Metrology X-ray Precision for Connected IoT Technologies. Precision Meets Efficiency for IoT Innovations In the rapidly evolving landscape of Internet of Things (IoT) technologies, Rigaku’s X-ray metrology tools stand out as essential solutions for quality control in the production of 200 mm and smaller wafers. OUR SYSTEMS AZX 400 TXRF 3760 TFXRD 200 WDA 3650 XHEMIS EX-2000, XTRAIA MF-2000
Metrology X-ray Precision for Connected IoT Technologies
Precision Meets Efficiency for IoT Innovations In the rapidly evolving landscape of Internet of Things (IoT) technologies, Rigaku’s X-ray metrology tools stand out as essential solutions for quality control in the production of 200 mm and smaller wafers.
OUR SYSTEMS AZX 400
TXRF 3760
TFXRD 200
WDA 3650
XHEMIS EX-2000,
XTRAIA MF-2000
Precision and performance to meet the stringent
demands of this growing market.
IoT | X-Ray Metrology for Quality Control
KEY BENEFITS
High Throughput and Low Cost
Designed for mass production, our affordable systems maximize output while minimizing costs, enabling manufacturers to maintain competitive pricing in the IoT sector. Achieve superior yield rates through high-precision measurements that identify defects early in production, reducing waste and increasing profitability. Yield Enhancement
Non-Destructive Testing (NDT)
Our innovative non-destructive X-ray technology allows for in-depth analysis without damaging the wafers, ensuring product integrity throughout the manufacturing cycle.
User-Friendly Operation
Our tools are easy to operate, with recipe-driven processes and an intuitive interface. This reduces your team's learning curve and enhances productivity.
Lab to Fab Technology
Designed to fit from lab to fab cleanroom environments, Rigaku systems deliver powerful performance at every step of the manufacturing process, making them ideal for quality control.
Sustainable Practices
Our tools support a low carbon footprint, aligning with the industry’s growing focus on sustainability while delivering effective performance for high- demand applications.
Rapid Measurement Capabilities
Our sweeping mode can measure up to X points in just X seconds, allowing for efficient analysis. It optimizes throughput to achieve approximately X wafers per hour, meeting the pace of modern manufacturing.
IoT | X-Ray Metrology for Quality Control
150 mm wafers
Elevate Your Production Standards with Rigaku By choosing Rigaku’s X-ray metrology tools, you are not just investing in equipment; you are enhancing your entire production process. Our commitment to innovation, precision, and user-friendly solutions empowers your team to confidently drive the
TXRF 3760
WDA-3650
AZX 400
future of IoT technology.
TFXRD 200
XHEMIS EX-2000
IoT | X-Ray Metrology for Quality Control
200 mm wafers
TXRF 3760
WDA-3650
AZX 400
XTRAIA MF-2000
XHEMIS EX-2000
TFXRD 200
Rigaku Technology Center Silicon Valley
a technology center designed for our customers
Rigaku Corporation and its Semiconductor Metrology Division are expanding its operations in Silicon Valley to improve its services for American market customers and enhance the corporation’s innovation links with US semiconductor manufacturers. We demonstrate metrology tools, offer service and application training, and showcase the latest technologies for thin film inspection, metrology, and monitoring .
Schedule a Tool Demo
Capabilities and technologies: Experience advanced 300 mm X-ray metrology instrumentation. The most reliable solutions to aid their metrology issues keep growing over the device generations, with the highest throughput and compelling cost of ownership.
