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ECOC EXHIBITION
Virtual Catch Up 1-3 November 2021
CONTENTS
Message from the Sponsor
Our Sponsors and Media Partners
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Welcome from the Organiser
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Dear attendees and delegates,
Vrtual Catch Up Timetable
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On behalf of the entire ASMAMICRAMicrotechnologies team, I warmly welcome you to this year's European Conference on Optical Communications. It’s such a relief to meet colleagues face to face again and being able to do this in the appealing city of Bordeaux is an absolute surplus. Due to the global pandemic, it became clear once again how important digital infrastructure is nowadays. That is why we are pleased to have the ECOC, an ideal platform for exchanging ideas with customers, users and partners in the field of fiber optic technology. This exhibition has been a magnet for visitors for 25 years when it comes to fiber optic and communication technology. ASMAMICRA is proud to having been part for many years by now. ASMAMICRAMicrotechnologies GmbH is a worldwide leading supplier for ultra-high precision die attach systems. The ASM AMICRA systems specialize in submicron placement accuracy to ±0.3μm@3s for the photonics and semiconductor market. The systems also support die attach, flip chip, eutectic, epoxy, and XCeleprint’s Micro Transfer Printing (MTP) processes. Headquartered in Regensburg, Germany, ASMAMICRA has worldwide sales and support locations. ASMAMICRA is a subsidiary of ASM Pacific Technology Limited, a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics that is headquartered in Singapore. This year the company has existed for 20 years and we have seen many changes in the industry over time. As network demands increase, long-haul communications are becoming complex. With the non-stop proliferation of connected devices and sensors, we are generating more data than ever before. The fast transmission of this steadily growing amount of data requires ever higher accuracy when assembling the semiconductor components and this is exactly what has been in the DNA of ASMAMICRA for 20 years. Our machines are already assembling semiconductor chips with an accuracy of 0.3 micrometers.
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Market Focus
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Abstracts
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Product Focus
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Abstracts
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ECOC Awards
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I would like to personally invite you to visit us at booth Nr. 1215 to meet members of our Technical Sales and Application Specialist teams.
Exhibitors
Wishing you a great conference with new insights and inspirations that will enable you to realise worldchanging technologies.
By Company Name
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By Market Sector
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Exhibitor Listings
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Dr. JohannWeinhändler Managing Director
ECOC 2021 is organised by Nexus Media Events Ltd Suite 3, Building 30, Churchill Square, Kings Hill, West Malling, Kent ME19 4YU United Kingdom t: +44 (0) 1732 752 125
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Sponsored by
THANK YOU TO OUR SPONSORS
ECOC Exhibition 2021 Official Media Partners
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Sponsored by
Welcome to ECOC Exhibition Virtual Catch Up 2021, the opportunity to revisit Europe’s largest exhibition dedicated to fibre optic communication technology. Exhibitors from around the globe await you in the virtual exhibition, along with a fantastic line up of the excellent Market Focus and Product Focus sessions from the event in Bordeaux.
Exhibition Highlights Back for a sixteenth year, Market Focus in 2021 once again forms a hub of discussion. Catch up with more than 25 sessions covering everything from datacentres, photonics integrations and digital silicon photonics to fibre access, service and content provider optical transmission, showcasing the very latest news and developments from global leaders within the industry. As new technologies continue to emerge, and increased pressure is being placed on the networks than ever, the need for efficient and resilient optical networks has never been greater, Market Focus gives you a unique opportunity to hear the latest trends, exciting predictions and the next steps to be taken to achieve connectivity goals. See p7 for the full speaker line up. The Product Focus theatre is our newest addition to the exhibition hall, after being introduced at the virtual event in 2020, and gives you the chance to hear about some of the latest innovative products. See p7 for the full timetable.
Run in conjuction with Optical Connections, the ECOC Exhibition Industry Award winners were announced at the live event in September. The Awards highlight significant achievements in advancing the business of optical communications, transport, networking, fibre-based products, photonic integration circuits and related developments. Catch up on what our winners had to say and revisit the interview videos online from Tuesday 2nd November. Don’t forget to join the conversation across the three days of the exhibition, by following on social media for previews, product launches, photos and highlights. Tweet us @ecoc_exhibition to share your own news, photos and event plans, and tag us using #ecoc2021. A big thank you goes out to all of our exhibitors, sponsors, partners, speakers and visitors for your continued support once again this year. We hope your time with us is well-spent and you find everything you are looking for. We look forward to welcoming you back next year for ECOC Exhibition 2022 in Basel, Switzerland.
