INNOVATING CONNECTIONS END-TO-END SOLUTIONS FOR ELECTRONICS An Element Solutions Inc Business
Market Focus
Driving Innovation – Research & Development (R&D) At MacDermid Alpha Electronics Solutions, innovation is at the core of everything we do. Our cutting- edge R&D efforts are shaping the future of electronic materials and manufacturing.
MacDermid Alpha Electronics Solutions delivers unmatched reliability and performance across the full spectrum of electronics manufacturing—from wafer fabrication to final assembly. Our advanced, integrated solutions connect and interconnect components, reinforce structures, protect sensitive electronics, manage heat with precision, and enhance haptics and touch functionality. Whether enabling next-generation semiconductor packaging, circuit board assembly, or smart surface films and in-mold electronics, we are a trusted partner delivering sustainable, high-quality solutions that ensure superior functionality and long-term durability across diverse electronic markets.
Products by Category
Wafer Level Packaging Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
Computing
Automotive Electronics
Circuitry Solutions Enabling next-generation technology with innovative specialty chemistries and materials for the most complex printed circuit board (PCB) and integrated circuit (IC) substrate designs.
Consumer Electronics
Industrial/Human-Machine Interface (HMI)
Semiconductor Assembly Advancing innovative electronics with reliable bonding materials for electronics, die attach, packaging and camera modules.
Medical Solutions
Military & Aerospace
Circuit Board Assembly Driving PCB technology with leading-edge electronic materials for high-reliability in complex circuit board assemblies.
Mobile Phone
Power Electronics
Haptics & Touch Shaping HMI advancements with hardcoated films and flexible, formable circuits for smart surfaces and displays.
Renewable Energy
Telecommunications
Powering Electronics with Integrated Solutions Our solutions seamlessly interconnect, connect, reinforce, protect, and manage thermal efficiency in electronic systems across all sectors.
The Elements of Our Culture
Our employees embody the 5 C’s of our culture in their interactions with customers, colleagues and other counterparties to drive sustainable financial performance and create a rewarding environment.
Challenge
Interconnecting
Connecting
We establish ambitious goals, take calculated risks, maintain high standards and seek to exceed expectations.
• Robust interconnects for high-density metallization and wafer-level packaging • Support complex designs with: • Redistribution layer (RDL) plating • Via filling • Damascene
• Reliable circuit pathways for high-density designs • Strong, conductive bonds via: • Board-level assembly • Circuit fabrication • Standard die attach • Top-side & package attach
Commit
We make commitments and hold ourselves accountable, individually and as a team, to deliver on them.
• Hybrid bonding • Copper pillars • Backside metallization
Collaborate
We value teamwork, with our customers and our colleagues, in pursuit of excellence and improvement.
Choose
Reinforcing
Protecting
We empower our employees to make choices and take calculated risks; we choose to hire, to recognize and reward people who demonstrate good judgement and choose to have good attitudes and strong work ethics.
• Precision bonding for next-generation electronics • Strong, reliable performance in harsh environments • Enhances yield and reduces total cost of ownership
• Protective solutions like coatings and potting compounds • Shield components from shock, vibration, corrosion, and heat • Extend longevity and reduce failure risk
Care
We care about our customers, our colleagues, our environment, and our place in the world at large.
Sustainability Protect the Environment: Pioneering Sustainable Innovation for a Greener Future We develop chemistry and materials that push technological boundaries while prioritizing eco- friendly solutions. Our innovations improve manufacturing and support several United Nations Sustainable Development Goals, fostering a more sustainable future.
Reliability
Quality
Ensure High Reliability: Advanced Solutions for Critical Electronics
Deliver Excellence: Empowering Teams to Develop Superior Solutions and Services
Thermal
Haptics & Touch • Haptic tech delivers tactile feedback for better user interaction • Flexible films and circuit materials enable durable, eye-catching HMIs • Supports innovative designs and high-yield production
• Advanced thermal solutions for efficient heat dissipation • Enhance performance and extend device lifespan • High-performance Thermal Interface Materials (TIMs) for circuit boards and semiconductorss
We create solutions that deliver top reliability in electronic systems. Our innovative materials and technologies deliver superior performance, durability, and stability, making us the trusted partner for critical applications. We focus on quality and precision to meet the highest reliability standards.
We are a world-class organization driven by a dedicated, skilled team. Through strong quality management, efficient
processes, and an empowered culture, we deliver exceptional solutions and services that consistently exceed customer expectations.
Compound Semiconductor Fabrication – Enhance the reliability and performance of your compound semiconductor fabrication with our industry-leading precious metal plating technologies, ensuring superior quality and precision for next-generation devices.