Visit us at 528 Mercury Drive, Sunnyvale, CA 94085
Give us a call at +1 408-469-4053
e-mail us at rtc.sv@rigaku.com
TXRF 3760
COMPACT TXRF SPECTROMETER | Wafer surface contamination
SYSTEM PARAMETERS
SPECIFICATIONS
Technique
Total reflection X-ray fluorescence (TXRF)
Rapid, non-destructive measurement of trace elemental surface contamination (Na – U) 3-beam TXRF system with electronically cooled detector and automatic optics exchange
Benefit
Technology
High-power X-ray source (9 kW rotating anode) XYθ sample stage In-vacuum wafer robotic transfer system Accepts up to 200 mm wafers
Core attributes
Full wafer mapping ( SWEEPING-TXRF ) Zero edge exclusion ( ZEE-TXRF ) SMIF handling SECS/GEM communication software
Core features
Optional
Core dimensions
1000 (W) x 1760 (H) x 948 (D) mm
Measurement Results
Quantitative result, spectrum chart, color contour map, mapping table
SEQUENTIAL WDXRF SPECTROMETER | Analytical flexibility for process R&D and low-volume manufacturing and high-product-mix
AZX 400
SYSTEM PARAMETERS
SPECIFICATIONS
Technique
Sequential wavelength dispersive X-ray fluorescence
Flexibility to measure a variety of sample types, including 50 - 300 mm wafers, coupons, and sputtering targets (up to 30 kg) Analytical flexibility to measure elements from Be to U, well-suited for process R&D and low-volume, high product mix environment score 4 kW sealed X-ray tube, Sequential type goniometer, Primary beam filter; Measurement spot sizes 30, 20, 10, 1, and 0.5 mm (diameter)
Benefit
Technology
Core attributes
SQX (Scan Quant X) software Diffraction peak interference rejection
Core features
Wafer Loader CCD Camera Sample view camera
Optional
Core dimensions
1376 (W) x 1710 (H) x 890 (D) mm
Measurement Results
Film thickness and Composition
WDA 3650
SIMULTANEOUS WDXRF SPECTROMETER | In-line high-volume semiconductor manufacturing
SYSTEM PARAMETERS SPECIFICATIONS Technique
Simultaneous wavelength dispersive X-ray fluorescence
Benefit
Thickness and composition of multi- layer stacks for ≤ 200 mm wafers
Technology
4kW, Rh-anode WDXRF with XYθ sample stage
20 channels max. fixed type ( ₄ Be ～ ₉₂ U) scanning type ( ₂₂ Ti ～ ₉₂ U) CE marked, GEM/SECS, SEMI S2
Core attributes
AD-Boron channel for greater sensitivity Auto-calibration function with C-to-C autoloader
Core features
Optional
Auto wafer loader
Core dimensions
1120 (W) x 1450 (H) x 890 (D) mm
Film thickness Composition
Measurement Results
XHEMIS EX-2000 XRR AND EDXRF METROLOGY TOOL
| In-line high-volume semiconductor manufacturing
SYSTEM PARAMETERS
SPECIFICATIONS
Technique
X-ray reflectometry and X-ray fluorescence with XYθ sample stage
Measure ultra-thin single-layer films to multi-layer stacks. Obtain film thickness, density, and roughness by XRR (without standards), obtain thickness / composition by XRF (with standards)
Benefit
Technology
XRR and small-spot XRF
Cu sealed-tube source for XRR; Cr sealed-tube source for XRF, SEMI S2/S8 design
Core attributes
Core features
Auto loader, XRF system, X-ray tube type, SECS/GEM
Core dimensions
1250 (W) x 1825 (H) x 2400 (D) mm (with auto loader)
Thickness, density, roughness, and composition of films on blanket wafers Full-wafer mapping
Measurement Results
PROCESS EDXRF, XRR, AND XRD METROLOGY FAB TOOL | Optimized for high-volume manufacturing
XTRAIA MF-2000
SYSTEM PARAMETERS SPECIFICATIONS
Energy dispersive X-ray fluorescence (EDXRF), Micro x-ray fluorescence (µXRF), and X-ray reflectivity (XRR) High-throughput Measurement of Product Wafers From Ultra-thin Films to Micron-order Films, Applicable to a Wide Range of Thickness and Film Types.
Technique
Benefit
Technology
Analytical flexibility to measure
Monochromatic, micro-spot X-ray beam modules (COLORS ) enables a choice of optimized X-ray sources. Ultra-fast detector with up to 108 dynamic range and with monochromatic, micro-spot X-ray sources. Wafer Loader.
Core attributes
Core features
Core dimensions
1612 （ W ） ×3395 （ D ） ×2118 （ H ） mm
TFXRD 200
XRD SYSTEM MAPPING TOOL | For Near-fab Applications
SYSTEM PARAMETERS
SPECIFICATIONS
Technique
X-ray diffraction (XRD), rocking curve (XRC) and reflectivity (XRR)
High precision goniometer with full mapping XY-stage for large wafers (200mm, 300mm)
Benefit
Technology
High precision θ - 2θ horizontal goniometer with large cradle
Core attributes
Up to 300mm wafer full mapping XY stage
PhotonMax high-flux 9 kW rotating anode X-ray source, Confocal Max- flux 800W rotating anode X-ray source, HyPix-3000 high energy resolution 2D HPAD detector
Core options
Computer
External PC, MS Windows® OS, SmartLab Studio II software
Core dimensions
Approx. 1900 (W) x 2200 (H) x 1900 (D) mm
Contact us
Rigaku Corporation 3-9-12, Matsubara-cho Akishima-shi, Tokyo 196-8666, Japan info-gsm@rigaku.co.jp +81 3-3479-0618
Rigaku Americas 9009 New Trails Drive The Woodlands, TX 77381-5209, USA rsmd@rigaku.com +1-281-362-2300
Rigaku Technology Center Silicon Valley 530 Mercury Drive Sunnyvale, CA 94085, USA
rtc.sv@rigaku.com +1-281-362-2300
Rigaku Europe SE Hugenottenallee 167 63263 Neu-Isenburg, Germany semieurope@rigaku.com +49 6102 77999 51
THE WORLD OF SEMICONDUCTOR METROLOGY SOLUTIONS FROM LAB TO FAB
RIGAKU.COM
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