Monday 19th September 11:20 - 11:50 VIAVI Solutions Beyond 800G pluggable - what challenges lie ahead for the ecosystem Speaker: Dr Paul Brooks - Director of Product and Technology Beyond 800G pluggables are becoming an important theme, we see the early ramp of 800G clients and 400G coherent and now the industry must set out a path of an ecosystem beyond 800G. We give a T&M perspective of the challenges ahead to successful develop and ramp in a post 800G world! 12:00 - 12:30 Effect Photonics The Growing Need for Tunable Lasers: Focus on Metro, DCI and Access Networks Speaker: Joost Verberk, Director of Product Management In situations where fiber is not readily available, due to fiber exhaust or limited penetration, tunable lasers and DWDM are helping to expand capacity for metro, DCI and access applications. Even in areas where plenty of fiber is available, those techniques help maximize the ROI of a service provider’s fiber infrastructure. Further, advances in coherent technology and pluggable transceivers have enabled widespread deployment of IP over DWDM services and self-tuning algorithms have simplified the installation and maintenance of DWDM. As a result, metro transport, DCI and future access networks are moving towards coherent tunable pluggables, with annual sales forecast to double by 2026. 12:40 - 13:10 Infinera Extending Coherent to the Edge with XR Optics Speaker: Fady Masoud, Director, Solutions Marketing With the number of connected devices and bandwidth demand skyrocketing, service providers are faced with the challenges of coping with massive growth in bandwidth, reducing CapEx/OpEx, and simplifying the network. These challenges can only be overcome by a major shift in technology – extending coherent technology to the edge. This session discusses how XR optics can help service providers extend coherent technology to the edge, enabling an order of magnitude increase in capacity, significant reduction in TCO (70%), dramatic network simplification and software-configurable capacity allocation. 13:20 - 13:50 SUSS MicroOptics Novel micro-optics solutions through monolithic integration of microlenses and prisms Speakers: Wilfried Noell, Director of Research and Development Justine Lullin, Project and Engineering manager Micro-optical solutions based on micro-lenses are unleashing innovation in such diverse fields as 5G, the Internet of Things, autonomous driving. However, the test, assembly and packaging of microscale devices remains a significant challenge. In this context, the compact integration of both micro-lenses and micro-prism provides an enticing solution to challenges faced in many applications such as Photonic Integrated circuit, Optical subassemblies and transceivers or LIDAR. Recently, innovative combination of process technology has allowed SUSS MicroOptics to monolithically integrate lenses and prisms on the micro-scale. We present here the manufacturing of both silicon and fused silica micro- prism integrated on a micro-lens.
14:00 - 14:30 Teramount Ltd A Novel Fiber Assembly for Co-Packaged Optics Speaker: Hesham Taha, PhD, CEO Packaging trends for silicon photonics technology are lagging behind the demands of applications that require high bandwidth and low power consumption such as ethernet switches, advanced computing, chip-to-chip optical connectivity and other datacom and telecom applications. A new and effective packaging solution that is compatible with conventional high-volume manufacturing and packaging of the semiconductor industry is required. We report a PhotonicPlug technology that offers a re-workable and detachable connectivity of large number of fibers, an unprecedented ±30µm/0.5dB fiber assembly tolerances, post reflow assembly and full compatibility with co-packaged optics and electronics packages. The PhotonicPlug technology takes advantage from wafer level manufacturing processes for accurate placement of optics and for aligning silicon photonics with standard semiconductor manufacturing and packaging flow. 14:40 - 15:10 Avicena Avicena’s LightBundle GaN microLEDs on Silicon enable ultra-low Energy Interconnects for Chip-to-Chip Communications Speaker: Chris Pfistner Vice President, Sales & Marketing Avicena has demonstrated LightBundleTM interconnects with less than 2pJ/bit and will soon unveil sub-1pJ/bit links. The technology is based on arrays of innovative GaN micro-emitters that leverage the microLED display ecosystem and can be integrated into high performance CMOS ICs. The parallel nature of LightBundle™ is well matched to parallel chiplet interfaces like UCIe, OpenHBI, and BoW, and can also be used to extend the reach of compute interconnects like PCIe/CXL, or HBM/ DDR/GDDR memory links. 15:20 - 15:50 Pilot Photonics iCLA - integrated comb laser assembly for coherent DWDM superchannels Speaker: Dr. Frank Smyth, Founder and CTO As the industry looks towards 1.6T and 3.2T channel rates, multi- wavelength superchannels are expected to be required. Comb lasers offer benefits over independent lasers in terms of cost, footprint, and power while also enabling enhanced spectral efficiency and reduced DSP complexity. The integrated comb laser assembly (iCLA) builds on the heritage of the industry workhorse, iTLA. It uses gain switched comb source technology and monolithically integrated injection locked demultiplexers to deliver multiple coherent wavelengths on individual fibers from a single module to drive multiple 400G and 800G coherent optical engines. 16:00 - 16:30 KDPOF Latest innovations and optical fibre benefits in the automotive and industrial sector Speaker: Carlos Pardo - CEO Noise in large installations, for example in factories, can interfere with communications when copper cables are used. In stand- alone environments, such as a vehicle, we also encounter a lot of communication pollution when using a copper-based system. A fibre optic-based system in Ethernet communication has several advantages that solve the problems caused by interference from different sources. KDPOF will present their next-generation transceivers based on the optical multi-gigabit technology (xGBase-AU standards) and the advantages of its application in the automotive and industrial sector, compared to xGBase-T1 copper solutions, that includes low cost, easy engineering, higher reach, EMC-issues free, galvanic isolation, , industrial temperature range (from -40ºC until 150ºC), robust and low-cost connectors and scalability.
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