SEMICONDUCTOR ASSEMBLY Advanced Materials for Reliable Performance and Thermal Management Optimize next-generation electronics with high-performance bondline materials for die attach, packaging, camera modules, and power electronics, delivering superior thermal management, durability, and reliability.
Power Electronics – Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
Package Attach – Sinter
Die Attach – Sinter High-reliability materials, enabling superior thermal and electrical conductivity for high- power applications.
Preforms Precisely shaped alloys for reliable joints in semiconductor and electronic assemblies, ensuring high- quality interconnects.
Top Attach – Sinter
Advanced Interconnect Assembly – Enhance thermal efficiency and precision with our solder Thermal Interface Material (TIM), solder, and flux solutions for advanced chip fabrication.
Our sintering materials ensure strong, reliable bonds to heat sinks or spreaders power electronics.
Robust mechanical and electrical connectivity in high-performance semiconductor packages.
Semiconductor Solder Flux Our Semiconductor fluxes for chip scale package (CSP), flip chip, and ball grid array (BGA) ball attach deliver high yields, stable performance, and easy deionized (DI) water cleanup.
Interconnect Solder Paste Advanced solder solutions for interconnecting semiconductor packages, from laminate to leadframe packaging.
Solder Thermal Interface Material Our Solder TIMs for semiconductors ensure efficient heat transfer, high purity, and low voiding.
Camera Modules – Camera module adhesives for secure assembly and peak performance.
Photomasks – Maximize yield and cut costs with reliable compugraphics photomasks and fast cycle times.
Standard Die Attach – Attain high-precision, reliable bonding with our Per- and polyfluoroalkyl substances (PFAS)-free die attach solutions for advanced semiconductor assembly.
Adhesives - Camera Modules Ensuring precise lens alignment, structural integrity, and long-term reliability in compact optical assemblies.
Compugraphics Photomasks High-quality photomask and reticle solutions, supporting advanced semiconductor manufacturing with precision patterning.
Conductive Die Attach Materials Our high-performance conductive die attach materials provide excellent thermal and electrical conductivity.
Hybrid Sintering Our advanced hybrid sintering delivers superior thermal conductivity and mechanical strength, ensuring reliable, durable bonds in high-performance electronics.
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