The ECOC Exhibition Team
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Sponsored by
SAVE THE DATE 19-21 SEPTEMBER 2022 BASEL, SWITZERLAND
Find out more at: www.ecocexhibition.com
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Monday 1 st November Start Finish Title
Presenter
Company
12:00 12:30 Adoption of Silicon Photonics accelerated in 2018-2020 12:00 12:30 Pluggable coherent optics drive new challenges for inter-op
Vladimir Kozlov, Founder and CEO
LightCounting VIAVI Solutions
Paul Brooks
12:35 13:05 Integrated Silicon Photonics for High-Bandwidth Data Center Connectivity Scott Schube, Sr. Director of Strategic Marketing Intel 12:40 13:10 100G/400G/800G Extended Reach Technologies, Standard and Applications Rangchen Yu Sifotonics 13:10 13:40 Advancing integrated photonics with electro-optic polymer modulators Michael Lebby Lightwave Logic Inc 13:20 13:50 NGSFP-DD the 5G form factor David Binder, Business Development Manager Yamaichi Electronics Deutschland GmbH
13:45 14:15 Optical I/O for Chip-to-Chip Communications
Mark Wade, CTO
Ayar Labs UK Ltd
14:20 14:50 Optics in Cloud Computing -> 100G/400/800 GbE optics 14:55 15:25 Novel LED based parallel optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications 15:30 16:00 The evolution and challenges to 800g optics and beyond
Marco Vitali
Sicoya
Christoph Pfistner, Marketing & Business Development
Avicena
Frank Chang
Source Photonics
16:05 16:35 The Road to 800G and Beyond
Andreas Bechtolsheim
Arista
Radha Nagarajan, SVP & CTO, Optical and Copper Connectivity Business Group
16:40 17:10 Post Moore Data Center Networks for 800GbE/1.6TbE
Marvell
17:15 17:45 Deployment of 400ZR and the ongoing OIFWork to Define 800ZR/LR Josef Berger, Marvell Semiconductor, Inc. and OIF Representative OIF Tuesday 2 nd November Start Finish Title Presenter Company 09:30 10:00 Optical Innovations for a Greener Planet - Evolving Today’s Network and Reimaging Tomorrows Tim Doiron, Sr. Director, Solution Marketing Infinera 10:00 10:30 10G& 25G Optical Transceivers: Optical Fronthaul Applications in Koreas 5GWireless Network Per Hansen OE Solutions 10:20 10:50 Readiness of 50G-PON in terms of technology, standard and ecosystem Junwei Li, Senior Expert on Optical Access China Mobile
Emerging Industrial Manufacturing Requirements Including Private 5G Communications, IIoT Sensors, and SecurityEPIC – European Photonics Industry Consortium
Tracey Vanik, Head of Photonics Market Research
10:55 11:25
EPIC
11:00 11:30 Multi Lambda Fiber Coupling solutions for Chip on board and Co-Packaged Optics
HUBER + SUHNER Cube Optics AG Ericsson Telecommunicazioni SpA
Dirk Götzl
11:30 12:00 Can Optical keep up with evolving RAN requirements. ?
Peter Finn, Strategic Head of Product Li
11:40 12:10 True PAM4 AOC for huge volume deployment in advanced data center using innovative self-aligned optical engine manufacturing 12:05 12:35 Innovative single wavelength BIDI transceivers will reshape optical communications
Yung Son
Optomind Inc
Spark Xu
QXP Technologies Inc
LightCounting Market Research TRUMPF Photonic Components
12:40 13:10 Fiber vs. IAB in 5G x-haul
Stéphane Téral, Chief Analyst
13:00 13:30 Expanded share of VCSELs in Data Center
Dipak Chudasama
Lorenzo Ghioni, Director of Product Management
13:15 13:45 Routed Optical Networking
Cisco
13:40 14:10 XR Optics Overview and Applications 13:50 14:20 Extending OpenROADM to the Network Edge
Fady Masoud, Director, Solutions Marketing Infinera
Raj Nagarajan, Product Line Manager Roshene McCool, Market & Technology Development Manager
Lumentum
14:25 14:55 High capacity pathways - Fiber innovations for a connected future
Corning
ECOC Exhibition Industry Awards
15:15 1:30 Award Winner Interviews
Raza Kahn, Senior Market Manager - Wireless Products Gert Sarlet - Principal Product Manager, II-VI
15:00 15:30 5G X-haul Transport Solutions
Semtech
15:30 16:00 High optical output coherent integrated optics enables simplified 400G metro networks 16:00 16:15 Overview of Ciena’s Coherent ELS: a high-capacity, coherent-optimized, disaggregated open line system (OLS)
II-VI
Mayank Chauhan, Product Line Manager
Ciena
Matt Bolig, Director of Product Marketing, Marvell
16:40 17:10 PAM4 DSPs for Global Network Infrastructure
Marvell
Wednesday 3 rd November Start Finish Title
Presenter
Company
09:45 10:15 Optical Communications for Satellite Networking: From Free Space Optics to Optics in Space ! 10:20 10:50 High volume integrated Silicon Photonics for next generation LiDAR and other sensing applications
Sanjai Parthasarathi, Chief Marketing Office II-VI
Robert Blum, Sr. Director of Marketing and New Business Dave Welch, Founder and Chief Innovation Officer
Intel
10:55 11:25 Extending Coherent to the Edge – How and Why Now?
Infinera
11:30 12:00 Next steps in coherent interface standardization
TomWilliams, Director of Marketing
Acacia, now part of Cisco
12:05 12:35 A New Specification for Multi-Wavelength Optical Laser Sources for Advanced Integrated Optics 12:40 13:10 Integrated lithium-niobate electro-optic platform, an emerging solution enabling a wide range of high speed and power efficient applications 13:15 13:45 Photonics integration and digital silicon photonics, Optoelectronic integration trends and applications 13:50 14:20 Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems 14:25 14:55 Data center optics – 400G and above rollout and the promise of co- packaged optics
Chris Cole, Chair, CW-WDM MSA; Advisor, II-VI Incorporated
CW-WDM MSA
Mian Zhang, Ph.D.
HyperLight Corporation
Brad Booth, Chairman and President, COBO and Principal Engineer, Microsoft Jeff Hutchins, Ranovus, Director, CTO Office Lisa Huff, CDCMP®, Senior Principal Analyst
Consortium for On-Board Optics
OIF
Omida
15:00 15:30 OSFP-XD vs Co-Packaged Optics
Mark Lutkowitz, Principal
fibeReality, LLC
= Market Focus Session
= Product Focus Session
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Sponsored by
Sponsored by:
Returning for its sixteenth year, the 2021 Market Focus will cover an even broader selection of informative and on-trend optical communications topics from a number of leading industry professionals. Top network equipment manufacturers, senior executives, key analysts and the principal FTTH industry body are among those confirmed to deliver thought provoking seminars and inspire discussion.
