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CLEANROOM

Laser Writer DWL2000 CLEANROOM

Contact Mask Aligning & Nanoimprint Lithography

The Heidelberg DWL2000 Laser Lithography System is a system mainly de- signed to create photomasks performing Maskless Laser Lithography onto Blank Mask substrates. Maskless lithography is used to perform high resolution patterning (0.7um) on substrates coated with photoresist. The radiation used to expose the substrate is not projected from, or transmitted through a photomask. Instead, with the DWL2000 tool, the radiation is focused through a system of lenses into a narrow laser beam. This laser beam is used to directly write the image from a design file into the photoresist. The system can also be used to perform Maskless Laser Lithography onto wafer substrates. This course gives participants a basic understanding of photolithography. It cov- ers tool setup and software, system initialization, file conversion, loading sub- strate, job setup, exposure map setup, understanding errors, and tool-standby status. Mask processing, developing, etching and the final cleaning process will be performed, and users will then learn to analyze and interpret results. Process issues and process optimization will also be discussed.

The contact aligner is used for exposure of wafers. Shining a UV light through a chrome mask to a photo-resist coated wafer exposes the photo-resist not covered by the chrome in the mask. The exposed photo-resist is dissolved by the developer and essentially the pattern on the mask is transferred to the wafer. Contact aligners can also align previously patterned marks on the substrate to a different mask during further exposure steps. Support for both front-side and back-side alignment are present in the EVG 6200 and it is capable of 1 micron feature resolution. It can accommodate substrates up to 8 inches in diameter and mask sizes 5, 7 and 9 inches. It also has additional nano-imprint capability and filters for i-line and SU-8 for nanometer scale patterning. This course gives participants a basic understanding of photolithography. It covers tool setup and software, system initialization, and loading substrates and masks. Process issues and process optimization will also be discussed. PARTICIPANT PROFILE This course is intended for students and research professionals from KAUST working in micro and nanofabrication. PREREQUISITES • Active Badger account

PARTICIPANT PROFILE This course is intended for students and research pro- fessionals from KAUST working in micro and nanofab- rication. PREREQUISITES • Active Badger account • Laboratory Safety Training • Hazardous Waste Training • Emergency Incident Preparedness Training

MAXIMUM PARTICIPANTS 4 DURATION 3 hours FREQUENCY Monthly

DURATION 3 hours FREQUENCY Monthly

• Laboratory Safety Training • Hazardous Waste Training • Emergency Incident Preparedness Training • Cleanroom Safety Training • Basic Wet Bench Training MAXIMUM PARTICIPANTS 4

• Cleanroom Safety Training • Basic Wet Bench Training

Learn Develop Excel

Specialized Instrument & Method Training Catalog

Edition 1, Sept e mber 2020

237

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