NPD10, DA1090, & DABX Brochure

SUMIDIA PCD / SUMIDIA Binderless PCD NPD10 / DA1090

█ SUMIDIA Materials

SUMIDIA PCD DA1000

SUMIDIA PCD DA2200

SUMIDIA PCD DA150

SUMIDIA PCD DA1090

SUMIDIA PCD DA90

SUMIDIA Binderless PCD NPD10

Grade

Structure

2µm

2µm

0.1µm

5µm

5µm

5µm

Diamond Particles

*White areas in the image are the binder material

Binder

-

Co

Co

Co

Co

Co

Grain Size (µm)

Up to 0.05

Up to 0.5

0.5

5

Up to 50

50

Content (%)

100

90 to 95

85 to 90

85 to 90

92 to 97

90 to 95

SUMIDIA PCD DA1090 A polycrystalline diamond material with the highest diamond content, made by sintering coarse diamond particles at high density.

High density and enhanced particle binding strength exhibit excellent wear and fracture resistance.

DA1090

Conventional PCD

2µm

2µm

30µm

30µm

Realizes high density and enhanced particle binding strength

*Black areas in image are diamond particles

Coarse-grain polycrystalline diamond with excellent wear resistance and enhanced particle binding strength improve fracture resistance, achieving stable machining in high-load roughing of cemented carbide and other hard brittle materials Ideal for Rough Machining of Cemented Carbide and Hard Brittle Materials

█ How to Use NPD10/DA1090 (Cemented Carbide Machining)

SUMIDIA Binderless PCD NPD10

SUMIDIA PCD DA1090

Grade

Dimensional Tolerance

Best

First Recommendation is NPD10

Tool Life (Wear Resistance)

Best

Applicable for ap=.008" or above

Machining Cemented Carbide with Sintered Surface

Not Applicable

Best

Machined Surface Quality

Best

First Recommendation is NPD10

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