SUMIDIA PCD / SUMIDIA Binderless PCD NPD10 / DA1090
█ SUMIDIA Materials
SUMIDIA PCD DA1000
SUMIDIA PCD DA2200
SUMIDIA PCD DA150
SUMIDIA PCD DA1090
SUMIDIA PCD DA90
SUMIDIA Binderless PCD NPD10
Grade
Structure
2µm
2µm
0.1µm
5µm
5µm
5µm
Diamond Particles
*White areas in the image are the binder material
Binder
-
Co
Co
Co
Co
Co
Grain Size (µm)
Up to 0.05
Up to 0.5
0.5
5
Up to 50
50
Content (%)
100
90 to 95
85 to 90
85 to 90
92 to 97
90 to 95
SUMIDIA PCD DA1090 A polycrystalline diamond material with the highest diamond content, made by sintering coarse diamond particles at high density.
High density and enhanced particle binding strength exhibit excellent wear and fracture resistance.
DA1090
Conventional PCD
2µm
2µm
30µm
30µm
Realizes high density and enhanced particle binding strength
*Black areas in image are diamond particles
Coarse-grain polycrystalline diamond with excellent wear resistance and enhanced particle binding strength improve fracture resistance, achieving stable machining in high-load roughing of cemented carbide and other hard brittle materials Ideal for Rough Machining of Cemented Carbide and Hard Brittle Materials
█ How to Use NPD10/DA1090 (Cemented Carbide Machining)
SUMIDIA Binderless PCD NPD10
SUMIDIA PCD DA1090
Grade
Dimensional Tolerance
Best
First Recommendation is NPD10
Tool Life (Wear Resistance)
Best
Applicable for ap=.008" or above
Machining Cemented Carbide with Sintered Surface
Not Applicable
Best
Machined Surface Quality
Best
First Recommendation is NPD10
3
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