Innovating Connections: End-to-end Solutions for Electronics

CIRCUITRY SOLUTIONS Advanced Chemistry for Tomorrow’s Electronics Enabling the most complex printed circuit board (PCB) and integrated circuits (IC) substrate designs with high- performance specialty chemistries.

Connector Plating – Ensure durability, high conductivity, and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.

Electronics Connector Plating Achieve bright, matte, low-stress finishes with high- efficiency electronic plating solutions that enhance durability and reliability.

Precious Metal Solutions Get corrosion-resistant, durable finishes with our high- speed, stable precious metal plating processes for demanding applications.

Circuit Formation – Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-generation applications.

Ammoniacal Etchants Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-generation designs.

Innerlayer Adhesion Promotion Ensure robust reliability for high- speed, low-loss applications with our wide range of engineered adhesion promoters.

Leadframe Adhesion Promotion Achieve moisture sensitivity level 1 (MSL-1) reliability with our adhesion promoters, from leadframe roughening to sidewall solderability.

Electrolytic Copper Metallization – Maximize uniformity in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.

High-Throw Direct Current (DC) Create mid-aspect-ratio boards with high-throw direct DC acid copper plating for enhanced performance, reliability, and versatility.

Periodic Pulse Reverse Ensure reliable plating for thick, multi-layer PCBs with periodic pulse reverse (PPR) solutions, delivering uniform coverage of high-aspect-ratio through-holes.

Via Fill Optimize PCB designs with high- performance copper via filling solutions, tackling any metallization challenge.

Molded Interconnect Device Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.

Process Chemicals Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, through dry film adhesion to board finish.

Solder Mask & Dry Film Adhesion Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.

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