Process News Spring 2015 | OI Plasma Technology

PROCESS NEWS

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A Newsletter from Oxford Instruments Plasma Technology

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Welcome to this issue of PROCESS NEWS

IN THIS ISSUE

2/3/4 Role of Plasma Enhanced Chemical Vapour Deposition (PECVD) in Thin Film Silicon Photovoltaics 4 One of the largest semiconductor companies in Europe signs agreement for multiple Failure Analysis systems from Oxford Instruments

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Getting a grip on sapphire etching: Novel clamping of sapphire looks to unleash brighter, cheaper LEDs Micro-and nanopillar patterning of GaN layer using an Oxford Instruments plasma etching system World leading graphene research at The University of Manchester uses our tools

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9 Introducing the Nanofab 1200 10/11 Direct comparison of the performance of and Cr 12/13 2D plenary sessions attracted enormous interest at recent Beijing Nanotechnology Seminar 13 Facilitating a “New Era of Science” at CUNY, USA 14/15 Novel silicon nitride ICP etching process with high selectivity over silicon dioxide for gate spacers 16 Check out our Upgrades! 16 We’re flexible with our support commonly used e-beam resists during nano-scale plasma etching of Si, SiO 2

Enabling emerging applications We provide technologies that address existing and emerging applications in nanotechnology markets. With our broad process and application portfolio, our technologies enable many of the applications identified today and those of tomorrow. Look inside this issue to find out more... www.oxford-instruments.com/plasma

PROCESS NEWS 1

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