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PEER-REVIEWED ARTICLE
Fiberboard Created Using the Natural Adhesive Properties of Distillers Dried Grains with Solubles Brent Tisserat, a, * HongSik Hwang, a Steven F. Vaughn, a Mark A. Berhow, a Steven C. Peterson, b Nirmal Joshee, c Brajesh N. Vaidya, c and Rogers Harry- O’Kuru d
Distillers dried grains with solubles (DDGS) were employed as a bio- based resin/adhesive. DDGS were defatted with hexane, ball ground, and screened prior to use. DDGS flour was mixed dry with Paulownia wood (PW) to make composites using the following conditions: temperature of 150 to 195 °C, PW particle sizes of d 75 to 1700 P m, pressure of 2.1 to 5.6 MPa, and using DDGS dosages of 10 to 100%. Molded composites were evaluated for their flexural properties. Composites were examined with Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analysis, and X-ray diffraction. The best flexural properties were obtained from composites containing 50% DDGS and 50% PW, using 180 to 250 P m PW particles, pressed at 5.6 MPa, and employing 185 °C. Flexural properties of DDGS-PW composites were similar to composites fabricated using soybean flour (Prolia) as the resin/adhesive. Dimensional stability properties (water absorbance and thickness swelling) of DDGS-PW and Prolia-PW composites were similar. DDGS- PW composite properties satisfied several European Committee Industry Standards for fiberboards in terms of flexural properties but were inferior in terms of thickness swelling properties.
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t is estimated that by 2030, global consumption of industrial and solid wood will increase by 60% over currently consumed levels, and in addition, there will be a substantial demand for more paper and paperboard products (Elias and Boucher 2014). To satisfy wood needs, engineered wood products are employed such as fiberboard (FB), which includes particleboard (PB), medium density fiberboard (MDF), hardboard (HB), and oriented strand board (OSB) (Hemmilä HWDO . 2017). These products are composed of various sized cellulosic particles bonded together with synthetic resins or adhesives using heat and pressure. Engineered wood products are expected to grow 25 to 33% by 2020 (Elling 2015). Structural panels made in North America will increase 21% by 2020 ( LH , from 31.5 billion square feet to 38 billion), largely in response to increased housing.
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Tisserat et al . (2018). “DDGS - PW fiberboards” B io R esources 13(2), 2678-2701.
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