Through-Hole Assembly – Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
Solder Bar Alloys Produce durable joints with consistent high-quality performance for any application, also low- and no-silver options that enable reduced total cost of ownership (TCO).
Liquid Flux Improve wetting, minimize defects, and ensure strong, electrochemically reliable joints to enhance quality and performance in through-hole soldering.
Discover our industry-leading Circuit Board Assembly Solutions Innovative materials, unmatched expertise, and a complete portfolio to enhance reliability, performance, and efficiency in advanced electronics.
Cored Solder Wire Delivers superior surface insulation resistance (SIR) reliability and excellent spread for clean and no- clean applications. Supports manual and automated processes, ensuring reliable, very low residue joints in critical assemblies.
Electronics Cleaners Enable reliable performance on stencils, PCBs, and critical assemblies by efficiently removing contaminants in solvent, aqueous, and semi-aqueous processes for consistent, high-quality results.
Made with FlippingBook - Online magazine maker