Advantech Embedded IoT solutions 2018

Industrial Motherboards

UTX

Model Name

UTX-3115

UTX-3117

CPU

Intel E3826 / E3815 processor

Intel ® Apollo Lake E3900 series & N series Processor

Core Number

Dual core / Single Core

Quad Core / Dual Core

Processor System

BIOS

AMI EFI 64 Mbit, SPI

AMI EFI 16 Mbit, SPI

Chipset

-

Technology

DDR3L 1333/1600 MHz SDRAM

Dual channel DDR3L 1866 MHz SDRAM

Memory

Max. Capacity

4 GB/update to 4GB/per DIMM

8GB/ up to 8GB per DIMM

Socket

1 x 204-pin DDR3L SODIMM (Non-ECC)

2 x 204-pin DDR3L SODIMM (Non-ECC)

Controller

Intel HD Graphics

Intel HD Graphics GEN9

VGA

1

-

Display

HDMI

2

1

Display Port

-

1

2.5” HDD bay

1 (support 2.5” HDD/SSD, max 7.5 mm height)

1(support 2.5" HDD/SSD, max 7.5mm height)

Storage

mSATA

1, colay with F/S miniPCIE

1, colay with H/S miniPCIE

Interface

10/100/1000 Mbps

10/100/1000 GbE LANs.

LAN1: Intel I210AT LAN2: Realtek 8111G

LAN1: Intel I210AT LAN2:Realtek 8111G

Ethernet

Controller

Connector

2(RJ-45)

2(RJ45)

Chipset

Realtek ALC892, High Definition Audio(HD)

Realtek ALC892, High Definition Audio(HD)

Audio

Connector

Mic in / Line out

Mic-in, Line-out combo

Mini-PCIe

2 (1xF/S miniPCIE slto, 1x H/S miniPCIE slot)

2 (1xF/S miniPCIE slot, 1x H/S miniPCIE slot), 1 M.2(E-Key)

Internal expansion Slot

SIM socket

1

1

USB

2 (1 x USB 3.0, 1 x USB 2.0)

2 ( USB 3.0 )

Audio

Mic in / Line out

Mic-in, Line-out Combo

Front Panel

LAN

2

2

Power button

1

1

LED Indicators

1(HDD LED)

1(HDD LED)

HDMI

2 (1xHDMI, 1x Micro HDMI)

1

VGA

1

- (change to DP1.2 port)

USB

1(Micro USB)

-

Rear Panel

USB

1(USB3.0)

2 (USB3.0)

COM

2 (1xRS-232, 1xRS-422)

2 (1RS-232 & 1RS-422/485)

Power jack

1(DC12V)

1 (DC12~24V)

Control

1 (Power Button)

1(Power button)

Voltage

12V DC

± 10%

12~24V DC

± 10%

 Power

Power Consumption

12V@0.88A

12V@0.61A

Power Adapter

AC to DC DC12V/3A, 36W

AC to DC adapter 12/24V/3A

Operating Temperature

-20 ~ 60 °C (32 ~ 104 °F)

-20 ~ 60 °C (32 ~ 104 °F) with RF module by max system performance

Non-operating Temperature

 Environment

-40 ~ 85 °C and 95% @ 40 °C Non-Condensing

-40 ~ 85 °C and 95% @ 40 °C Non-Condensing

Vibration

3G (with 2.5” SSD)

3G (with 2.5” SSD)

Dimensions (W x H x D) Dimensions (W x H x D)

138.5 x 35.98 x 116.4 mm (5.5” x 1.4” x 4.6”)

152 x 37.1 x 128 mm (5.6" x 1.46" x 5.04")

 Weight

Weight

1.0kg

1.2KG

EMC

CE/FCC/CCC/KC/VCCI/BSMI

CE/FCC/BSMI/CCC

Certification

Safety

UL/CB/BSMI/CCC

UL,CB,BSMI,CCC

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