2021 Timetable Following on from our retrun to the Market Fcous theatre in September, the Virtual Catch Up allows you to revisit some of the excellent sessions.
Monday 1st November PIC and SiPh/Datacenters/Optics in Cloud computing The opening Market Focus session from Vladimir Kozlov of LightCounting and takes a look at the significant impact Silicon Photonics (SiP) is making on the market. Following this we hear from Intel and Lightwave Logic's CEOMichael Lebby, as he reviews the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level. MarkWade fromAyar Labs joins us to share the impact of chip-to-chip connectivity on next- generation computing systems for AI/HPC, telecommunications and intelligent edge follwed by a presentation fromMarco Vitali fromSicoya looking at optics is cloud computing. During the afternoonwewelcome Frank Chang fromSource Photonics as he looks at next gen 800G, follwed by Andreas Bechtolsheim from Arista will discuss how the transition to 800G and 1600Gdata center optics will enable cloud networks to evolve in themost cost effective, power efficient and compatible fashion. The first day finishes off with a discussion on the advanced building blocks for DSP, Silicon Photonics, TIA and Drivers to enable the 800GbE/1.6TbE for inter and intra data center applications fromMarket Focus sponsors Marvell, and the day closes with an overview of 400ZR and discuss its deployment status fromOIF.
Tuesday 2nd November Optical Transmision (SDN/ Network Agility)/Fibre Access (5G/cable/PON/FTTX) Day two we welcome Junwei Li from China Mobile who will discuss the readiness of 50G-PON in terms of technology, standard and ecosystem, follwed by Tracey Vanik from EPIC as she examines the important role photonics plays in industrial applications including 5G Private Networks, real-time imaging & equipment control, synchronization, high-speed connectivity, and even security for connected IIoT devices. Ericsson poses the question 'Can optical keep up with evolving RAN requirements' followed by a presentation fro QXP Technologies. During the afternoon we hear from Cisco and LightCounting Market Research, and the second day of sessions closes with Raj Nagarajan from Lumentum who will discus the novel methods by which cost can be reduced to enable ROADM at the Edge and will propose potential WSS solutions for these applications. Corning's Rohsene McCool joins us for the closing session with a look at the options available to increase capacity and deliver more pathways, and explore the fiber innovations that will support multi-service networks of the future.
Wednesday 3rd November New technologies & systems/New markets/New Packaging platforms The final day of the event openswith Sanjai Parthasarathi from II-VI with a look at the status and evolution of the 'NewSpace' emerging market segment within optical communications, reviewing trends and sizing opportunities. Intel's Robert Blumwill then discuss progress and challenges in using silicon photonics for coherent FMCWLiDAR applications, followed by sessions from Infinera and focus on how point-to-multipoint coherent optical pluggables enable service providers to push coherent to the accesswhile leveraging existing infrastructure (e.g., PON) and deliver higher capacity. TomWilliams fromAcacia (nowpart of Cisco) will analyze howcurrent trends in coherent interface standardisation are expected to influence next generation networks and investment in coherent technology, followed by a look at a new specification formulti-wavelength optical later sources for advanced integrated optics. The afternoon continueswith sessions from BradBooth fromConsortium forOn-Board Optics, and Jeff Hutchins fromOIF and the final day closeswith a focus on 400Gand above rollout and the promise of co-packages optics fromLisaHuff of Omida.We are then joined by Mark Lutkowitz fromFibeRealitywith a review of the latest information onwhy pluggableswill continue to be viable at least until the arrival of 200T switchASICs.
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The Committee
Advisory Committee Members
GlennWellbrock
Committee Chair: Michael Lebby, Lightwave Logic
Verizon
Pierpaolo Ghiggino
Stephan Neidlinger
Industry Consultant
ADVA Optical Networking
Frank Chang
Wladek Forysiak
Source Photonics
Aston University
Bill Ring
Daryl Inniss
Voyant Photonics
OFS
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Sponsored by:
Monday 1st November
11:00 – 11:30 LightCounting Adoptionof SiliconPhotonics accelerated in2018-2020 Speaker: Vladimir Kozlov, Founder and CEO It is clear by now that Silicon Photonics (SiP) is making a very significant impact on the market. Sales of SiP-based products started to ramp in 2014, accelerated in 2018 and reached almost $2 billion in 2020, accounting for 25% of the total market for optical transceivers. Numerous foundries offer design and manufacturing of SiP optical engines, making this technology available to a wide range of suppliers and accelerating innovation. Co-packaged optics and Integration of optical chips with coherent and PAM4 DSPs will solidify market position of SiP technology over this decade. 11:35 – 12:05 Intel Integrated Silicon Photonics for High-Bandwidth Data Center Connectivity Speaker: Scott Schube, Sr. Director of Strategic Marketing Data center traffic continues to grow at an exponential rate and is generating a large demand for optical transceivers at ever increasing data rates and bandwidth densities with reduced cost per bit and power consumption per bit. We’ll review the recent trends for pluggable transceivers from 100G to 1.6T and discuss how continued bandwidth scaling is driving the need for a much tighter integration of optics and electronics. Deployments of co-packaged optics (CPO) at scale will require wafer level fabrication processes to manufacture photonic ICs with a high density of integrated components, advanced 2.5/3D packaging to integrate multiple electrical and photonic ICs, and appropriate system level thermal and mechanical solutions. 12:10 – 12:40 Lightwave Logic Advancing integrated photonics with electro-optic polymer modulators Speaker: Michael Lebby, CEO Electro-optic polymer modulators are now poised to impact data- heavy applications such as datacenter networks, high-performance computing and telecom applications with their inherent high speed and very low power properties. Electro-optic polymers are now additive to integrated photonics platforms such as silicon photonics to increase performance significantly. Two types of polymer designs that are called Polymer Plus™ and Polymer Slot™ have been developed that are compatible with integrated photonics platforms and fabricated in commercial silicon foundries using standard PDKs (process development kits). The talk will discuss the latest results on stable and reliable EO polymers for integrated photonics platforms that have demonstrated electro-optical and electrical 3dB bandwidths that are in excess of 100GHz. These highspeed, low-power solutions provide a vehicle for next generation PIC (photonic integrated circuit) designs. The electro- optical materials have competitive performance characteristics both at 1310nm as well as 1550nm operating wavelengths. The development of 1310nm advanced polymers opens up opportunities for short distance optical interconnects that are expected to positively impact the datacenter and high-performance computing market. This talk will also review the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level. The roadmaps are a working, living document that helps plot out PIC platform challenges, opportunities, and directions for a broad portfolio of stakeholders over the next decade. The roadmaps review next generation aggregated data rates of 1600 and 3200 Gbps as well as multi-Tbps optical switching solutions, and more specifically, how these challenges can be addressed by polymer-based technologies.
