TOP Conference 2024 Programme & Optical Connections

Abstracts

STREAM 1: Telecommunications Wednesday 13:30 -15:00

PANEL SESSION: UKTIN Wednesday 11:00 - 12:30

Session Chair: Mingming Tan, Research Fellow, Aston Institute of Photonic Technologies, Aston University

This session will introduce the UK Telecoms Innovation Network (UKTIN: https://uktin.net) to the TOP audience. The session will also present the foresight work carried out by the Optical Communications Experts Working Group (EWG) within UKTIN and will debate interdependencies with other key technology domains in delivering future network solutions. 11:00 - 11:15 General introduction to UKTIN – Dimitra Simeonidou (University of Bristol) 11:15 - 11:45 Presentation of the Optical Comms EWG findings – Nick Parsons (HUBER+SUHNER) 11:45 - 12:30 Panel: The role of optical and photonics across the broader telecoms ecosystem

Optical Communications – The future is bright Joerg-Peter Elbers, Adtran

Optics and photonics have revolutionized telecommunications. Starting with an analysis of past successes, this talk will explore future challenges and opportunities in delivering broadband fiber connectivity – from the core through the door.

Panel speakers:

Experimentation enabled by the National Dark Fibre Facility Martyn Fice, UCL The National Dark Fibre Facility (NDFF) is a UKRI-EPSRC National Research Facility which provides researchers with access to a dedicated software-defined optical fibre network at the physical layer. Since being established in 2014, NDFF has supported research in a diverse range of areas, including quantum key distribution, quantum networks, 5G/6G wireless, optimisation of WDM systems using machine learning, time and frequency distribution, and virtual reality research. In this presentation, the capabilities provided by NDFF will be summarised and some examples of recent experiments carried out by users of the facility will be described.

Chair: Dimitra Simeonidou (UKTIN Founding Partner)

Nick Parsons (Chair Optical Comms EWG)

Simon Saunders (Chair Wireless EWG)

Neil McRae (Chair Core Networking EWG)

Andy Sellars (Co-Chair Semiconductors EWG)

Integrating Hollow Core fibres with SMFs

Radan Slavik, Optoelectronics Research Centre, University of Southampton Thanks to a strong suppression of light-glass interaction, hollow core fibres (HCFs) have many unique properties as compared to standard single-mode fibres (SMFs). These include low nonlinearity in combination with low attenuation

Wednesday 12:30 -12:40 Low-Loss Photonic Wire Bonds and Facet-Attached Micro-Optical Elements: from Telecom to Quantum Applications Dr. Sebastian Skacel Vanguard Automation GmbH, Germany

and chromatic dispersion even at wavelengths outside 1550 nm telecom band. They also enable inserting of custom gases and liquids into the light path, of interest in sensors, gas cells, and nonlinear optics. Their design and manufacturing process have been maturing recently, making them of interest in a wide range of applications. We expect that many future fibre systems will be hybrid, including both, SMFs and HCFs. This will be initially to integrate HCFs into existing SMF systems or in the future to benefit from advantages of both fibre types. We will discuss current state-of-the art in interconnecting HCFs and SMFs, covering all important aspects such as insertion loss, back-reflection, suppression of multi-path interference, and robustness.

Photonic wire bonding allows to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The

technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. 3D nano-printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.

8

Made with FlippingBook - professional solution for displaying marketing and sales documents online