Compound Semiconductor Fabrication – Enhance the reliability and performance of your compound semiconductor fabrication with our industry-leading precious metal plating technologies, ensuring superior quality and precision for next-generation devices.
WAFER-LEVEL PACKAGING SOLUTIONS Empowering Next-Generation Semiconductor Designs
We specialize in advanced wafer-level packaging (WLP) technologies that enhance the performance, reliability, and scalability of modern electronic devices, enabling faster, smaller, and more powerful solutions across diverse applications.
Backside Metallization Optimize via step coverage, yield, and reliability for power/radio frequency (RF) with our solutions that integrate seamlessly with die attach material.
Display Driver Interface (DDI) Achieve superior bondability, reliability and thermal stability of display driver applications with our high-hardness gold solutions.
Fan-Out Wafer-Level Packaging (FOWLP) Solder Surfaces Design next-generation fan-out wafer- level packaging with our advanced gold and palladium solutions for thin metal films.
Advanced Interconnect Metallization – Transform the performance of your packages with our advanced interconnect solutions, designed to provide reliable, uniform, and robust results for even the most complex semiconductor applications.
Damascene Enable advanced-node
Hybrid Bonding Hybrid bonding optimizes pitch, power, and reliability in advanced interconnects, with the added benefit of lower bonding temperatures for greater flexibility and a reduced thermal budget.
Low Alpha Materials Enhance reliability in next-generation devices with our sustainably sourced low-alpha tin—optimized for cost-efficiency and aligned with your Environmental, Social, and Governance (ESG) goals.
manufacturing with ViaForm ® for void-free copper electroplating and reliable, high-performance interconnects.
Gold Etch Materials Ensure precise, uniform gold seed removal on titanium-tungsten (TiW) barriers with advanced, cost- effective gold etchants for semiconductor fabrication.
Micro-Electromechanical Systems (MEMS) Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
Redistribution Layer (RDL) Unlock best-in-class RDL performance with efficient Input/ Output (I/O) pitch redistribution, advanced plating precision, and finer line widths for stronger, more reliable high-density packages.
Through-Silicon Via (TSV) Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high- density packages.
Wafer Bumping Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.
Discover our industry-leading wafer fabrication and integrated circuit (IC) substrate solutions Innovative technology, unmatched expertise, and a complete portfolio to power your advanced packaging needs.
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