PRODUCT NEWS
Albis releases new photodiodes for 200G and beyond
At the upcoming OFC Exhibition 2025, Albis Optoelectronics will be
designed for advanced 400G per lane applications, pushing the boundaries of optical communication capabilities. This chip is ideal for high-density, high- bandwidth applications, making it a perfect fit for future-proof optical networks. With over 20 years of experience, Albis Optoelectronics specializes in designing and manufacturing Telcordia qualified InP and GaAs photodiodes. Their extensive product range includes PIN photodiodes for various digital and analog receivers; high power photodiodes; low bias, high sensitivity APDs for 28 Gbaud PAM-4 and 100GBASE- ER4 applications; monitor photodiodes; photodiodes with integrated lenses; hermetically packaged, short and long-wavelength microwave
showcasing its latest cutting- edge photodiodes, designed to meet the demands of next-generation high speed optical communications. PD50Y1 is a compact 200G photodiode chip sporting an unsurpassed responsivity, targeting next-gen optical transceivers in data centers and telecom applications. This photodiode features an integrated backside lens for easy and efficient optical coupling, and supports up to 200 Gbps per channel, ensuring superior data transmission speeds. The chip topside pads are optimized for flip-chip soldering processes using AuSn or SAC305. Additionally, Albis releases its new PD80X1 photodiode chip,
photodetectors up to 40 GHz. All products are manufactured in-house at their state-of-the-art clean-room facilities in Rüschlikon, Switzerland. Attendees of OFC Exhibition 2025 are invited to visit Albis Optoelectronics’ booth #1657 to discover how our photodiodes can elevate optical communication systems to new heights.
Micro Assembly and Active Alignment Stations at OFC
During OFC Optical Fiber Conference in San Francisco, nanosystec presents the NanoWelder on booth # 5439. This high- precision active alignment and microwelding station assembles optoelectronic components in the sub- micron regime with minimum shift. The fast active alignment uses any feedback signal such as optical power, beam pointing or PER. A key feature is the accurate laser micro welding process. The NanoSeries stations use high-precision epoxy gluing and laser soldering or welding (or a combination of various joining methods). NanoTest performs optical and electrical characterization for Silicon Photonics Devices on wafer and
accuracy. The assembly techniques include gluing
and UV curing, selective laser soldering and hot bar soldering, eutectic bonding and laser welding. According to the production volume, loading is performed manually or automated with robots, belts and feeders. All stations can be customized to perfectly reach the desired technical performance and throughput. Headquartered in Germany, nanosystec addresses customers worldwide with local support in North America and Asia. With nearly 30 years of experience, nanosystec offers a broad knowledge base to tailor the systems to the customer requirements.
chip level, VCSEL wafers, laser bars and CoS and High-Density PICs. The VersaSeries pick-and- place mounts opto-electronic assemblies and other precision
devices with a precision between 1 µm and 10 µm. Typical processes include the placement of laser structures, optics, apertures and similar components requiring high
Website: nanosystec.com
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ISSUE 40 | Q1 2025
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