12:45 – 13:15 Ayar Labs UK Ltd Optical I/O for Chip-to-Chip Communications Speaker: Mark Wade, CTO A new connectivity solution is needed to meet the ever-growing bandwidth needs of data-intensive applications, low power interconnects, and new innovative heterogeneous and disaggregated system architectures. In-package Optical I/O is poised to disrupt performance, cost, and efficiency curves and create a new path forward for composable computing. In this talk, Hugo Saleh will present advancements in building a new generation of chiplet and multi- wavelength laser solutions that deliver up to 1000x bandwidth density at 1/10th the power of standard electrical I/O. Additionally, he will share the impact of chip-to-chip connectivity on next-generation computing systems for AI/HPC, telecommunications and intelligent edge. 13:20 – 13:50 Sicoya GmbH Optics in Cloud Computing -> 100G/400/800 GbE optics Speaker: Marco Vitali The introduction of 100G per lambda optics is ongoing and the industry is yet again entering into another iteration of debating about how to define next generation interconnects. A number of different approaches have been proposed such as co-packaging optics with switch ASICS and defining new pluggable modules that can support up to 1.6T utilizing 200G per lambda. In this presentation we are going to review the individual options and assess them in terms of performance, cost of ownership and maturity of the ecosystem. We will highlight how Silicon Photonics is going to play an important role in all those solutions and provide an update of the most recent technology developments in this field. 13:55 – 14:25 Avicena Novel LED based parallel optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications Speaker: Christoph Pfistner, Marketing & Business Development Avicena is developing a highly parallel LED based optical link technology targeting up to 10m reach for chip-to-chip interconnects in High-Performance and Cloud computing, as well as processor-to- memory disaggregation applications. The technology is based on arrays of novel GaN high-speed micro emitters, leveraging the LED display ecosystem, and Si based PDs integrated into a single CMOS chip and linked with multi-core fiber. At 10Tbps/mm2 @ < 0.5pJ/bit combined with excellent reliability over the industrial temperature range of -40°C to +150°C this new class of optical interconnects eliminates the inherent power, reach and interference limitations of electrical links in chip-to-chip communications.
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Sponsored by:
Monday 1st November
14:30 – 15:00 Source Photonics The evolution and challenges to 800g optics and beyond Speaker: Frank Chang Ethernet data rates have been increasing rapidly. Optical transceivers capable of supporting 400Gb/s have commercially deployed to wrap up in volume for data centers. Source Photonics will review the evolving state of proliferate 400G technologies for these applications and the deployment requirements such technologies should meet. We will look into next gen 800G and beyond technologies available for even up to 80km. Finally, we will review how to apply 200G per lambda technologies for emerging 800G and/or 1.6Tb/s applications such like 2xFR4 and LR8.
15:40 – 16:10 Marvell
Post Moore Data Center Networks for 800GbE/1.6TbE Speaker: Radha Nagarajan, SVP & CTO, Optical and Copper Connectivity Business Group We will discuss the advanced building blocks for DSP, Silicon Photonics, TIA and Drivers to enable the 800GbE/1.6TbE for inter and intra data center applications. In addition, we will also discuss the modulation format and system tradeoffs that are needed to enable these data rates with the available technology. 16:15 – 16:45 OIF Deployment of 400ZR and the ongoing OIF work to define 800ZR/LR Speaker: Josef Berger, Marvell Semiconductor, Inc. and OIF Representative 400ZR coherent deployment is underway and showing a strong ecosystem already exists for this new interoperable standard developed by the OIF. In this presentation an OIF expert will give an overview of 400ZR and discuss its deployment status, including ongoing maintenance. The presentation will then give an overview of current 800ZR and 800LR technical work to create the next core network architecture components and looking to bring coherent networking into the datacenter.
15:05 – 15:35 Arista
The Road to 800G and Beyond Speaker: Andreas Bechtolsheim
With the ever increasing demand for more bandwidth in cloud data centers, the three most important attributes for data center optics are cost, power, and compatibility. In my presentation I will discuss how the transition to 800G and 1600G data center optics will enable cloud networks to evolve in the most cost effective, power efficient and compatible fashion.
