Tuesday 8th December - Session 3 12:00 – 12:20 IHP GmbH - Innovations for High Performance Microelectronics, Leibniz-Institut für innovative Mikroelektronik EPIC Foundry Services for Data Center Interconnect Applications Speaker: Prof. Lars Zimmermann SG25H5_EPIC is an advanced monolithic electronic photonic integrated circuit (EPIC) technology co-integrating silicon photonics with high-performance BiCMOS electronics. A major application of this technology is in datacenter interconnects. Important features of the latest generation technology will be presented, such as passive optical building blocks design libary, high-speed germanium detectors, and high-speed depletion type phase shifters. In addition, sample circuits will be presented demonstrating performance characteristics of photonic BiCMOS based optical sub-assemblies. The technology will be presented in the context of IHP's overall technology portfolio including SG13G2 (ft=300/fmax=500) and the upcoming enhancement of SiGe:C BiCMOS performance with world record bipolar performance. A paradigm shift in the optical communication market – from Transceivers to Highly Integrated Co-package Optics enabled by Silicon Photonics Speaker: Sven Otte, Chief Executive Officer and Co-Founder The era of exponential data growth driven by mobile broadband has just started which generates new technical and business requirements for optical component vendors. In the past 20 years the optical communication market did undergo an evolutionary development in which data rates in the optical domain increased from 10Gb/s to 100Gb/s. Nevertheless, the fundamental partitioning of the market, i.e having an ecosystem where vendors either supply components, transceivers, subsystems and or systems remained mostly intact. Recognizably the electrical data rate has been kept at 50Gb/s so far and research shows that increasing the electrical data rate to 100Gb/s creates challenges in terms of signal integrity and power. Those 12:20 – 12:40 SICOYA challenges may lead to a paradigm change in the sense that the current four level ecosystem may collapse to two or three level. In this talk we will provide an overview about the challenges and why monolithic integrated silicon photonic is indispensable to address them. 12:40 – 13:00 LioniX Inernational Narrow linewidth tunable lasers based on hybrid assembled Photonic IC technology Speaker: Douwe Geuzebroek Ph.D., VP Marketing & Sales Narrow linewidth and tunable lasers have a broad range of application both inside data and telecommunication as well as in sensing. We will discuss how hybrid assembled lasers based on a photonic integrated circuits in silicon-nitride technology allow for record low linewidths, while being tunable over the C-band or even beyond. The photonic integration technology allows to include application specific functionality as well, creating a fully integrated components, that is robust and compact. The use of silicon-nitride even allows for applications outside of the 1550nm range.
13:20 – 13:40 Synposys Industry's First Unified Electronic and Photonic Design Platform Speaker: Twan Korthorst, Director Photonic Solutions Summary: This talk will introduce Synopsys’ OptoCompiler solution for photonic integrated circuit (PIC) design, layout implementation and verification. OptoCompiler is the industry's first unified electronic and photonic design platform, combining mature and dedicated photonic technology with Synopsys' industry-proven electronic design tools and methods to enable engineers to produce and verify complex PIC designs quickly and accurately. By providing schematic-driven layout and advanced photonic layout synthesis in a single platform, OptoCompiler bridges the gap between photonic experts and IC designers to make photonic design accessible, fast, and flexible.
13:40 – 14:00 Luceda Photonics Go to market faster by building Photonic ICs the way you build software Speaker: Dr. Martin Fiers, Product Manager & Co-founder, In the last 10 years, new platforms and tooling in software development have changed the way building software happens. What can we learn from this when we build photonic integrated circuits? In this presentation we'll look at how a code-centric design flow for PIC looks like. We'll explain how we can borrow techniques from software development to manage design complexity and deal with uncertainty, and go to market faster.
14:00 – 14:20 ICON Photonics 3D Wafer-Level Microoptics For Ultrafast Optical Fiber Communications Speakers: Carlos Viana, CEO Jean-Luc Polleux The next generation ultrafast optoelectronics imply smaller active areas and thus complex assembly and active alignment techniques. High performance and low-cost fiber-to-device coupling is an outstanding challenge. A main question stands – Can we simplify our photonics packaging? Can we make the optical coupling easier and accessible to most? Can we keep shrinking down the active device sizes to go beyond MMF/SMF 56Gbps or 112Gbps+ transmission per channel? A novel technology emerged from ICON Photonics startup company in France with wafer-level 3D polymer microoptics technology that is addressing this challenge offering a passive and simple alignment method.
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