WAFER-LEVEL PACKAGING SOLUTIONS Empowering Next-Generation Semiconductor Designs
We specialize in advanced wafer-level packaging (WLP) technologies that enhance the performance, reliability, and scalability of modern electronic devices, enabling faster, smaller, and more powerful solutions across diverse applications.
Backside Metallization Optimize via step coverage, yield, and reliability for power/radio frequency (RF) with our solutions that integrate seamlessly with die attach material.
Display Driver Interface (DDI) Achieve superior bondability, reliability and thermal stability of display driver applications with our high-hardness gold solutions.
Fan-Out Wafer-Level Packaging (FOWLP) Solder Surfaces Design next-generation fan-out wafer- level packaging with our advanced gold and palladium solutions for thin metal films.
Advanced Interconnect Metallization – Transform the performance of your packages with our advanced interconnect solutions, designed to provide reliable, uniform, and robust results for even the most complex semiconductor applications.
Damascene Enable advanced-node
Hybrid Bonding Hybrid bonding optimizes pitch, power, and reliability in advanced interconnects, with the added benefit of lower bonding temperatures for greater flexibility and a reduced thermal budget.
Low Alpha Materials Enhance reliability in next-generation devices with our sustainably sourced low-alpha tin—optimized for cost-efficiency and aligned with your Environmental, Social, and Governance (ESG) goals.
manufacturing with ViaForm ® for void-free copper electroplating and reliable, high-performance interconnects.
Gold Etch Materials Ensure precise, uniform gold seed removal on titanium-tungsten (TiW) barriers with advanced, cost- effective gold etchants for semiconductor fabrication.
Micro-Electromechanical Systems (MEMS) Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
Redistribution Layer (RDL) Unlock best-in-class RDL performance with efficient Input/ Output (I/O) pitch redistribution, advanced plating precision, and finer line widths for stronger, more reliable high-density packages.
Through-Silicon Via (TSV) Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high- density packages.
Wafer Bumping Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.
Discover our industry-leading wafer fabrication and integrated circuit (IC) substrate solutions Innovative technology, unmatched expertise, and a complete portfolio to power your advanced packaging needs.
CIRCUITRY SOLUTIONS Advanced Chemistry for Tomorrow’s Electronics Enabling the most complex printed circuit board (PCB) and integrated circuits (IC) substrate designs with high- performance specialty chemistries.
Connector Plating – Ensure durability, high conductivity, and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.
Electronics Connector Plating Achieve bright, matte, low-stress finishes with high- efficiency electronic plating solutions that enhance durability and reliability.
Precious Metal Solutions Get corrosion-resistant, durable finishes with our high- speed, stable precious metal plating processes for demanding applications.
Circuit Formation – Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-generation applications.
Ammoniacal Etchants Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-generation designs.
Innerlayer Adhesion Promotion Ensure robust reliability for high- speed, low-loss applications with our wide range of engineered adhesion promoters.
Leadframe Adhesion Promotion Achieve moisture sensitivity level 1 (MSL-1) reliability with our adhesion promoters, from leadframe roughening to sidewall solderability.
Electrolytic Copper Metallization – Maximize uniformity in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.
High-Throw Direct Current (DC) Create mid-aspect-ratio boards with high-throw direct DC acid copper plating for enhanced performance, reliability, and versatility.
Periodic Pulse Reverse Ensure reliable plating for thick, multi-layer PCBs with periodic pulse reverse (PPR) solutions, delivering uniform coverage of high-aspect-ratio through-holes.
Via Fill Optimize PCB designs with high- performance copper via filling solutions, tackling any metallization challenge.
Molded Interconnect Device Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
Process Chemicals Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, through dry film adhesion to board finish.
Solder Mask & Dry Film Adhesion Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
IC Substrates – Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.
PCB Surface Finishes – Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
Copper Adhesion Promotion Drive innovation with copper adhesion promoters for consistent bonding and precise etching in IC substrates.
Copper Plating Technologies Enable advanced IC substrates with innovative micro via filling, redistribution layers (RDL), through-hole conformal & filling, and panel-level packaging.
Final Finishes Meet original equipment manufacturer (OEM) standards with high- performance finishes that enhance solderability and gold wire bonding.
Semi-Additive Process (SAP) Technologies Produce high-density IC substrates with our family
Electroless Nickel/Immersion Gold (ENIG) Exceed Institute for Interconnecting and Packaging Electronic Circuits (IPC) quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
Immersion Silver Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry’s most trusted ImAg finishes.
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion- free, high-uniformity deposits.
of semi-additive, high- performance buildup processes.
Primary Metallization – Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
Immersion Tin Gain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Organic Solderability Preservative (OSP) Explore OEMs’ preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
Conductive Polymers Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
Direct Metallization Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
Electroless Copper Optimize the performance of multilayer boards with high-reliability
electroless copper plating for demanding PCB applications.