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Sponsored by:
Tuesday 2nd November
10:20 – 10:50 China Mobile Readiness of 50G-PON in terms of technology, standard and ecosystem Speaker: Junwei Li, Senior Expert on Optical Access The ITU-T has recently consented a series of standards related to 50Gb/s passive optical network (50G-PON), which represents a significant leap from the current 10G-PON systems. Such an advance is made possible by innovations in optical transceiver components, digital signal processing based channel equalization, and enhanced forward error correction. 50G-PON also introduces new capabilities such as low-latency operation via cooperative dynamic bandwidth allocation and expanded cryptographic features. With these improved capabilities, 50G-PON is well positioned to meet the demanding requirements of emerging services. In this talk, the readiness of 50G-PON in terms of technology, standard and ecosystemwill be presented. 10:55 – 11:25 EPIC – European Photonics Industry Consortium Emerging Industrial Manufacturing Requirements Including Private 5G Communications, IIoT Sensors, and Security Speaker: Tracey Vanik, Head of Photonics Market Research Industrial Applications increasingly utilize a wide variety of photonic sensors to enable real-time dynamic processmonitoring. Supporting the high bandwidth images, 5Gnetworks are emerging as the best solution to support Industry 4.0 process communications as well as the information fromnumerous remote sensors. Yet there are additional elements that must be taken into consideration for successful operations - including timing and security. This presentationwill examine the important role photonics plays in industrial applications including 5GPrivateNetworks, real-time imaging & equipment control, synchronization, high-speed connectivity, and even security for connected IIoT devices. Can Optical keep up with evolving RAN requirements? Speaker: Peter Finn, Strategic Head of Product Line Optical From 1 to 5G, Radio technology continues to advance. Operators are constantly challenged to stick or twist with respect to when and where to invest in a very public competition to provide the highest performing network. With performance measures openly available, and operators under pressure to deliver shareholder value, Can optical technology keep pace and help provide faster, &more flexible solutions at the right cost? 12:05 – 12:35 QXP Technologies Inc Innovative single wavelength BIDI transceivers will reshape optical communications Speaker: Spark Xu This presentation will introduce the innovative single wavelength transceiver, which is different from the conventional circulator or 3-dB splitter type solutions, and which has superior performance and cost. A brief description of the mechanism of single wavelength BIDI is given, and test-bed system results will highlight the excellent performance QXP's 50G BIDI modules. This innovative technology has three major advantages: I. It simplifies the carrier's inventory management and network construction; II. It doubles the wavelength capacity; III. It reduces up/down link time differences down to the ps level, thus meeting more rigid specs of next generation systems. The technology will bring significant improvements to optical networks. 11:30 – 12:00 Ericsson Telecommunicazioni SpA
12:40 – 13:10 LightCounting Market Research Fiber vs. IAB in 5G x-haul Speaker: Stéphane Téral, Chief Analyst
13:15 – 13:45 Cisco Routed Optical Networking
Speaker: Lorenzo Ghioni, Director of Product Management The Routed Optical Network is a new paradigm for networking that delivers improved operational efficiencies. The architecture has consistently demonstrated a 45% total TCO savings over traditional architectures in over 50 network modeling examples. With a single service layer based upon IP, flexible management tools can leverage telemetry and model-driven programmability to streamline lifecycle operations. This simplified architecture integrates open data models and standard APIs, enabling a provider to focus on automation initiatives for a simpler topology. Network automation substantially increases network efficiency to lower the cost per bit so more services can be deployed to provide better profitability. 13:50 – 14:20 Lumentum Extending OpenROADM to the Network Edge Speaker: Raj Nagarajan, Product Line Manager The OpenROADMMSA has recently released an updated specification that extends ROADM capability from the existing Metro-core application, to cover aggregation networks in the Metro-access where fixed OADM has historically been prevalent. This presentation will discuss supported architectures at the edge and interoperability with Metro-core OpenROADM. The key differences between the Edge ROADM optical specification and the existing OpenROADM specification will be discussed, along with how the YANG models differ. The presentation will discuss the novel methods by which cost can be reduced to enable ROADM at the Edge and will propose potential WSS solutions for these applications. 14:25 – 14:55 Corning High capacity pathways - Fiber innovations for a connected future Speaker: Roshene McCool, Market & Technology Development Manager The need for effective delivery of communication networks has never been greater, as bandwidth demands fromusers grow and the services connected to communication infrastructures increase in diversity. As network connectivity and complexity increases, the ability to deliver increased capacity over more pathways has become the focus of innovation in fiber and cable. This presentation will explore the options available to increase capacity and deliver more pathways, and explore the fiber innovations that will support multi-service networks of the future.
