Market Focus
Driving Innovation – Research & Development (R&D) At MacDermid Alpha Electronics Solutions, innovation is at the core of everything we do. Our cutting- edge R&D efforts are shaping the future of electronic materials and manufacturing.
MacDermid Alpha Electronics Solutions delivers unmatched reliability and performance across the full spectrum of electronics manufacturing—from wafer fabrication to final assembly. Our advanced, integrated solutions connect and interconnect components, reinforce structures, protect sensitive electronics, manage heat with precision, and enhance haptics and touch functionality. Whether enabling next-generation semiconductor packaging, circuit board assembly, or smart surface films and in-mold electronics, we are a trusted partner delivering sustainable, high-quality solutions that ensure superior functionality and long-term durability across diverse electronic markets.
Products by Category
Wafer Level Packaging Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
Computing
Automotive Electronics
Circuitry Solutions Enabling next-generation technology with innovative specialty chemistries and materials for the most complex printed circuit board (PCB) and integrated circuit (IC) substrate designs.
Consumer Electronics
Industrial/Human-Machine Interface (HMI)
Semiconductor Assembly Advancing innovative electronics with reliable bonding materials for electronics, die attach, packaging and camera modules.
Medical Solutions
Military & Aerospace
Circuit Board Assembly Driving PCB technology with leading-edge electronic materials for high-reliability in complex circuit board assemblies.
Mobile Phone
Power Electronics
Haptics & Touch Shaping HMI advancements with hardcoated films and flexible, formable circuits for smart surfaces and displays.
Renewable Energy
Telecommunications
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