Spring 2018 Optical Connections Magazine


New microlens arrays with more lenses per wafer

Emtelle updates fibre microduct system

Ingeneric will premiere a new range of microlens arrays, oering shorter focal lengths and a higher number of lenses per wafer, at both Laser World of Photonics China and OFC this year. The company says the new products address requests received from numerous customers to implement focal lengths down to 0.3mm. Dr. Stefan Hambücker, the company’s Managing Director, sees clear advantages for customers, saying “We are seeing a pronounced trend towards shorter focal lengths. The consequence is that we have to produce optics with significantly smaller radii than before. We have made substantial progress here in recent months. These two fairs are the opportunity to present our latest developments: More lenses per wafer with shorter focal lengths on larger arrays.”

Ingeneric work with precision moulding techniques, which ensure that high refractive index glass takes on precisely the form of the moulding tool. The moulds manufactured to sub-micron precision enable the arrays to be produced with exceptionally high accuracy and reproducibility. When it comes to designing micro-optics for special applications, the process oers significant degrees of freedom and, compared to the etching process, optics can be far more complex with a larger radius-to-aperture aspect ratio. Furthermore, the process excels with a relative radius tolerance better than 0.2%, which is fully reproducible in serial production. For optics with a short focal length, Ingeneric has increased the usable surface area to 10 x 10 mm and thus significantly expanded the existing product range.

Based on their current QWKconnect pre-connectorised fibre microduct system, Emtelle’s new QWKconnect MDU uses QWKlink fibre from the company’s FibreFLow brand, but comes pre-installed in a Low Fire Hazard (LFH) microduct with connectors on both ends to eliminate the need to splice or blow the fibre. The microduct creates a future-proof pathway to each apartment and is suitable for use in multiple dwelling units (MDUs) as it can be installed from the basement, up the riser and then connected to a simple termination box within each premises. “There is no other product on the market which provides such savings for an internal or ducted FTTH drop solution when quality needs to be high and installation needs to be cost-eective, simple and reliable. You simply ‘Fit and Forget’” said Mark Graham, Technical Engineer. Cisco has announce a new highly- scalable circuit emulation solution supporting speeds up to OC-192, which is to be used by Verizon to carry customer trac on part of its transport network, Intelligent Network Edge. Circuit emulation enables transport of conventional digital and optical signal rates over a packet-based MPLS network without impacting customer trac. This creates smoother migration of legacy services to next- generation infrastructure and improves overall reliability. Verison hopes the move will improve customer experience and increase eciency. The companies have worked closely on the project, testing and implementing the equipment, with plans to increase the number of circuits using this technology over the next ten years. Verizon initially deployed the technology where it could aggregate multiple Ethernet and TDM circuits at the same location onto a unified high-speed circuit on part of its next-generation 100G U.S. metro network rollout. Cisco supports speeds to OC-192

Anritsu releases three new software packages

Anritsu has said that three recently released software packages will expand measurement standards for fast and fully automatic testing in accordance with the IEEE 802.11ax test specifications and oer “the World’s fastest fully automated testing of RF TRx characteristics for up to 16 devices simultaneously.” The new packages, WLAN 802.11ax Tx Measurement MX887033A and WLAN 802.11ax Waveform Files MV887033A, will evaluate IEEE 802.11ax devices and come with a fully automatic measurement program oering a turnkey system for production-line testing of standard-compliant devices.

IEEE 802.11ax is a next-generation WLAN standard which was developed to improve average data throughput in locations with high client device densities, like oces, sports stadiums and rail stations. It is currently under review by the IEEE 802.11ax Task Group and is likely to be released as an international standard next year. The Universal Test Set MT8870A is targeted at production-line measurements of various wireless equipment and modules. Four high-performance test units are installed in the main frame and each unit supports fully independent parallel simultaneous measurements of up to four wireless devices. The measurement standards are supported by the Universal Wireless Test Set MT8870A.


| ISSUE 12 | Q1 2018


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