IC Substrates – Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.
PCB Surface Finishes – Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
Copper Adhesion Promotion Drive innovation with copper adhesion promoters for consistent bonding and precise etching in IC substrates.
Copper Plating Technologies Enable advanced IC substrates with innovative micro via filling, redistribution layers (RDL), through-hole conformal & filling, and panel-level packaging.
Final Finishes Meet original equipment manufacturer (OEM) standards with high- performance finishes that enhance solderability and gold wire bonding.
Semi-Additive Process (SAP) Technologies Produce high-density IC substrates with our family
Electroless Nickel/Immersion Gold (ENIG) Exceed Institute for Interconnecting and Packaging Electronic Circuits (IPC) quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
Immersion Silver Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry’s most trusted ImAg finishes.
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion- free, high-uniformity deposits.
of semi-additive, high- performance buildup processes.
Primary Metallization – Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
Immersion Tin Gain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Organic Solderability Preservative (OSP) Explore OEMs’ preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
Conductive Polymers Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
Direct Metallization Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
Electroless Copper Optimize the performance of multilayer boards with high-reliability
electroless copper plating for demanding PCB applications.
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