PRODUCT FOCUS
New 400G Photodiode Array by Albis Optoelectronics
At the upcoming ECOC exhibition in Brussels, Albis will present its new product PS20Y4. This product is an assembly of multiple 56 Gbaud photodiode chips that are flip-chip soldered onto a metallized ceramic submount with coplanar G-S-G contact layout and a channel pitch of 750 µm. All photodiodes are positioned with high accuracy with respect to the alignment features to guarantee a chip-to-chip alignment down to ±6 µm. The photodiode array consists of InGaAs/InP very high-speed photodiode chips with integrated backside lenses. The bottom
illuminated p-i-n photodiode structure is optimized for up to 56 Gbd PAM-4 (400GBASE-DR4 and 400G-FR4) single-mode telecom, microwave photonic links, RF over fiber as well as test and measurement applications. It offers an excellent responsivity and high speed of response in the wavelength region from 1260 to 1620 nm. The integrated backside lens focuses the incoming light beam on the top side detecting area, enabling easy and efficient optical coupling by increasing the effective active diameter up to 50 µm. Customized versions with other submount layouts, optimized for low capacitance
or low inductance, wrap-around metallization and other channel pitches are available on request. Albis Optoelectronics is a leading designer, developer and manufacturer of high-speed photodiodes. Since more than 15 years, the company has offered the broadest portfolio of Telcordia qualified InP and GaAs photodiodes for datacom and telecom applications in the industry.
dedicated clean-room facilities. Product highlights include: PIN photodiodes for 10G, 25G and 40G digital and analog receivers. High power photodiodes and packaged photodetectors. Low bias APDs for 2.5G and 10G OLT/ ONUs. 25G APDs for 28 Gbaud PAM-4 and 100GBASE-ER4 applications. Side-illuminated monitor diodes and monitor diode arrays. Photodiodes with integrated lenses and optical filters. And last but not least hermetically packaged, short and long wavelength microwave photodetectors up to 30 GHz.
All photodiode products are manufactured in-house in Albis’
No data traffic without Axetris microlenses
Customized silicon and fused silica microlenses and microlens arrays Axetris microlenses are made of high quality optical materials like silicon and fused silica, which have optimal properties for optical communication solutions and many other applications like UV and IR spectrum. Axetris produces microlenses with customized lens designs, and can also add auxiliary features, such as fiducials, glue
Axetris has been providing microlenses to the Communication industry for more than 15 years. Microlenses are omnipresent in telecomand datacom solutions such as wavelength selective switches (WSS), optical transceivers for data centers and long-haul coherent communications. It all startedwith PassiveOptical Network (PON) for themegabit telecommunication era. Today, Axetris contributes cost-attractivemicrolenses andmicrolens arrays (MLA) to the advance of Gigabit internet age, where hyperscale data centers and service providers require more efficient, economical and faster solutions.
stops, metal and soldering pads. Microlens chips are provided in the form of single-lens chip or 1D and 2D lens arrays. Likewise, Axetris lenses and lens arrays can support single- and multi-channel coupling schemes. Advantages Axetris can supply sub-millimeter chip dimensions, down to a few hundred microns in width and length with thicknesses
of also down to 100 µm. This dimension enables compact packaging and miniaturized optical setups. Microlenses are manufactured by well- established micro-machining processes at our MEMS foundry. It is in fact the same fabrication techniques used in the silicon photonics manufacturing: i.e., photolithography, thermal reflow, and plasma etching. These micro-machining techniques guarantee sub- nanometer surface roughness, high-precision pitch accuracy for microlens arrays, and good control of the lens aspherical profile given by customized lens designs. Since our wafer-level processes allow scalability to high volume production, we can eventually offer cost-attractive solutions to our clients
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| ISSUE 22 | Q4 2020
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