This approach creates a highly interconnected bonding system, providing multiple paths to ground and reducing the potential for electromagnetic interference (EMI). Mesh-IBN: Isolation with Control In contrast, a mesh-IBN is an isolated bonding network where components are electrically insulated from the CBN, except for one controlled Single Point Connection (SPC). This approach can be beneficial in environments where a clean ground reference is critical, such as in sensitive telecommunications equipment areas. The choice between mesh-BN and mesh-IBN depends on factors such as the specific equipment requirements, the potential for EMI, and the overall design philosophy of the data center or telecommunications facility. INSTALLATION BEST PRACTICES AND PRACTICAL CONSIDERATIONS Implementing an effective ICT bonding system requires meticulous attention to detail and strict adherence to industry best practices to ensure proper functionality. ICT professionals must consider several key factors to ensure the system's integrity and performance.
When installing the PBB, proper positioning is critically important as it needs to be located near the primary electrical power panel. This placement facilitates the connection of the TBC in a relatively short, straight pathway between the PBB and the electrical service Alternating Current Equipment Ground (ACEG) busbar (Figure 3). It is essential to insulate the PBB from its supports using a listed insulator, maintaining a minimum separation of 50 mm (2 in) from the wall. This separation ensures proper access to the rear of the PBB and reduces the risk of unintended contact with other potentially conductive surfaces. Correct sizing of the TBC is also an important consideration. The TBC should be, at a minimum, as large as the largest TBB in the system. For specific sizing guidelines, ICT professionals can refer to the ANSI/TIA-607-E standard, which provides detailed information on the proper conductor sizes based on length. For specific sizing guidelines, ICT professionals can refer to the ANSI/TIA-607-E standard (Figure 4), which provides detailed information on the proper conductor sizes based on length.
FIGURE 3: Example relationship of PBB with primary ACEG bonding infrastructure (Source: Harger)
I
January/February/March 2025
39
Made with FlippingBook - Online catalogs