Sustainability – Pioneering chemistries and advanced material formulations that break technological barriers with greener solutions that improve manufacturing processes.
Direct Metallization Streamline PCB production with a greener alternative to electroless copper: • Up to 57% reduced power consumption • Up to 80% lower water usage • Fewer chemical baths, no formaldehyde or cyanide
Cyanide-Free Affinity Final Finish Boost performance while eliminating hazardous materials: • Cyanide-free electroless nickel/immersion gold (ENIG)/ electroless nickel/electroless palladium/immersion gold (ENEPIG) plating for safer operations • Lower energy use through reduced operating temperatures • High uniformity, improved solderability, and corrosion-free reliability
Discover our high-performance PCB materials – innovative chemistries, unmatched expertise, and sustainable solutions to meet your reliability and performance goals in today’s evolving electronics industry.
Water-Efficient Chemistries Concentrates and process-ready solutions for a range of formulations: • Designed to enhance efficiency and sustainability in manufacturing • Concentrates improve transportation efficiency, leading to significant CO 2 e reductions • Process-ready solutions benefit customers in water- restricted and drought-prone areas, where lower water usage is essential
Sustainability Leadership MacDermid Alpha supports multiple UN Sustainable Development Goals through innovative, resource- efficient chemistries that reduce waste, lower emissions, and improve worker safety—empowering next- generation electronics manufacturing with a reduced environmental footprint.
SEMICONDUCTOR ASSEMBLY Advanced Materials for Reliable Performance and Thermal Management Optimize next-generation electronics with high-performance bondline materials for die attach, packaging, camera modules, and power electronics, delivering superior thermal management, durability, and reliability.
Power Electronics – Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
Package Attach – Sinter
Die Attach – Sinter High-reliability materials, enabling superior thermal and electrical conductivity for high- power applications.
Preforms Precisely shaped alloys for reliable joints in semiconductor and electronic assemblies, ensuring high- quality interconnects.
Top Attach – Sinter
Advanced Interconnect Assembly – Enhance thermal efficiency and precision with our solder Thermal Interface Material (TIM), solder, and flux solutions for advanced chip fabrication.
Our sintering materials ensure strong, reliable bonds to heat sinks or spreaders power electronics.
Robust mechanical and electrical connectivity in high-performance semiconductor packages.
Semiconductor Solder Flux Our Semiconductor fluxes for chip scale package (CSP), flip chip, and ball grid array (BGA) ball attach deliver high yields, stable performance, and easy deionized (DI) water cleanup.
Interconnect Solder Paste Advanced solder solutions for interconnecting semiconductor packages, from laminate to leadframe packaging.
Solder Thermal Interface Material Our Solder TIMs for semiconductors ensure efficient heat transfer, high purity, and low voiding.
Camera Modules – Camera module adhesives for secure assembly and peak performance.
Photomasks – Maximize yield and cut costs with reliable compugraphics photomasks and fast cycle times.
Standard Die Attach – Attain high-precision, reliable bonding with our Per- and polyfluoroalkyl substances (PFAS)-free die attach solutions for advanced semiconductor assembly.
Adhesives - Camera Modules Ensuring precise lens alignment, structural integrity, and long-term reliability in compact optical assemblies.
Compugraphics Photomasks High-quality photomask and reticle solutions, supporting advanced semiconductor manufacturing with precision patterning.
Conductive Die Attach Materials Our high-performance conductive die attach materials provide excellent thermal and electrical conductivity.
Hybrid Sintering Our advanced hybrid sintering delivers superior thermal conductivity and mechanical strength, ensuring reliable, durable bonds in high-performance electronics.
Microelectronics & Sensors – Our advanced materials enhance device performance and lifespan with getters and thermal inks engineered for strong bonding and chemical resistance in high-precision MEMS and sensor applications.
Getters Our getters provide effective gas absorption for hermetic packages, ensuring reliable performance and long-term protection in demanding applications.
Marking Inks Ensure long-lasting identification with durable, high- quality marking inks.
Discover our advanced Semiconductor Assembly Solutions Cutting-edge bondline materials designed to enhance reliability in power electronics, die attach, packaging, and camera modules.
Thermoplastic Adhesives Our thermoplastic adhesive solutions provide durable, reworkable bonds with excellent heat and pressure performance for high-reliability electronic assemblies like connectors, sensors, and flexible circuits.
Thermoset Adhesives Our thermoset adhesives deliver strong, durable bonds with superior thermal and chemical resistance, ideal for high-reliability semiconductor, automotive, and electronic applications in demanding environments.
