Spring 2019 Optical Connections Magazine

PRODUCT NEWS

iXblue offers golden optical reference transmitters up to 56 Gbauds and 70 GHz

iXblue Photonics has engineered test solutions for the Telecommunication industry and provides Optical Reference Transmitters based on proprietary LiNbO3 high speed modulators. These ModBoxes address the Telecommarket and are designed to be Golden Transmitters that generate robust and reliable optical eye diagrams. They are compliant with IEEE norms for high-speed test solutions and are used in the development and qualification of next-generation telecommunications, Datacom, Long-Haul and other optical interfaces. The Optical Reference Transmitter ModBox addresses the Telecommunication and Datacom networks equipment markets. The ModBox is a flexible and efficient Electrical to

NRZ up to 56 Gb/s. The transmitter produces very clean eye diagrams with high SNR and fast rise and fall times. They reach incomparable optical modulated output power with 5 dBm at 850 nm, 1310 nm or 1550 nm. The PAM-4 ModBox also allows external interference injection for optical stress eye generation. The ModBox-VNA are optical transmitters designed to extend the Vectorial Network Analyzers applications into the optical domain. When associated with a Vectorial Network Analyzer, they make up a high- performance and easy to use test equipment for the characterisation of photoreceivers or any high- speed optoelectronic device. iXblue will be exhibiting during the next OFC, a chance and opportunity to talk about your project and ModBox needs. To book your appointment please contact contact. photonics@ixblue.com.

Optical converter. It is designed to generate linear or digital standard telecom modulation schemes such as NRZ with and without adding impairments, NRZ up to 56 Gb/s, DPSK up to 28 Gb/s, QPSK and PAM-4 up to 56 Gbaud and VNA up to 70 GHz. The ModBox-PAM4 generates excellent quality optical data streams PAM-4 up to 56 Gbaud and

ViaLite has launched a new C-Band RF over fibre link. With a C-Band uplink/downlink frequency range of 3.4–7.1 GHz, the link is suitable for use in a wide range of satcom and broadcast applications, as well as some surveillance and weather radar systems. The link’s full frequency range is 500 MHz – 7.5 GHz. By removing the requirement for an up/down converter to convert signals to an IF band, the module reduces deployment costs and complexity. Another benefit is that there is virtually no signal attenuation across the site from the dish to the operations centre. The ViaLiteHD C-Band Link is available either as a rack chassis card or as a new purple OEM module, and comes with a five-year warranty as standard. “The C-Band Link has the highest frequency band of all our RF over fibre links and we anticipate it generating a lot of interest,” said ViaLite Marketing Manager: Natasha Miller. The new C-Band Link products will be showcased at CABSAT in Dubai this March, where the company has a stand on the Satellite exhibition floor (stand: B5-22). ViaLite will be sharing the stand with its distributor for the region, Symbolise, whose managing director Jeroen Husken will also be in attendance. ViaLite Launches C-Band RF over Fibre Link

Rockley announces silicon photonics platform for sensing AI

Rockley Photonics, a vendor of integrated optics for high-density digital systems, has announced the completion of its fully integrated silicon photonics platform running in a large-scale foundry environment. The company says it has successfully overcome significant technological challenges that have, until now, held back the broad adoption and implementation of integrated photonics in high-volume applications. Chipset shipments to Rockley

customers have begun and products implementing them will ramp up the production curve. The integrated photonic platform delivers low-cost, high-value wafer scale processing to photonics. It is key to many product opportunities in applications where Rockley has go-to- market partnerships including optical sensing, 3D laser imaging and AI computing connectivity. It solves a large number of key issues experienced by wafer scale silicon photonics to date.

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| ISSUE 16 | Q1 2019

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