TAPPI Scholarships (CONT’D FROM PAGE 41)
science and engineering, University of Wisconsin-Ste- vens Point, Paper and Board Division Scholarship • Abigail “Abbi” Brooke Mendius, graphic design and production, Dunwoody College of Technology, Corru- gated Packaging Division Scholarship • Emma Perrin, paper and chemical engineering, West- ern Michigan University, Process and Product Quality Scholarship • Ashley Randall, paper and chemical engineering, West- ern Michigan University, Paper and Board Division Scholarship • Kate Ross, chemical engineering, Miami University, Pro- cess Control Division Scholarship • Yuvraj (Yuvi) Shah, packaging science, Michigan State University, Corrugated Packaging Division’s Joe Dief- fenbacher Engineering Memorial Scholarship • Nayab Tuifail, paper engineering, Western Michigan University, Corrugated Packaging Division’s John O. Telesca Engineering Scholarship • Caroline Youngblood, paper science and engineering, chemical engineering, North Carolina State University, Process and Product Quality Scholarship TAPPI is currently accepting scholarship applications for the 2025-2026 academic year. Applications are due February 15, 2025. For application details and to view the gallery of 2024-2025 scholarship recipients visit tappi. org/scholarships . For more information, contact Mary Beth Cornell at mcornell@tappi.org.
Scholarship and the Coating, Printing and Surface En- hancement Division’s Robert W. Hagemeyer Scholar- ship • Alana Hattenstein, Chemical Engineering, Auburn Uni- versity, Paper and Board Division Scholarship • Meegan Heerlyn, paper and chemical engineering, Western Michigan University, Coating, Printing and Surface Enhancement Division’s Robert W. Hagemeyer Scholarship and the Corrugated Packaging Division’s Bobst Scholarship • Dan Hursh, chemical engineering, Miami University, Process Control Division Scholarship • Nathan Johnson, paper science and chemical engi- neering, North Carolina State University, Process Con- trol Division Scholarship • Troy Knudson, paper science and chemical engineer- ing, University of Wisconsin-Stevens Point, Nonwovens Division’s Ron Franklin Fiberglass Mat Memorial Schol- arship • Jack Kosloski, packaging science, Michigan State University, International Flexible Packaging Division’s Scholarship • Jacob Levesque, chemical engineering, University of Maine, Corrugated Division’s Mitsubishi Heavy Indus- tries Scholarship • Dominique Mauhar, chemical engineering and paper
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October 14, 2024
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