SUMIDIA - Polycrystalline Diamond Tools PCD Inserts
■ General Features Sumitomo PCD - SUMIDIA ® sintered diamond series has 4 grades (DA90, DA150, DA2200, DA1000) with individual features depending on the optimum combination of diamond particle size and binder, as well as the NPD10 grade (nano- polycrystalline diamond) where nano-order diamond particles are directly bound with high strength without using binders. PCD is suited for a wide range of applications from machining of aluminum alloy to machining of hard brittle materials and cemented carbide.
M
■ Grades, Features and Applications
Average grain size of diamond particles (μm)
Hardness HK (GPa)
Transverse Rupture Strength (GPa)
Grade
Features
Applications
100% diamond structure that directly binds nano-order diamond particles with high strength. Demonstrates optimum wear and fracture resistance as well as the best edge sharpness. High-density sintered grade made of ultra-fine grained diamond that demonstrates excellent wear and fracture resistance as well as edge sharpness.
120 to 130
· Finishing of Cemented Carbide · Machining of Hard Brittle Material (Ceramics)
NPD10
up to 0.05
≈ 3.15
· Machining of High-Silicon Aluminum Alloy · Rough, Interrupted and Finishing Machining of Aluminum Alloy · Woodcraft or Wooden Board Cutting/ Facing · General Finishing of Non-Ferrous Metals · Rough, Interrupted and Finishing Machining of Aluminum Alloy · Woodcraft or Wooden Board Cutting/ Facing · General Finishing of Non-Ferrous Metals · Finishing of Semi-Sintered Ceramics and Mold-Extruded Products · FRP, Hard Rubber & Carbon Cutting · Wooden or Inorganic Board Cutting/Facing · Machining of High-Silicon Aluminum Alloy · Machining of Aluminum Composite (MMC) · Green or Semi-Sintered Cemented Carbide & Ceramic Roughing · Machining of Sintered Ceramics/Stone/ Rock
50 to 60
DA1000
up to 0.5
≈ 2.60
C
Sintered grade made of ultra-fine grained diamond that demonstrates optimum wear and fracture resistance and excellent edge sharpness.
45 to 55
DA2200
0.5
≈ 2.45
D
Grade with micro-grained sintered diamond particles. With strong diamond particle bonding, it has an excellent balance of machinability and wear resistance. Contains coarser diamond particles than other grades, giving it good wear resistance suitable for the machining of carbides and high- silicon aluminum. Shows the highest diamond content for excellent wear resistance.
S
50 to 60
DA150
5
≈ 1.95
T
50 to 65
DA90
up to 50
≈ 1.10
V
Transverse rupture strength measured with test piece equivalent to insert PCD layer
■ Performance
Test Results for Continuous Cutting of Al-25% Si Alloy
Test Results for Continuous Cutting of Cemented Carbide (87HRA)
Test Results for Continuous Cutting of Cemented Carbide (91HRA)
Test Results for Continuous Cutting of MMC (Al-20% SiC) Competitor's Product
W
.012
.006
.012
.004
Conventional PCD
Competitor's Product B
DA90
.008
.004
.008
DA150
DA150
DA90
DA90
.002
Competitor's Product A
.006
DA90
.006
.002
DA1000
NPD10
0
0
0
0
165
330
500
650 1,300 2,000 2,650
6.2 12.4 18.6 24.8
.62 1.24 1.86 2.49
Cutting Distance (miles)
Cutting Distance (feet)
Cutting Distance (feet)
Cutting Distance (miles)
Part Material : Al-25% Si alloy Tool Cat. No. : SPG421 Holder : FP11R Cutting Conditions : v c =1,640 SFM, f =0.004 IPR, a p =5.1" Dry
Part Material : MMC (Al-20%SiC) Tool Cat. No. : CNMX432 Holder : PCLN2525 Cutting Conditions : v c =1,150 SFM,
Part Material : Cemented carbide (87HRA) Tool Cat. No. : NF-DCMA21.51 Cutting Conditions : v c = 65 SFM,
Part Material : Cemented carbide (91HRA) Tool Cat. No. : DCMA32.51RH (NPD10) NF-DCMW11T304 (DA90) Cutting Conditions : v c = 65 SFM,
f =0.008 IPR, a p =4.5" Wet
f = 0.004 IPR, a p = 5.1" Wet
M2
f = 0.002 IPR, a p = 1.27" Dry
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