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Wednesday 3rd November
09:45 – 10:15 II-VI Optical Communications for Satellite Networking: From Free Space Optics to Optics in Space! Speaker: Sanjai Parthasarathi, Chief Marketing Officer World’s hunger for data connectivity is insatiable. COVID has shown us the importance of high speed connectivity to our lives including in critical applications like telehealth. Connecting underserved communities is a UNESCO priority and Satellite networks are a promising tool. This emerging ‘New Space’ market is at an inflection point. We expect New Space to leverage Optical Communications innovations originally developed for terrestrial. The status and evolution of this important emerging market segment within optical communications will be discussed, reviewing trends, sizing opportunities as well as trying separate fact from fiction ! High volume integrated Silicon Photonics for next generation LiDAR and other sensing applications Speaker: Robert Blum, Sr. Director of Marketing and New Business Many next generation sensing applications require the integration of multiple and sometimes dozens of emitters and receivers. This high level of integration makes these applications well suited for silicon photonics, particularly in markets that require the ability to manufacture in high volume. This presentation will discuss progress and challenges in using silicon photonics for coherent FMCW LiDAR applications and review other applications that could potentially benefit from a mature silicon photonics platform with integrated lasers, amplifiers, and receivers. Extending Coherent to the Edge – How andWhy Now? Speaker: Dave Welch, Founder and Chief Innovation Officer The world is on the verge of wide-scale 5G deployment, and enterprises around the globe are moving to cloud applications to increase productivity and lower costs. This is fueling ever-growing demand for next-generation connectivity services with higher capacity, more flexibility, and simpler operations. While existing access networks carry all today’s services, their limitations prevent them frommeeting tomorrow’s capacity and agility requirements. This session describes how point-to-multipoint coherent optical pluggables enable service providers to push coherent to the access while leveraging existing infrastructure (e.g., PON) and deliver higher capacity (40x vs. XGS- PON), better flexibility, and 70+% TCO reduction. 10:20 – 10:50 Intel 10:55 – 11:25 Infinera 11:30 – 12:00 Acacia, now part of Cisco Next steps in coherent interface standardization Speaker: Tom Williams, Director of Marketing Standardization of coherent technology has taken a big step forward at 400G supporting applications in DCI and service provider networks. Looking toward the next generation, there are opportunities to increase speeds and expand the application space to address both shorter and longer reach interfaces using pluggable coherent optics. Meanwhile, silicon photonics is fast becoming the preferred material for high-speed coherent interfaces. The presentation will analyze how these trends are expected to influence next generation networks and investment in coherent technology.
12:05 – 12:35 CW-WDM MSA
A New Specification for Multi-Wavelength Optical Laser Sources for Advanced Integrated Optics Speaker: Chris Cole, Chair, CW-WDM MSA; Advisor, II-VI Incorporated The CW-WDMMSA, dedicated to defining and promoting specifications for multi-wavelength advanced integrated optics, recently announced the release of its first official specification for 8, 16, and 32 wavelength optical sources to support advances in datacentre bandwidth density and energy efficiency, for high performance computing, artificial intelligence, and other emerging applications. Chris Cole, Chair of the MSA, will present details of the new specification and how it creates great opportunities for transceiver and laser suppliers to develop innovative products. Integrated lithium-niobate electro-optic platform, an emerging solution enabling a wide range of high speed and power efficient applications Speaker: Mian Zhang, Ph.D, CEO and Founder Energy consumption in optical networking for ethernet, data centers and 5G is soaring because of the rapidly growing data traffic. The bottleneck is the limited voltage-bandwidth performance of existing integrated photonics solutions, which poses a serious challenge for meeting the tight power consumption requirements from network builders. In this session, HyperLight will talk about their breakthrough solution which is an integrated photonics platform based on thin- film lithium niobate. This scalable photonics platform offers sub-volt electro-optic modulators with a 3-dB bandwidth > 100 GHz as well as monolithically integrated ultralow loss passive optical components. Up to 700 Gb/s IMDD single channel and 1.55 Tb/s coherent transmission have been demonstrated on the platform. This emerging platform would save building and running costs for network operators and enable a wide range of high speed and power efficient applications. 12:40 – 13:10 HyperLight Corporation Photonics integration and digital silicon photonics, Optoelectronic integration trends and applications Speaker: Brad Booth, Chairman and President, COBO and Principal Engineer, Microsoft Is it right to continue the proven path of pluggable modules or time to adopt a new deployment model involving on-board optics or co-packaged optics? The trend of moving optics from the faceplate into the enclosure and onto the main PCB (on-board optics) or onto the switch package (co-packaged optics) represents an attractive opportunity to shorten electrical channels and minimize the number of transitions. COBO established its CPO and OBOWorking Groups, collaborations of end users and technology suppliers uniquely positioned to address guidance topics including trade-offs, enabling technologies, adoption paths, and potential impact on datacenter network architectures. 13:15 – 13:45 Consortium for On-Board Optics
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Wednesday 3rd November
13:50 – 14:20 OIF
15:00 – 15:30 fibeReality, LLC
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems Speaker: Jeff Hutchins, Ranovus, Director, CTO Office Co-Packaged Optics are proposing smaller form-factor and lower power solutions to enable the ever increasing levels of integration required for the networking future. In this presentation an OIF expert will give an overview of the current standards emerging across a range of applications and use cases for co-packaged optics. As one of the hot button topics in the technology sector at the moment, the OIF will highlight why standards are required and some of the technical challenges currently on the table that must be solved to enable this innovative new technology for success. 14:25 – 14:55 Omida Data center optics – 400G and above rollout and the promise of co-packaged optics Speaker: Lisa Huff, CDCMP®, Senior Principal Analyst ICP data centers are quickly adopting 400Goptics inside their data centers and are looking towards the next progression of network technology to simplify and reduce cost and power consumption. This presentation will summarize the high-speed network connectivity adoption, ICP data center network evolution and its needs. Co-packaged optics (CPO) is one technology that promises to reduce cost and power consumption inside the data center, but can components companies develop the ecosystem fast enough to competewith the tried-and-true pluggable optics solutions? The advantages and risks of CPOwill be discussed.
OSFP-XD vs Co-Packaged Optics Speaker: Mark Lutkowitz, Principal
Both the new pluggable solution, which was just announced, and CPO have major technological and practical challenges. The timing of OSFP- XD, at least in establishing a foothold is expected to take place much sooner for intra-data center applications at the hyperscalers. CPO has more of a potential play more quickly with other types of apps. The presentation will address the latest information on why pluggables will continue to be viable at least until the arrival of 200T switch ASICs. The fact that Near Package Optics (NPO) is still being considered demonstrates the long process in developing a viable, cost-effective CPO.
