INDUSTRY NEWS
Cloud operators drive adoption of converged architecture
Cloud Operator Datacentre Interconnect (DCI) is propelling high volume adoption of coherent pluggable optics, according to the latest Active Insight report, IP-over-DWDM Pluggables Forecast, from research firm Cignal AI. The analyst says IP-over-DWDM, which is the practice of using coherent optics directly within routers and switches, has transformed how Cloud Operators connect their data centres over short distances. The standardization, development, and maturation of 400G pluggable coherent optics (400ZR) has fortuitously coincided with the ongoing AI spending boom, with
volumes increasing faster than any previous DWDM technology. The report also finds that Cloud Operators, predominantly the big four hyperscalers, will continue to be the driving force behind the technology and volume of pluggable coherent transceivers, and that 400G purchases by Cloud Operators will peak in 2026 once the adoption of 800G and 1600G begins. In addition, it finds that the performance gap between embedded and pluggable optics will further shrink with 1600G, making IP-over- DWDM even more attractive from a network design perspective. However, the
rate of adoption for IP- over-DWDM will be slow and steady. Despite the operational hurdles, the technology’s space, power, and cost benefits will justify the change in architecture for many operators. “The market for router- hosted pluggables is already sizeable, but it will continue to further grow as operational issues are solved and new generations of optics evolve,” said Kyle Hollasch, lead analyst at Cignal AI. “The uptake of IP-over-DWDM will vary significantly between Cloud Operators and traditional Service Providers, as will the preferences for the speed and module type.” IP-over DWDM Pluggables
Forecast is part of Cignal AI’s Active Insight research service and leverages data from the Optical Components and Transport Hardware reports. This Active Insight report provides forecasts for IP-over-DWDM module deployment by operator type (Cloud, Traditional Service Provider, Enterprise and Government) and coherent module speed (400G, 800G, 1600G). Active Insight reports provide real-time reporting on important developments in the optical market, including detailed analysis of key product trends, show reports, summaries of quarterly earnings calls, and vendor reports.
UCIe Consortium Releases 2.0 Specification
Nokia first to self-certify fibre products for use in BEAD
The Universal Chiplet Interconnect Express™ (UCIe™) consortium has announced the release of its 2.0 Specification. The UCIe 2.0 Specification adds support for a standardised system architecture for manageability and holistically addresses the design challenges for testability, manageability, and debug (DFx) for the SIP lifecycle across multiple chiplets – from sort to management in the field. The introduction of optional manageability features and a UCIe DFx Architecture (UDA), which includes a management fabric within each chiplet for testing, telemetry, and debug functions, allows vendor agnostic chiplet interoperability across a flexible and a unified approach to SIP management and DFx operations. The UCIe 2.0 Specification includes holistic support for manageability, debug, and testing for any System-in- Package (SiP) construction
Nokia says it has become the first technology vendor to self-certify its fibre products manufactured in the U.S., ensuring each meets the requirements outlined in the recently announced BABA compliance and self-certification guidelines for the BEAD program. BEAD Applicants can now obtain a Certification Letter from Nokia to prove BABA compliance. The products include Nokia’s FX and MF OLT modular product lines, the SF-8M sealed OLT, and the XS-220X-A ONT. Operators and infrastructure players seeking
with multiple chiplets; improved system-level
Manufacturers that complete the self-certification process are added to a list managed by the Department of Commerce. Focused on reducing the number of fraudulent claims of BABA compliance, the list requires manufacturers to have an
solutions with manageability defined as part of the chiplet stack; and fully backward compatibility with UCIe 1.1 and UCIe 1.0. Additionally, the 2.0 Specification supports 3D packaging – offering higher bandwidth density and improved power efficiency compared to 2D and 2.5D architectures. UCIe-3D is optimised for hybrid bonding with a bump pitch functional for bump pitches as big as 10-25 microns to as small as 1 micron or less to provide flexibility and scalability. Another feature is optimised package designs for interoperability and compliance testing. The goal of compliance testing is to validate the main-band supported features of a Device Under Test (DUT) against a known- good reference UCIe implementation. UCIe 2.0 establishes an initial framework for physical, adapter, and protocol compliance testing.
officer of the company certify – under fine or imprisonment – that its
products are Buy America- compliant. Manufacturers must also be able to provide a BABA certification letter to subgrantees for audit purposes Sandy Motley, President of Fixed Networks at Nokia, said, “We are excited to announce yet another milestone in our BEAD journey. As a certified vendor, we can now provide BEAD applicants with a certification letter that’s become essential for applications and BABA reporting requirements. It also provides the confidence and assurance several need to submit product orders today without fear of being out of compliance.
to participate in BEAD and the US$42.45bn of
available funding will need to ensure – under federal penalty – that certain fibre broadband equipment used in their network buildouts are manufactured in the U.S. To help, the NTIA created a self-certification and compliance framework for manufacturers, allowing each to show its products meet these requirements.
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| ISSUE 38 | Q3 2024
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