional imaging world. The State of Quantum Cryptography Market: A Closer Look at CV-QKD Technology LuxQuanta: Sergi Vizcaíno Fuentes, Strategy & Outreach Manager This talk aims to provide an in-depth, accurate assessment of the Quantum Cryptography market, equipping the audience with a comprehensive understanding of it. We will also offer a preview of our Continuous Variable Quantum Key Distribution (CV-QKD) system, NOVA LQ™. This system generates unhackable keys and seamlessly integrates into existing optical networks, coexisting with data transmission over the same fibre. Practical Considerations for Achieving Quantum-Secure Optical Networks Ciena: Robert Keys, Sr. Director, Optical Transmission R&D In this presentation, a roadmap from quantum security to quantum communications on telecom networks will be discussed. There is increasing concern around development of quantum computers and their potential to render public key encryption vulnerable. The proposed mitigation of the quantum threat is, not surprisingly, based on quantum optical technologies, that is quantum key distribution. But will the mitigation be ready and deployed before the threat emerges? We will discuss the steps that are necessary to deploy quantum secure optical networks by looking through the lens of the telecom equipment provider.
Analog Receive Optics – A Robust Alternative to LPO MaxLinear, Inc.: Drew Guckenberger, Vice President High Speed Interconnect Much industry attention is currently being given to Linear Pluggable Optics (LPO) due to its potential for reduced power and latency in 100G links. Despite these potential advantages, LPO comes with several challenges related to link robustness, variability and interoperability that could limit volume deployments. It is also not scalable to 200G/lane. Here we discuss a compromise solution called Analog Receive Optics (ARO), with DSP functionality only on the optical transmit path. Next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding and Facet- Attached Micro-Optical Elements Vanguard Automation GmbH: Thorsten Mayer, CEO Photonic Wire Bonding allows to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. 3D nano- printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibres, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.
ultra-high external modulation formats around 1300nm, and high-power narrow linewidth lasers for FMCW Lidar. We will report on the latest developments including optimised laser design, wafer fab process technology trends, device parametric performance and reliability. Understanding Vertical Integration and The Technology Behind Coherent Pluggables Infinera: David F. Welch, Ph.D. co- founder and Chief Innovation Officer This session presents a comprehensive overview of the design principles and best practices in building high performance coherent pluggables. The session will focus on the key building blocks such as the digital signal processor (DSP), transmit/receive optical sub-assemblies (TROSA), radio frequency application-specific integrated circuit (ASIC) and other opto-electronic components, and how to leverage vertical integration and monolithic indium phosphide photonic integrated circuits to maximise performance reduce power consumption and enhance reliability. Fujitsu 1FINITY Ultra Optical System Novelties for Deepest Network Insights Fujitsu Network Communications: Muhammad Sarwar, Distinguished Planner, Advanced Technology and Architecture This talk will highlight benefits of some of novel techniques offered by Fujitsu Ultra Optical System for deepest network insights, with specific examples. -Fault auto tracking – to improve reach by reducing OSNR design margin -Real time fault localisation – for faster recovery, and to characterise fault baseline profiles -Telemetry of deep DSP data for AI/ ML based use cases like predictive maintenance -E2E reachability testing – to pretest link characteristics for optimal selection of transponder parameters, even before service is created -Fibre type verification – to validate operator’s assessment of fibre type to ensure optimal optical performance. The Need for Modular SDN Controller Architecture Telia Company: Stefan Melin, Lead Optical Network Architect Here we present our view on use cases and requirements for deployment of an optical SDN architecture. The driver for operators to deploy SDN architectures is to improve management of their networks. It is about to enable faster deployment, faster trouble shooting and to know the networks better. There are very interesting opportunities with intelligent functions which will develop a lot. An SDN architecture will be deployed over long time and must support a modular concept where
Future PIC Trends, Roadmaps Complexity with InP
Smart Photonics: Luc Augustin The field of integrated photonics holds great promise for overcoming societal challenges in data and telecom, autonomous driving and healthcare in terms of cost, performance, and scalability. Similar to the semiconductor industry, the ever-increasing demands of various applications are driving the necessity for platform integration in photonics as well, enabling seamless integration of diverse functionalities into compact and efficient photonic devices. This high level of integration reduces footprint and drives down system level costs. Advances in InP Laser Arrays for Data Centre and Sensing Applications Sivers Photonics: Andrew McKee, Chief Technology Officer There is increasing demand for high precision laser sources for a range of applications. These include multi- wavelength DFB laser arrays supporting
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| ISSUE 34 | Q3 2023
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