ECOC2022 Show Guide

Wednesday 21st September

10:30 - 13:00 EPIC TechWatch at ECOC 10:30 - 10:45 Welcome and introduction by EPIC 10:45 - 12:30 Presentations:

Advanced Photonics Integrated Packaging Solutions Enabling the Next Generation Optical Connectivity Speaker: Carlos Viana, CEO at ICON Photonics Photonics Packaging in Datacenter Focused Applications Speaker: Giorgio Cazzaniga, Director of Product Management by Jabil Advanced Material Solutions for Packaged Optoelectronic Devices Speaker: Luca Mauri, Head of the Getters & Dispensers Development Laboratory at SAES Group PHABULOuS – Fabrication Technologies for Free-form Optics Speaker: Ton Offermans, Technical Coordinator at PHABULOuS Pilot Line / CSEM

JePPIX: Scaling up InP PIC Production Speaker: Kevin Williams, Professor and Chair of the Photonic Integration research group at TU Eindhoven / JePPIX PDKs of the Future: Enabling a Modular Design Ecosystem Speaker: Pierre Wahl, Co-founder & Global Sales Director at Luceda Photonics Photonic Integration Based Devices for Tunable and Next Generation Networks Speaker Speaker: Francisco Rodrigues, CEO at PICadvanced

12:30 – 13:00 Networking

13:10 - 13:40 Yamaichi Electronics Deutschland GmbH 112Gbps-PAM4 connectivity – different solutions for all applications Speaker: David Binder, Product Manager Data Networking The market demands 112Gbps-PAM4 connectivity for pluggable modules. Yamaichi Electronics offers 112Gbps-PAM4 for: SFP, DSFP, NGSFP- DD, OSFP, QSFP, QSFP-DD, CFP and more. We have also available our modular mezzanine connector and our high-speed jumper cable interconnect product. • SFP and DSFP up to 112Gbps-PAM4 per diff. pair • NGSFP-DD the next generation small form factor pluggable with double density • QSFP and QSFP-DD host connector up to 112G-PAM4 per diff. pair • The latest development in CFP2 form factors • 112Gbps-PAM4 Mezzanine Connectors – YTM Series with highest density. • 112Gbps-PAM4 high-speed jumper cable interconnect product with stable data transmission