PRODUCTS Detachable Fibre Connector Solutions on GF Fotonix to Scale Next-Generation Optical Connectivity As part of a collaborative effort with GlobalFoundries (NASDAQ: GFS) (GF) to develop detachable fibre connector solutions for the GF Fotonix™ silicon photonics platform, Corning have announced their latest solution
“Our collaboration with GlobalFoundries is helping to shape the future of AI infrastructure and accelerate the progress needed to meet the demands of an increasingly data-driven world,” said Dr. Claudio Mazzali, vice president, global research, Corning. “There’s something truly powerful in combining GlobalFoundries’ and Corning’s expertise in silicon process and optical connectivity – together, we’re enabling new possibilities for the AI-powered industries of tomorrow.”
Built on the comprehensive GF Fotonix platform that supports co-packaged optics solutions for scale-out and scale- up networks, Broadband Journal are told this collaboration will pair Corning’s well established supply chain and leadership in optical interconnect technologies with GF’s high volume manufacturing capabilities and leadership in silicon photonics. “Our collaboration with Corning marks a significant step forward in delivering next-generation connectivity solutions for AI and machine learning,” said Kevin Soukup, senior vice president of GF’s silicon photonics product line. “Corning’s cutting-edge fibre technology, integrated with our silicon-proven GF Fotonix platform, delivers the performance and flexibility required for enabling scalable, high-density optical packaging for AI data centres.”
That solution being a glass-waveguide based edge-coupler compatible with GF Fotonix’s v-grooves, is designed to meet the growing demands of AI data centres for high bandwidth and power- efficient optical connectivity. Corning tell us that other coupling mechanisms are also being developed, including a vertically-coupled detachable fibre- to-PIC (Photonic Integrated Circuit) solution – demonstrating Corning and GlobalFoundries’ combined ability to produce multiple forms of co-packaged PIC-to-fibre connectivity. The collaboration leverages Corning’s long-established innovation in glass, optical fibre and connectivity technologies. This includes a broad portfolio of special glass compositions, glass wafer, IOX, and laser processing, and Fibre Array Units (FAUs), leveraging fibres with ultra-precise core alignments minimising insertion loss for the most demanding data centre and high-performance computing applications.
www.corning.com
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DECEMBER 2025 Volume 47 No.4
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