PRODUCT FOCUS
Albis Optoelectronics extends portfolio of mounted photodiodes
MPO technology for multi-fibre type solutions
The MPO, from Sanwa, is designed to be used with their full line of connectors, as well as a stand-alone system. Users can choose from individual components, such as MT ferrules, MPO adapters, MPO connector kits, or an entire assembly in 12-, 24-, or 48-port models. Key features include a choice of standard and high-grade SM and MM, compliance to IEC, TIA, RoHS, and REACH standards, as well as a flammability rating of UL 94 V-0. All MPO components are made using advanced manufacturing systems that incorporate the latest in injection moulding technology, along with state-of-the-art assembly and test procedures. Sanwa is exhibiting at OFC. Stand number 2324.
Apex Technologies to launch ultra-high resolution OSA customized 2D or 3D (wrap-around) carriers and the PS20X4 consists of an array of four, flip-chip soldered 28 Gbps lensed photodiodes that can be used as the core building block inside a 100G ROSA module. All photodiode products are completely manufactured Albis will use this year’s OFC to present its extended portfolio of mounted photodiode. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on
in-house, in fully owned, clean-room facilities. Product highlights include: PIN photodiodes for 10G, 25G and 40G digital and analog receivers; Low bias, top illuminated APDs for 2.5G and 10G OLT/ONUs; Side-illuminated monitor diodes and monitor diode arrays; Photodiodes with integrated lenses and optical filters; Hermetically packaged, short and long wavelength microwave photodetectors, up to 30 GHz. Albis is exhibiting at OFC 2017. Stand number 3506.
3-micron die bonder from MRSI Systems
The highly configurable, MRSI-M3 platform provides 3-micron accuracy, automation, speed and reliability, in-situ assembly processes such as eutectic die bonding. UV epoxy die attach and flip chip assembly are also possible. From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.
The MRSI-M3 3-Micron die bonder is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi- chip modules, stacked assemblies, hybrid devices and photonic packages. The product comes with force control, 360° die orientation and programmable multi-colour lighting as standard, but can also be customised to
Ultra-high performance test equipment specialist, Apex Technologies, has announced plans to launch updated versions of a number of key products – the compact high resolution optical spectrum analyser (OSA), ultra-high resolution OSA and optical complex spectrum analyser (OCSA). By using robust and smart internal and external mechanics, Apex Technologies has made the new family of OSA extremely reliable. Furthermore, with faster new electronic and optical designs, the OSAs provide not just high resolution, but also fast sweep solutions to satisfy customer needs in C, L and O band applications. The detailed spectrum and temporal information offered opens the door to much more varied possibilities of characterisations like lasers, combs, advanced modulation formats, sensor, components and ASE source. Apex Technologies will be exhibiting at OFC. Stand number 3146.
specific user requirements. MRSI Systems is exhibiting at OFC 2017. Stand number 1728.
Senko unveils Micro LC connector
Senko’s Micro LC connector provides an ideal solution for behind-the-wall (BTW) applications, plug and play modules and on board optics, where space saving is paramount. Using a conventional LC ferrule, with a spring loaded design, the connector mates with all standard LC connectors. Senko isexhibiting at OFC 2017. Stand number 2811.
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| ISSUE 8 | Q1 2017
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