FTA Fall Conference (Cont’d from Page 1)
ers to explore the latest trends, innovations, and sustainable advancements shaping the future of packaging design. The Dieline Forum will provide an opportunity for participants to take part in live discussions, gain
Before attendees dive into the project, they’ll hear from expanded gamut pioneers Mark Samworth, who will review its history and principles, as well as Kariahlyn Lindsey and Johnny Dye of Accredo Packaging, a printer that implemented expanded gamut years ago. Rounding out the conference agenda are presen- tations on boosting productivity, fostering leader- ship at all organization levels, high-level calibration techniques, color communication resources and tools, methods to control print production, and each of the three 2023 FTA Technical Innovation Award recipients. Labelexpo Europe 2023 Announces Dieline Forum The organizers of Labelexpo Global Series have announced a new exclusive forum, ‘The Dieline Fo- rum’ taking place on September 11-12 as part of Labelexpo Europe 2023 at Brussels Expo, Brussels, Belgium. Organized by Dieline, a global package design community, the two-day conference will reportedly bring together industry experts, and thought lead-
invaluable knowledge and develop meaningful connections with leading design professionals. The discussions will explore topics such as the branding strategies and practices that are targeted toward Gen Z and Millennials to how brands are tapping into the power of sustainability. Keynote speakers include Jemma Wong of PlasticFree.com, Andreu Gadea of Lavernia & Cienfuegos, Jonas Andersson of Brand Union Stockholm, Jo Tulej of Mother Design, Matt Lurcock from Turner Duck- worth, and Brandi Parker of Here Design.
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4 September 11, 2023 Flexo Market News
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