For Cemented Carbide Glass Lens Molds Ultra-Precision Cutting Tool BLPCD UPC
Optical Components
Achieves long tool life in mirror nish and ne machining of cemented carbides SUMIDIA BINDERLESS is a new material developed by Sumitomo Electric Industries, Ltd. Fine grains of a few tens of nanometres are rmly and directly bonded together without the use of a binder, achieving a hardness exceeding that of single crystal diamond. There is also no anisotropy or speci c cleavage. Combined with our signature diamond precision grinding technology, this material enables unprecedented tool life and chipping resistance.
Features [Features of SUMIDIA BINDERLESS] D Fine grains of a few tens of nanometres are rmly and directly bonded
together without the use of a binder. D Harder than single-crystal diamond. D No anisotropy or speci c cleavage.
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[Features of BLPCD UPC] D Superior fracture and wear resistance compared to single/polycrystalline diamond. D Sharp and precise cutting edge equivalent to UPC (single-crystal diamond). D Free from uneven wear caused by crystal orientation, as it is not anisotropic.
Applications D Machining of cemented carbide glass lens molds and other high-hardness and brittle materials
Flank Wear Comparison of Machined Cemented Carbide
Sharp Cutting Edge Equivalent to Single Crystal Diamond
Wear Damage
Chipping
0.025mm
0.025mm
BLPCD UPC
UPC (Single-crystal Diamond)
50μm
No Large Chipping Found
Large Chipping Found
Surface Roughness of Machined Cemented Carbide
500μm
Ra 3.5nm
*"SUMIDIA" is a registered trademark of Sumitomo Electric Industries, Ltd.
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