Summer 2017 Optical Connections Magazine

“Our mission is to build a nation of Gigabit Cities, using optical fibre connectivity”

NEWS & BUSINESS

Matthew Peach– see page 14

Vodafone select BKT Elektronik for UK exchange renewal project

The solution is designed from the ground up in direct response to Vodafone’s requirements for a new future-proof deployment with the added benefit of backward compatibility for installation into their legacy network. Andrew Wilson, UK and Ireland Business Development Manager at BKT explained, “As a manufacturer we were able to address a very long list of disparate future- proofing requirements that Vodafone knew from experience it was going to need; something other big names were unable to match. Working closely with Vodafone our engineering excellence and ability to quickly prototype and react have been clear winners throughout.” “The result is a suite of ODF frames built to house

1U and 2U 19” mini-ODFs plus a brand new splice field. All 19” components have built-in adaptability to legacy racks such as the TEP1E and Ciena 6500. “Vodafone is now very satisfied and, with our commitment to ongoing product development, set up for the foreseeable future. Our solution is also applicable in many other operator environments” Andrew added. A key aspect of the solution is that it has been built around a modular connectivity package developed by SENKO Advanced Components, BKT Elektronik’s chosen partner for high-end FO applications. This allows for rapid inter-rack installation of ruggedised FO hydra assemblies. Additionally, LC Uniboot patchcords routed on the front dramatically reduce packing density in the ODF.

BKT’s custom-made ODF and connectivity suite, selected by Vodafone for its UK exchange renewal programme.

QSFP-DD MSA Group announces form factor specification

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and thermal management requirements to enable multi-vendor interoperability. QSFP-DD pluggable modules can quadruple the bandwidth of networking equipment to keep pace with advances in ASIC technology. Systems designed for QSFP-DD modules will be backwards compatible with existing QSFP form factors and provide maximum flexibility for end users, network platform designers and integrators. The new QSFP-DD form factor expands the standard QSFP four-lane interface by adding a row of contacts providing for an eight-lane electrical interface, each operating up to 25 Gbps with Non-Return-to-Zero (NRZ) modulation or 50 Gbps with Pulse Amplitude Modulation (PAM4).

The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement group has released a specification for the new QSFP-DD form factor. In total, 52 companies came together in support of the QSFP-DD MSA to address the industry need for high-density, high-speed networking solutions. The QSFP-DD MSA group accepted the challenge to meet the market demand for a next generation high- density, high-speed pluggable module form factor and have released a specification with broad market support that overcomes the technical challenges of specifying a QSFP28 compatible double- density interface. The QSFP-DD specification defines mechanical, electrical

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| ISSUE 9 | Q2 2017

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