TAPPI Announces Corrugated Division Honorees, Award Winners TAPPI announced the honorees who will be recognized during a special awards ceremony at CorrExpo, on August 28-30 in Cleveland, Ohio: • Christopher Krumm, Greif Inc.’s former Vice President of Production, now retired • Harrison Talton, R&D Researcher, Fiber Technology, WestRock • Ed Stuczynksi, Director of Engineering at Menasha Packaging Co, LLC Krumm will be presented with the Corrugated Division’s David A. Carlson Leadership and Service Award. A TAPPI Fellow, he has served on the TAPPI Board of Directors, the
Corrugated Packaging Division’s Council (CPC), as well as its Supplier Advisory Council. The award is intended to recognize individuals for outstanding leadership and exceptional service to the Corrugated Packaging Division that have resulted in significant and demonstrable bene- fits to Division members. Talton is one of TAPPI’s 2023 Young Professional of the Year recipients, an annual honor identifying aspiring young leaders in the global forest products, pulp, paper, tissue, Chris Krumm Harrison Talton Ed Stuczynski
packaging and associated industries. Eligi- ble nominees are age 35 or younger with less than 10 years of industry experience. The award recognizes young profession- als who have made significant contribu- tions to the forest products industries in the following areas: leadership, communi- ty service, and problem-solving contribu- tions to scientific or engineering projects. Stuczynksi will be honored as Outgo- ing Division Chair. A TAPPI member since 2006, Stuczynksi has been an active vision participant serving in a variety of capaci- ties, as well as being involved in the Divi- sion’s special events, including SuperCorr- Expo, Corrugated Week and CorrExpo. He also serves on the Executive Committee of the Chicago TAPPI Local Section. During the Awards ceremony, the Divi- sion will also celebrate its 2023 scholar- ship recipients: •Katherine Marie Bodenschatz, University of Cincinnati, the Supplier Advisory Com- mittee Scholarship •Alex E. Boyd, Western Michigan Univer- sity, the Terry S. Paulson Memorial Schol- arship and the Mitsubishi Heavy Industries Scholarship •Weston Blaine Cregger, North Carolina State University, the Joe Dieffenbacher Engineering Scholarship •Abigail Brooke Mendius, Dunwoody Col- lege of Technology, the Corrugated Pack- aging Division Scholarship •Kate Ross, Miami University, the John O. Telesca Engineering Scholarship Visit correxpo.org to register and learn more about the event. To learn more about the Corrugated Packaging Division, visit tappi.org .
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July 31, 2023
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