CIRCUIT BOARD ASSEMBLY Global Leader for Optimal Printed Circuit Board (PCB) Assembly Performance Our next-generation material solutions drive performance in demanding applications, ensuring high reliability in advanced electronics while optimizing throughput and yields for maximum efficiency and value.
Polymer Reinforcement – Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.
Adhesives & Encapsulants Reinforce components with high-performance adhesives and encapsulants.
Edgebonds Boost reliability and efficiency with heat-curable epoxies, including reworkable solutions that maximize throughput and support sustainability.
Underfills Enhance semiconductor reliability with reinforced heat-curable underfill epoxies.
Surface-Mount Technology – Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.
Solder Alloys Advance performance with the industry’s broadest solder alloy range, supporting high reliability, lowest total cost of ownership and improved process flexibility.
Preforms Enable reliable electronics
Solder Pastes Meet demands for miniaturization, reliability, and yield with advanced solutions providing a wide processing window to lower total cost of ownership (TCO).
packaging with precision preforms delivering volume control, reliability, and performance.
Solder Recycling – Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.
Cored Solder Wire Ensure robust performance in critical assemblies with high- reliability cored solder wire designed for primary attach and rework.
Electronics Cleaners (SMT) Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.
Stencil Solutions Optimize assembly with solutions addressing today’s printing needs through rapid response, high accuracy, and exceptional performance.*
Maximize Value with Responsible Recycling Compliance and transparency without compromising profitability. Our certified in-house solder recycling processes all solder materials, offering cost efficiency, traceability, and responsible waste management to ensure confidence at every step.*
*Available in North America and the European Union
*Products and Services fulfilled through our European facilities
Circuit Board Protection – Safeguard electronics with advanced potting compounds and conformal coatings, ensuring longer life or reliability in any environment.
Thermal Management – Enhance device performance and longevity with high-performance thermal interface materials that efficiently dissipate heat.
Liquid Gap Fillers Two-component, cure-in-place materials designed for high-volume production offer easy dispensing and pump-out resistance at the interface.
Gap Filling Pads Provide efficient heat dissipation with a soft, conformable design that extends in-use life and improves reliability.
Thin Dielectric Sheets Ensure thermal transfer, electrical isolation, and easy assembly with reinforced adhesive-backed options.
Conformal Coatings Shield printed circuit board assemblies from moisture to prevent corrosion and failure, ensuring long-term reliability.
Potting Compounds Form a complete barrier that extends service life and ensures reliable performance to endure in any environment.
Thermal Pastes Designed to offer low thermal impedance and efficient performance for high-power applications—with no mixing or curing required.
Pre-Cured Gels One-part, stable materials ideal for thicker gaps—no mixing or curing needed, easy to dispense manually or with automated systems.
Bio Based Materials • Electrolube ® Conformal Coatings incorporate solvent-free, environmentally friendly materials with bio-based content, outperforming many traditional offerings. • Electrolube ® Potting Compounds provide options with over 60% bio-based content, demonstrating performance on par or superior to more conventional materials.
Through-Hole Assembly – Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
Solder Bar Alloys Produce durable joints with consistent high-quality performance for any application, also low- and no-silver options that enable reduced total cost of ownership (TCO).
Liquid Flux Improve wetting, minimize defects, and ensure strong, electrochemically reliable joints to enhance quality and performance in through-hole soldering.
Discover our industry-leading Circuit Board Assembly Solutions Innovative materials, unmatched expertise, and a complete portfolio to enhance reliability, performance, and efficiency in advanced electronics.
Cored Solder Wire Delivers superior surface insulation resistance (SIR) reliability and excellent spread for clean and no- clean applications. Supports manual and automated processes, ensuring reliable, very low residue joints in critical assemblies.
Electronics Cleaners Enable reliable performance on stencils, PCBs, and critical assemblies by efficiently removing contaminants in solvent, aqueous, and semi-aqueous processes for consistent, high-quality results.
ABOUT: MacDermid Alpha Electronics Solutions, a prominent business of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials; helping to deliver enhanced performance, reliability, and sustainability to electronics manufacturers worldwide. With a legacy spanning over a century of innovation, MacDermid Alpha has garnered the trust of manufacturers encompassing more than 50 countries. What sets MacDermid Alpha Electronics Solutions apart is our unique ability to promptly deliver high-quality solutions and provide technical services that comprehensively cover the entire electronics supply chain. We are actively shaping industries such as automotive, consumer electronics, mobile devices, telecommunications, data storage, and infrastructure.
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MacDermid Enthone and Alpha are product brands of MacDermid Alpha Electronics Solutions. © 2025 MacDermid Inc. and its group of companies. All rights reserved. ® and ™ are registered trademarks or trademarks of MacDermid Inc. and its group of companies in the United States and/or other countries.
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