PMMI Scholarships (Cont’d from Page 11)
Industry Events
to students attending two-year North American col- leges. Each recipient received a $4,000 scholarship. Recipients of PMMI Memorial Scholarships are: Ricardo Carranza , Gateway Technical College, CNC Programming Jeffrey Gandy , Hennepin Technical College, Ro- botics Engineering Austin Holderness , Hennepin Technical College, Mechatronics A.A.S Steven Jones , Metropolitan State University, Com- puter Science Karan Karadennavar , Rochester Institute of Technology, Print and Graphic Media Alexander Kong , Hennepin Technical College, Automation Robotics Engineering Technology Benjamin Pedersen , Hennepin Technical College, Automation Robotics and Engineering Technology Thomas Wells , Dunwoody College of Technology, Automation and Controls Engineering Technology PACK EXPO Scholarship : $30,000 awarded. This scholarship is the beneficiary of PMMI’s PACK gives BACK events at PACK EXPO International and PACK EXPO Las Vegas. Each year, six $5,000 schol- arships are awarded to students attending a North American college or university. The recipients of the PACK EXPO Scholarships this year are: Haleigh Gartner , Clemson University, Packaging Science Julianne Hom , California Polytechnic State Uni- versity, Packaging Value Chain Marissa Rupert , Pennsylvania College of Tech- nology, Automation and Engineering: Mechatronics Caden Sand , Alexandria Technical and Communi- ty College, Mechatronics Jeffrey Santos , Hennepin Technical College, Au- tomation and Robotics Engineering Technology Sierra Seton , Toronto Metropolitan University, Graphic Communications Management Electrical Engineering Scholarship: $5,000 award- ed. This scholarship, awarded to one student at- tending a North American four-year college or uni- versity with a focus on electrical engineering, goes to Gavin Boomsma from Michigan State University. Packaging & Processing Women’s Leadership Net- work (PPWLN) Scholarship : $5,000 awarded. The PPWLN scholarship aims to support women’s ca- reers in the packaging and processing industry. This year’s recipient is Molly Coonfield from Montana State University, studying Mechanical Engineering. Mechanical Engineer Scholarship : $5,000 award- ed. Nathan Gessler from Colorado Mesa University, pursuing Mechanical Engineering.
Labelexpo Europe September 11-14, 2023 Brussels Convention Center Brussels, Belgium
FTA Fall Conference October 9-11, 2023 Louisville, Kentucky
TLMI Annual Meeeting October 15-17, 2023 The Broadmoor Colorado Springs, CO
Labelexpo Asia December 5-8, 2023 SNIEC Shanghai, China
Gulf Print & Pack January 9-11, 2024 World Trade Center Dubai, United Emirites
Labelexpo Americas September 10-12, 2024 Donald E. Stephens Convention Center Rosemont, Illinois
FTA Annual Meeting May 4-7, 2025 David L. Lawrence Convention Center Pittsburgh, Pennsylvania
(Cont’d on Page 14)
Flexo Market News September 11, 2023 13
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