PMMI Scholarships (CONT’D FROM PAGE 10)
• Jeffrey Santos, Hennepin Technical College, Automa- tion and Robotics Engineering Technology • Sierra Seton, Toronto Metropolitan University, Graphic Communications Management The Electrical Engineering Scholarship awarded $5,000. This scholarship, awarded to one student attend- ing a North American four-year college or university with a focus on electrical engineering, goes to Gavin Boomsma from Michigan State University. The Packaging & Processing Women's Leadership Net- work (PPWLN) Scholarship awarded $5,000. The PPWLN scholarship aims to support women's careers in the pack- aging and processing industry. This year's recipient is Mol- ly Coonfield from Montana State University, who is study- ing Mechanical Engineering. The Mechanical Engineer Scholarship awarded $5,000 to Nathan Gessler from Colorado Mesa University, who is pursuing Mechanical Engineering. The Processing Scholarship awarded $5,000 to Supri- ya Korade, a student at the Illinois Institute of Technology, who is studying Food Process Engineering. The $5,000 Chuck Yuska Scholarship, named in honor of PMMI's former President & CEO of 28 years, is awarded to a student representing innovation in the packaging in- dustry. This year's recipient awarded was Lexi McFarlane from California Polytechnic State University, San Luis Obis-
• Austin Holderness, Hennepin Technical College, Mechatronics A.A.S • Steven Jones, Metropolitan State University, Computer Science • Karan Karadennavar, Rochester Institute of Technology, Print and Graphic Media • Alexander Kong, Hennepin Technical College, Automa- tion Robotics Engineering Technology • Benjamin Pedersen, Hennepin Technical College, Au- tomation Robotics and Engineering Technology • Thomas Wells, Dunwoody College of Technology, Au- tomation and Controls Engineering Technology The PACK EXPO Scholarship awarded $30,000. This scholarship is the beneficiary of PMMI’s PACK gives BACK events at PACK EXPO International and PACK EXPO Las Vegas. Each year, six $5,000 scholarships are awarded to students attending a North American college or university. Recipients include: • Haleigh Gartner, Clemson University, Packaging Sci- ence • Julianne Hom, California Polytechnic State University, Packaging Value Chain • Marissa Rupert, Pennsylvania College of Technology, Automation and Engineering: Mechatronics • Caden Sand, Alexandria Technical and Community Col- lege, Mechatronics
po, who is studying Packaging Value Chain. Visis www.pmmi.org for more information.
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12 July 10, 2023
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