PRODUCT NEWS
Complex Optical Alignment in a Tiny Space
Two different nanosystec gluing stations align and assemble up to 30 individual optical components in a butterfly housing using automated sub processes. This customized combination demonstrates the perfect fit of the assembly configuration regarding the process requirements. The VersaGlue station uses high-performance machine vision algorithms to precisely pick and place half of the components in the micron regime. The heat conductive resin should be applied evenly to maintain the optical path parallel to the bottom of the housing. In addition, the uniform resin line guarantees a good heat transfer. Optical power, beam parameters and optical spectrum serve as feedback signals for the active alignment and positioning
via a single mode fiber which transmits the signal into an integrating sphere with a photodetector. The NanoProfiler – developed by nanosystec on basis of a CCD camera – provides fast measurement capability. An optical spectrum analyzer measures the spectral properties. The versatile software package TestMaster allows for the fast and efficient realization of the automated process flow. The concept of manual interchange with trays fulfills the requirements for small and medium production volumes. Feeders, belts and robots serve higher production volumes and the linking of various manufacturing systems.
of the demanding optics. Machine vision combined with sensor measurements allow for a well-defined starting position followed by the assembly with submicron precision.
These actively aligned optics use epoxy glue which is cured by UV LED sources. Especially in these process steps, the position during assembly must not change. Optical power is measured
ECOC Copenhagen: Booth #C1411.
Powering the next generation of AI with high-performance 200G/400G photodiodes
At the upcoming ECOC Exhibition 2025 in Copenhagen, Albis Optoelectronics will showcase a comprehensive portfolio of 200G/400G photodiodes fulfilling the demands of next- generation optical transceivers used in high- end AI applications. Our latest generation of InGaAs photodiodes combine superior bandwidth with unsurpassed responsivity, ensuring precise signal detection even under demanding operating conditions. Integrated backside lenses simplify optical coupling and enable
supporting flip-chip soldering assemblies, enable seamless integration with TIAs and advanced packaging designs. Engineered for reliability, scalability and cost efficiency, these best-in-class devices empower customers to accelerate innovation, reduce time-to-market, and meet the ever-increasing performance demands of hyperscale data centers and AI-driven infrastructures. With over 20 years of experience, Albis Optoelectronics specializes in designing and manufacturing Telcordia qualified InP and GaAs photodiodes. The extensive product range includes PIN photodiodes for various digital and analog receivers;
high power photodiodes; low bias, high sensitivity APDs for 28 Gbaud PAM-4 and 100GBASE-ER4 applications; monitor photodiodes; photodiodes with integrated lenses; as well as hermetically packaged, short and long-wavelength microwave photodetectors up to 50 GHz. All products
are manufactured in-house at state-of-the-art clean- room facilities in Rüschlikon, Switzerland. Attendees of ECOC Exhibition 2025 are invited
to visit Albis Optoelectronics’ booth #C1108 to discover how our photodiodes can elevate optical communication systems to new heights.
exceptional alignment accuracy and efficiency. Versatile pad options
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| ISSUE 42 | Q3 2025
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