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PRODUCT FOCUS TIMETABLE Launching at our virtual exhibition this year, the new Product Focus Theatre focuses on the latest innovative products. Run in conjunction with Market Focus, Product Focus allows you to hear about some of the latest innovative products and watch live demonstrations. The Product Focus timetable can be found below and the Abstracts on p25.
Monday 1st November 11:00 – 11:30 VIAVI Solutions Pluggable coherent optics drive new challenges for inter-op Speaker: Paul Brooks Pluggable coherent optics are now becoming available at 400Gb for both ZR and CFP2/DCO applications – encompassing both classic DWDMand emerging DCI ecosystems. A key driver in any open multi- vendor standards based ecosystem is plug and play inter-op. This presentation reviews the key area where the addition functionality and complexity drives inter-op challenges beyond the traditional photonic domain focus. The material highlights what can be done to drive module interop across the key areas of photonic, host interface and host management while meeting all the challenges of time to market and increased functionality. 11:40 – 12:10 Sifotonics 100G/400G/800G Extended Reach Technologies, Standard and Applications Speaker: Rangchen Yu We will discuss progress made in standardization and MSA, such as 100G Lambda MSA, on extended reach optical solutions based on 100G PAM4 Technology. The focus will be on exploring 100G, 400G and 800G extended reach transceiver solutions. We will discuss the applications in 5G and data center connectivity for these new generation of 400G and 800G extended reach solutions. We will also cover how to extend the technology to 200G PAM4 IM-DD for future generation optical solutions. 12:20 – 12:50 Yamaichi Electronics Deutschland GmbH NGSFP-DD the 5G form factor Speaker: David Binder, Business Development Manager Data Networking In the global 5G rollout, both technical and geopolitical factors apply. A 5G front-end unit may have a different hardware spec in China than in the EU. Narrowed down to the pluggable I/O transceiver interface we expect SFP(x) to dominate in the EU, and NGSFP in China. Yamaichi Electronics developed a “one fits all” pluggable I/O host connector, complying with SFP(x), DSFP and NGSFP - aiming to seize the combined quantity potential of the Chinese and European roll out. In this webinar, we would like to introduce our host connector, which is backwards compatible, cross-compliant and future ready up to 112G-PAM4/Ch.
Tuesday 2nd November 09:30 - 10:00 Infinera Optical Innovations for a Greener Planet - Evolving Today’s Network and Reimaging Tomorrows Speaker: Tim Doiron, Sr. Director, Solution Marketing
10:30 - 11:00 OE Solutions Title TBC Speaker: TBC
11:00 – 11:30 HUBER + SUHNER Cube Optics AG Multi Lambda Fiber Coupling solutions for Chip on board and Co-Packaged Optics Speaker: Dirk Goetzl, Manager RF Electronic Next generation of 800G and 1,6T transceivers brings new challenges regarding the optical coupling and the integration of a multiplexer or demultiplexer in the transceiver. Co-Packaged optics or Chip on board engines need low loss, high performance and stable optics with a matched beam characteristic especially for silicon photonics. The optical coupling needs to have a small form factor to allow a high density for coupling on the chip and due to available space in small form factors. To solve these challenges different solutions are available which are discussed in this session to find the best solution for the application.
11:40 – 12:10 Optomind Inc
True PAM4 AOC for huge volume deployment in advanced data center using innovative self-aligned optical engine manufacturing Speaker: Yung Son, Chief Marketing Officer Optomind’s advanced optical engine technology has enabled PAM4 as well as NRZ AOC with analog CDR to meet all the requirements including high performance, lowest power, and shortest latency at a disruptive pricing. Its innovative design implemented self-alignment between the optical device and optical fiber without any high precision vision assembly machine that enhances productivity and reduces huge manufacturing cost and delay in quick ramp-up volume. Our PAM4 AOC is the best-in-class product using analog CDR, which is a key breakthrough in applications for higher performance computing (HPC) and advanced cloud data center including artificial intelligence and machine learning.
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Tuesday 2nd November
15:30 - 16:00 II-VI High optical output coherent integrated optics enables simplified 400Gmetro networks Speaker: Gert Sarlet - Principal Product Manager, II-VI The high-performance IC-TROSA integrated optics module with transmitter optical output power of 0 dBm is the optical engine for 400ZR/400ZR+ QSFP-DD coherent pluggable transceivers that can be installed directly into routers, which allows simplified metro and regional core networks. With their high optical output power, these transceivers are compatible with existing and emerging modern ROADM-based photonic layers supporting multiservice, multilayer architectures. This disruptive solution opens up a direct technical path for the further evolution of IP-over-DWDM, extending the application space beyond a simple point-to-point datacenter interconnect. This game-changing IC-TROSA is enabled by a highly integrated indium phosphide platform, which integrates all the key optical functions of a coherent transceiver into one digitally controlled subassembly.
