ECOC 2024 MARKET FOCUS
Will You Need CPO In 3 Years? Rajiv Pancholy, Broadcom Inc. AI/ML cluster sizes are growing exponentially, making optics essential to interconnect tens of thousands of GPUs. Bandwidth, power, latency, and cost demands expected in five years are now required much sooner. Additionally, folded CLOS, Dragonfly, and Torus interconnect architectures, supporting higher radix requirements, present challenges in density, fiber routing, and thermal management, all aimed at achieving the lowest cost per compute. At ECOC 2024, we plan to present the status of Broadcom’s Co- Packaged Optics technology platform, addressing the challenges for current and next-generation developments supporting both scale-up and scale-out interconnects.
flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. 3D nano- printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices. 100G PAM4 Analog CDR for SFP112 modules – enabling 6G front haul architecture Raza Khan, Semtech In wireless front haul where latency variation is extremely critical, a traditional DSP will not enable the 6G architectures. An alternative approach is looking back at how analog architectures used to dominate in NRZ modulations. We believe the road for analog is only starting, and are scalable to 100G PAM4 and beyond. A 100G analog CDR would enable lower power, near-zero latency variation and low cost – a true innovation that is required for 6G’s demanding architectures. Semtech has decades of analog experiences and is at the forefront of developing such differentiated solutions to enable the MOPA community as well as our system vendor partners with a path forward for their 6G architectures and beyond. Advancing optical technologies toward 224Gbps/lane for AI Haifeng Shao, Huawei technologies co. Ltd, China The explosive growth of AI large language models is driving the evolution of optical components from 112Gbps/lane to 224Gbps/ lane. This transformation affects all optical technologies including retimed modules, linear modules, pluggable or CPO formfactors, all must meet the AI engine massive bandwidth requirements. This presentation will review the latest HiSilicon advancements in 224Gbps/ lane optical chips technologies, including VCSEL&PD, EML&PD and high-power DFB laser source for silicon photonics engines. We will also present details on how to construct the streamlined package that enhances the overall system performance reducing the crosstalk and BER floor. Liquid cooled pluggable optical transceivers Mike Bishop, Ciena As the functional density of equipment continues to increase and equipment power starts to exceed 40 KW per rack, air-cooling is starting to reach some fundamental limitations in performance, power consumption, and acoustic noise. Liquid-cooling on the other hand, is well suited to manage power up to 100KW
per rack and is a highly efficient heat transfer technology which can produce significant energy savings in comparison to air-cooling. This presentation discusses hybrid Liquid-Air cooling technologies and how they could be integrated into routing and optical platforms. A novel design for a liquid-cooled pluggable transceiver is also presented. Multi-gigabit Optical Transceiver Design for Automotive Alberto Rodríguez Pérez, KD In the realm of Advanced Driver Assistance Systems (ADAS) and Autonomous Vehicles (AV), seamless sensor-to-AI connectivity is paramount. IEEE Std 802.3cz revolutionizes this with speeds up to 50 Gb/s on multi- mode fiber, tailored for automotive use. Central to this is the optical transceiver, but traditional designs fall short in automotive applications. This presentation highlights the need for fresh approaches, covering multi-protocol capabilities, technology nodes, analog- digital design, and photonics integration. By addressing these challenges, we advance automotive connectivity for a safer, more efficient future. Evolution of Optical Interconnection in the Era of Intelligent Computing Networks Junjie Li, IPEC & China Telecom AI-driven massive model training puts forward higher requirements on the ultra-large scale, ultra-low latency, ultra- large bandwidth, and ultra-high reliability of the new generation of intelligent computing data center networks, and the optical interconnection technology of data center clusters is also developing simultaneously. This presentation mainly introduces some new cutting- edge transceivers such as 800G/ B800G CPO, LPO, LRO and networking technologies towards IDC and DCI applications, followed by thinking of any potential technology of optics for future infrastructure construction of China Telecom data centers.
Path to carbon zero Andrea Di Giglio, Telecom Italia
ICT footprint is huge and, without any dramatic intervention the situation will explode. However, ICT seems to be aware of this issue, and the biggest ICT companies are aiming to find a common path (the agreement is 50% saving by 2030, net zero goal by 2050). This path has been also recommended by ITU-T for Telco and ICT enterprise. This path should be in line with the P2 scenario of IPCC which foreseen a global reduction of GHG of about 90% by 2050, which aims to stay below the 1.5 degrees increase mentioned before. To contribute to this general scenario, the project IPCEI CIS (Cloud Infrastructure & Services), funded by the European Union – NextGenerationEU, has among its main goals, the implementation of solutions and technologies aimed to guarantee the Cloud Edge Continuum for new application services, optimizing the energy and resource efficiency. The main topic of the speech is to understand problems and provide solutions how to measure, predict and minimize the CO2 emissions for a cloud environment.
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| ISSUE 38 | Q3 2024
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