Spring 2019 Optical Connections Magazine

PRODUCT NEWS

Unleash a New Era in OSP Fibre Management

Axetris has been providing microlenses to the communication industry for more than 15 years and microlenses are omnipresent in telecom and datacom solutions such as wavelength selective switches, optical transceivers for data centers and long-haul coherent communications components. It all started with Passive Optical Network (PON) components for the megabit telecommunication era. Today, Axetris contributes cost- attractive microlenses to the advance of Gigabit internet age, where hyperscale data centers and service providers require more efficient, economical and faster solutions. Axetris microlenses are made of high quality optical materials like silicon and fused silica, which have optimal properties for optical communication solutions. We produce microlenses with customized lens designs and also auxiliary features, such as fiducials and metal- or solder pads. Microlens chips are provided in the form of single- lenses or 1- and 2-dimenional lens arrays, which cover single- and multi-channel coupling schemes. Advantages We supply sub-millimeter chip size, down to a few hundred microns with thicknesses down to of 100 µm, which enables compact packaging and miniaturized optical setups. Microlenses are manufactured by well-established micro-machining processes, the same techniques used in silicon photonics fabrication: photo- lithography, thermal reflow, and plasma etching. These micro- machining techniques guarantee sub-nanometer surface roughness, high-precision pitch accuracy for microlens arrays, and good control of the lens shape for customized lens designs. The No data traffic without Axetris microlenses Customized silicon and fused silica microlenses and microlens arrays

Go!Foton’s OSP High-Density Fiber

deploying OSP fibre in areas that are historically reluctant to approve right-of-way access for traditionally larger enclosures. Available as both a hermetically sealed dome enclosure or an equally compact pole, wall or strand mount enclosure, the PEACOC FDH brings GoFoton’s patented PEACOC technology to the OSP to support the increasing need for high density fibre distribution in support of 5G, CRAN, and other next generation PON topologies. With the new PEACOC™ FDH, the engineers at Go!Foton have unleashed a new era of OSP fibre management by implementing a solution which offers FDH installers phenomenal front side access to all cabling, splices, and optical components while maintaining their commitment to provide a craft friendly approach that is fast, easy, and reliable. By providing this functional modularity, and flexible cable management, the Go!Foton FDH can be customized to meet the needs of new and emerging optical distribution network requirements. The PEACOC wing-based FDH is available in both a traditional cabinet solution targeted at pole, wall, and pad mount applications, as well as a hermetically sealed dome enclosure suitable for underground deployment.

Distribution Hub (FDH) is a revolutionary new concept in OSP fibre connectivity management which is built upon the highly agile, award-winning PEACOC™ technology platform. The PEACOC FDH incorporates high performance PLC splitters, patching, splicing, and connector parking in a highly compact and modular design. The distinctive “wing-based” fibre routing panel provides a highly craft friendly approach to managing the dense field of splitter pigtails and fibre jumpers. The highly innovative Go!Foton PEACOC FDH is unlike any other fibre distribution hub on the market today. It is a fully integrated platform that forms the foundation on which small form factor jumpers and a multitude of PON components can be easily incorporated and managed in a highly compact OSP enclosure. It’s the only FDH platform capable of supporting simplex LC connectors with full front-side access for easy fibre management that is fast, highly organized, and accurate. With up to 432 subscribers in a highly compact, attractive enclosure, service providers will finally have greater flexibility when

wafer-level processes allow scalability to high volume production and eventually cost- attractive solutions.

Triple your density with SN™ connector

SENKO’s SN™ connector, utilising standard LC Ferrule technology, the duplex connector allows you to triple the density compared to the conventional LC Connectors. The SN™ is also designed to fit four of the duplex connectors in

one QSFP footprint transceiver for direct breakout, increasing your density, while still exceeding GR-326 requirements.

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| ISSUE 16 | Q1 2019

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