13:00 – 13:30 TRUMPF Photonic Components Expanded share of VCSELs in Data Center Speaker: Dipak Chudasama, Director, Business Development Datacom
Vertical-cavity surface-emitting lasers (VCSELs) has played a key role in datacom including all important Data Center applications. A high volume of VCSEL based ActiveOptical Cables (AOC) and transceivers are deployed ranging in data rates from1Gbps to 400Gbps pushing distances up to 100m. New technologies are emerging to expand the VCSEL applications with high reliability and lower power consumption reaching longer distances at lower cost. Will VCSEL ‘s share expand to distances of 500m, 2kmand 10km typically addressed by edge-emitter lasers? 13:40 – 14:10 Infinera XR Optics Overview and Applications Speaker: Fady Masoud, Director, Solutions Marketing Since the inception of optical networking, there has been a misalignment between network traffic patterns and the technology used to transport that traffic. Traffic patterns, particularly in metro networks, are overwhelmingly hub and spoke. Optical connectivity solutions, however, have been implemented using strictly point-to- point technology, with each end of the connection required to operate at the same speed (1G, 10G, 100G, etc.). The result is an extremely inefficient architecture requiring large numbers of bookended transceivers and numerous intermediate aggregation devices to “up- speed” traffic flows. This session provides an overview of XR optics, a game-changing innovation, that leverages digital subcarriers to enable the industry’s first scalable point-to-multipoint, direct low-speed to high-speed optical transceiver connectivity. XR optics enables network operators to dramatically reduce the number of transceivers in the network, eliminate the need for costly intermediate aggregation devices, and more efficiently optimize optical transport infrastructure for hub-and-spoke end-user traffic flows, resulting in TCO savings of 70% or more.
16:00 - 16:15 Ciena
Overview of Ciena’s Coherent ELS: a high-capacity, coherent-optimized, disaggregated open line system (OLS) Speaker: Mayank Chauhan, Product Line Manager
16:40 - 17:10 Marvell PAM4 DSPs for Global Network Infrastructure Speaker: Matt Bolig, Director of Product Marketing, Marvell
15:15 - 15:30 ECOC Exhibition Industry Awards AwardWinner Interviews
15:00 - 15:30 Semtech 5G X-haul Transport Solutions Speaker: Raza Kahn, Senior Market Manager - Wireless Products This presentation highlights some of the market growth drivers and key technology trends for the 5G wireless market, particularly for 5G front haul and mid haul deployments. This also discusses how innovative IC solutions enabling low latency optical links can help the 5G front haul and mid haul deployments
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CIOE 2022 SEPTEMBER 7-9, 2022
WORLD'S LEADING OPTOELECTRONIC EVENT
EXHIBITION & CONVENTION CENTER SHENZHENWORLD
Exhibition Area: 200,000 M² Exhibitors: 3,000 + Visitors: 90,000 +
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Wednesday3November 9:30 – 10:00 Overview of XR Optics Technology, benefits, Open XR Forum goals XR optics is the industry’s first point-to-multipoint coherent optical subcarrier aggregation technology, purpose-built to break the inherent limitations of traditional point-to-point optical transmission solutions. XR optics provides the industry’s first scalable solution, optimized for point-to-point and point-to-multipoint traffic flows, and designed to dramatically reduce the number of transceivers in the network, eliminate the need for costly intermediate aggregation devices, resulting in TCO savings of 70% or more. Infinera’s onsite subject matter experts will also provide information on the newly founded Open XR Forumwith a goal to foster collaboration that will advance the development of XR optics-enabled products and services, accelerate adoption of coherent point-to-multipoint network architectures, and drive standardization of networking interfaces to ensure ease of multi-vendor interoperability and an open, multi-source solution ecosystem.
11:00 – 11:30 Overview of XR Optics Technology, benefits, Open XR Forum goals XR optics is the industry’s first point-to-multipoint coherent optical subcarrier aggregation technology, purpose-built to break the inherent limitations of traditional point-to-point optical transmission solutions. XR optics provides the industry’s first scalable solution, optimized for point-to-point and point-to-multipoint traffic flows, and designed to dramatically reduce the number of transceivers in the network, eliminate the need for costly intermediate aggregation devices, resulting in TCO savings of 70% or more. Infinera’s onsite subject matter experts will also provide information on the newly founded Open XR Forum with a goal to foster collaboration that will advance the development of XR optics-enabled products and services, accelerate adoption of coherent point-to-multipoint network architectures, and drive standardization of networking interfaces to ensure ease of multi-vendor interoperability and an open, multi-source solution ecosystem.
10:00 – 10:30 XR Optics Applications
11:30 – 12:00 XR Optics Applications
This session provides an overview of XR optics applications and use cases, as well as highlights of recent techno-economic studies and field trials conducted across a wide range of network operators and in a variety of applications (metro aggregation, PON overlay, mobile backhaul, and others.). The session can also be complemented with a white board sessions with Infinera’s onsite subject matter experts. 10:30 – 11:00 Infinera’s ICE6 technology and applications This session provides an overview of Infinera’s 5th generation optical engine (ICE6/800G). It describes key innovative features and capabilities behind ICE6’s industry-leading and record-setting optical performance. Onsite Infinera’s subject matter experts can help you understand how ICE6 can reduce the cost of optical transport (boost capacity/reach), maximize fiber capacity, and lower operational costs.
This session provides an overview of XR optics applications and use cases, as well as highlights of recent techno-economic studies and field trials conducted across a wide range of network operators and in a variety of applications (metro aggregation, PON overlay, mobile backhaul, and others.). The session can also be complemented with a white board sessions with Infinera’s onsite subject matter experts. 12:30 – 12:30 Infinera’s ICE6 technology and applications This session provides an overview of Infinera’s 5th generation optical engine (ICE6/800G). It describes key innovative features and capabilities behind ICE6’s industry-leading and record-setting optical performance. Onsite Infinera’s subject matter experts can help you understand how ICE6 can reduce the cost of optical transport (boost capacity/reach), maximize fiber capacity, and lower operational costs.
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