Circuit Board Protection – Safeguard electronics with advanced potting compounds and conformal coatings, ensuring longer life or reliability in any environment.
Thermal Management – Enhance device performance and longevity with high-performance thermal interface materials that efficiently dissipate heat.
Liquid Gap Fillers Two-component, cure-in-place materials designed for high-volume production offer easy dispensing and pump-out resistance at the interface.
Gap Filling Pads Provide efficient heat dissipation with a soft, conformable design that extends in-use life and improves reliability.
Thin Dielectric Sheets Ensure thermal transfer, electrical isolation, and easy assembly with reinforced adhesive-backed options.
Conformal Coatings Shield printed circuit board assemblies from moisture to prevent corrosion and failure, ensuring long-term reliability.
Potting Compounds Form a complete barrier that extends service life and ensures reliable performance to endure in any environment.
Thermal Pastes Designed to offer low thermal impedance and efficient performance for high-power applications—with no mixing or curing required.
Pre-Cured Gels One-part, stable materials ideal for thicker gaps—no mixing or curing needed, easy to dispense manually or with automated systems.
Bio Based Materials • Electrolube ® Conformal Coatings incorporate solvent-free, environmentally friendly materials with bio-based content, outperforming many traditional offerings. • Electrolube ® Potting Compounds provide options with over 60% bio-based content, demonstrating performance on par or superior to more conventional materials.
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