• Secondary Bonding Busbars (SBBs) Previously known as telecommunications
MESH-BN VS. MESH-IBN: CHOOSING YOUR BONDING NETWORK When designing an ICT bonding infrastructure, professionals must decide between two primary approaches: the mesh-BN (Bonding Network) and the mesh-IBN (Isolated Bonding Network). Each has its advantages for specific use cases. Mesh-BN: Integrated Bonding A mesh-BN (Figure 2) is a supplementary bonding network where all associated equipment cabinets, racks, and cabling pathways are bonded together at multiple points to the Common Bonding Network (CBN). The CBN encompasses a wide range of interconnected metallic components, including: • Structural steel • Reinforcing rods • AC power conduits • Cabling infrastructure (e.g., racks, cable trays) • Structural steel • Associated bonding conductors
grounding busbars (TGBs), SBBs serve as bonding points for ICT systems and equipment in ICT areas or rooms such as telecommunications rooms, distributor rooms, access provider spaces, and computer rooms. They are connected to the TBB, creating a hierarchical bonding structure throughout the building. • Telecommunications Bonding Conductor (TBC) The TBC is a critical link, bonding the PBB to the electrical service busbar. This connection provides a direct path to ground, ensuring that the ICT and electrical systems share a common ground reference. • Secondary Bonding Conductors (SBCs) and Backbone Bonding Conductors (BBCs) SBCs are used to bond SBBs to the TBB when a direct connection is not possible. BBCs interconnect multiple TBBs, either on the same floor of a multi- story building or across a single story structure.
FIGURE 2: Example multi-story mesh-BN and example cabinet bonding to mesh-BN (Source: Harger)
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