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Oxygen Plasma Strip CLEANROOM

CLEANROOM

Basic Wet Bench Training

Wet etch processes during fabrication may include etching Si, SiO 2 , and various metals. For Si etching, potassium hydroxide (KOH) or tetramethylammonium hydroxide (TMAH) solutions are used with varying temperatures. With wafer holders whole wafers can be etched with backside and edge protection. Highly concentrated Hydrofluoric acid (HF, 50%) and BOE (buffered oxide etch) are used to isotropically etch SiO 2 or polysilicate glass. The following metals may be etched with relevant etchants: Al, Au, Cr, Cu, Ni, Pd, Ti and W. Wet cleaning processes may include Piranha (H 2 SO 4 and H 2 O 2 ) and RCA clean- ing and also the use of solvents. The Piranha clean can be applied to a large number of materials by removing metals and organic contamination. RCA clean- ing is for removing organic residue and metal ions from Si wafers. The clean technique, also called “Standard Clean” (SC), is for removing organic residue (SCA-1) and removing metal ions (SCA-2). Safety and use of personal protective equipment (PPE) is especially important in these wet processes and this training will ONLY cover the basics (not necessar- ily the processes described previously), and is a prerequisite for other trainings and processes. PARTICIPANT PROFILE This course is intended for students and research professionals from KAUST working in micro and nanofabrication. PREREQUISITES • Active Badger account

The oxygen plasma strip is a process for dry-cleaning and etching of photoresist and polymers with O 2 plasma. The unique HDRF technology of the DSB 6000 plasma strip allows isotropic etching of high aspect ratio features with a much higher ashing rate compared to conventional plasma technologies. It also offers damage-free processing, and targets the growing demand for low temperature processing. The DBS 6000 is capable of handling batch wafers, namely 25 wa- fers per run up to 200 mm in diameter. This course introduces the main applications of oxygen plasma strip processes. Users will learn about tool setup, control software, and operation procedures, as well as how to set up the process parameters for different applications in recipe modules. Sample loading/unloading and run recipes will also be discussed. PARTICIPANT PROFILE This course is intended for students and research professionals from KAUST working in micro and nanofabrication. PREREQUISITES • Active Badger account

• Laboratory Safety Training • Hazardous Waste Training • Emergency Incident Preparedness Training • Cleanroom Safety Training MAXIMUM PARTICIPANTS 5 DURATION 2 hours FREQUENCY Monthly

DURATION 2 hours FREQUENCY Monthly

• Laboratory Safety Training • Hazardous Waste Training • Emergency Incident Preparedness Training • Cleanroom Safety Training • Basic Wet Bench Training MAXIMUM PARTICIPANTS 4

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Specialized Instrument & Method Training Catalog

Edition 1, Sept e mber 2020

235

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