3. SBB
Electrical Testing 1. Continuity: Perform annual continuity tests between critical points in the bonding system, ensuring low-resistance paths are maintained. 2. Ground impedance: Conduct ground impedance tests every two years to verify the effectiveness of the overall grounding system. 3. Voltage difference measurements: Regularly measure voltage differences between different points in the bonding system to identify potential issues. Maintenance Procedures 1. Cleaning: Clean bonding connections annually, removing any dust or debris that could impact conductivity. 2. Tightening: Check and re-torque all mechanical bonding connections according to manufacturer specifications at least once a year. 3. Replacement: Replace any corroded or damaged bonding conductors or connectors immediately upon discovery.
• In typical telecommunications spaces (e.g.,telecom rooms or closets) where an electrical service panel is present.
• The ACEG busbar of this panel is bonded directly to the SBB.
This coordinated approach ensures that both the electrical and ICT systems share a common ground reference, promoting safety and reducing the potential for ground loops or other electrical issues. TROUBLESHOOTING AND MAINTAINING ICT BONDING SYSTEMS Implementing an ICT bonding system is only the first step; maintaining its integrity over time must be planned to account for ensuring ongoing performance and safety. The best practices for troubleshooting and maintenance include: Regular Inspections 1. Visual checks: Conduct quarterly visual inspections of all accessible bonding connections, look for signs of corrosion, loose connections, or physical damage. 2. Thermal imaging: Use thermal cameras annually to identify hot spots in bonding conductors, which could indicate high resistance or loose connections. 3. Documentation review: Keep bonding system documentation up-to-date, reviewing and updating it after any changes to the ICT infrastructure.
Troubleshooting Common Issues 1. Ground loops: If equipment is experiencing
interference, check for inadvertent multiple ground paths. Use a structured approach to identify and eliminate redundant connections.
2. High-resistance connections: If continuity tests show higher than expected resistance, investigate connections for corrosion or loose fittings. Clean and re-terminate as necessary. 3. EMI/RFI Issues: When EMI or RFI is detected, verify the integrity of shielding and bonding in the affected areas. Consider upgrading to a mesh-IBN approach if persistent issues occur in sensitive equipment areas.
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