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Monday 1st November
11:00 – 11:30 LightCounting Adoptionof SiliconPhotonics accelerated in2018-2020 Speaker: Vladimir Kozlov, Founder and CEO It is clear by now that Silicon Photonics (SiP) is making a very significant impact on the market. Sales of SiP-based products started to ramp in 2014, accelerated in 2018 and reached almost $2 billion in 2020, accounting for 25% of the total market for optical transceivers. Numerous foundries offer design and manufacturing of SiP optical engines, making this technology available to a wide range of suppliers and accelerating innovation. Co-packaged optics and Integration of optical chips with coherent and PAM4 DSPs will solidify market position of SiP technology over this decade. 11:35 – 12:05 Intel Integrated Silicon Photonics for High-Bandwidth Data Center Connectivity Speaker: Scott Schube, Sr. Director of Strategic Marketing Data center traffic continues to grow at an exponential rate and is generating a large demand for optical transceivers at ever increasing data rates and bandwidth densities with reduced cost per bit and power consumption per bit. We’ll review the recent trends for pluggable transceivers from 100G to 1.6T and discuss how continued bandwidth scaling is driving the need for a much tighter integration of optics and electronics. Deployments of co-packaged optics (CPO) at scale will require wafer level fabrication processes to manufacture photonic ICs with a high density of integrated components, advanced 2.5/3D packaging to integrate multiple electrical and photonic ICs, and appropriate system level thermal and mechanical solutions. 12:10 – 12:40 Lightwave Logic Advancing integrated photonics with electro-optic polymer modulators Speaker: Michael Lebby, CEO Electro-optic polymer modulators are now poised to impact data- heavy applications such as datacenter networks, high-performance computing and telecom applications with their inherent high speed and very low power properties. Electro-optic polymers are now additive to integrated photonics platforms such as silicon photonics to increase performance significantly. Two types of polymer designs that are called Polymer Plus™ and Polymer Slot™ have been developed that are compatible with integrated photonics platforms and fabricated in commercial silicon foundries using standard PDKs (process development kits). The talk will discuss the latest results on stable and reliable EO polymers for integrated photonics platforms that have demonstrated electro-optical and electrical 3dB bandwidths that are in excess of 100GHz. These highspeed, low-power solutions provide a vehicle for next generation PIC (photonic integrated circuit) designs. The electro- optical materials have competitive performance characteristics both at 1310nm as well as 1550nm operating wavelengths. The development of 1310nm advanced polymers opens up opportunities for short distance optical interconnects that are expected to positively impact the datacenter and high-performance computing market. This talk will also review the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level. The roadmaps are a working, living document that helps plot out PIC platform challenges, opportunities, and directions for a broad portfolio of stakeholders over the next decade. The roadmaps review next generation aggregated data rates of 1600 and 3200 Gbps as well as multi-Tbps optical switching solutions, and more specifically, how these challenges can be addressed by polymer-based technologies.
12:45 – 13:15 Ayar Labs UK Ltd Optical I/O for Chip-to-Chip Communications Speaker: Mark Wade, CTO A new connectivity solution is needed to meet the ever-growing bandwidth needs of data-intensive applications, low power interconnects, and new innovative heterogeneous and disaggregated system architectures. In-package Optical I/O is poised to disrupt performance, cost, and efficiency curves and create a new path forward for composable computing. In this talk, Hugo Saleh will present advancements in building a new generation of chiplet and multi- wavelength laser solutions that deliver up to 1000x bandwidth density at 1/10th the power of standard electrical I/O. Additionally, he will share the impact of chip-to-chip connectivity on next-generation computing systems for AI/HPC, telecommunications and intelligent edge. 13:20 – 13:50 Sicoya GmbH Optics in Cloud Computing -> 100G/400/800 GbE optics Speaker: Marco Vitali The introduction of 100G per lambda optics is ongoing and the industry is yet again entering into another iteration of debating about how to define next generation interconnects. A number of different approaches have been proposed such as co-packaging optics with switch ASICS and defining new pluggable modules that can support up to 1.6T utilizing 200G per lambda. In this presentation we are going to review the individual options and assess them in terms of performance, cost of ownership and maturity of the ecosystem. We will highlight how Silicon Photonics is going to play an important role in all those solutions and provide an update of the most recent technology developments in this field. 13:55 – 14:25 Avicena Novel LED based parallel optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications Speaker: Christoph Pfistner, Marketing & Business Development Avicena is developing a highly parallel LED based optical link technology targeting up to 10m reach for chip-to-chip interconnects in High-Performance and Cloud computing, as well as processor-to- memory disaggregation applications. The technology is based on arrays of novel GaN high-speed micro emitters, leveraging the LED display ecosystem, and Si based PDs integrated into a single CMOS chip and linked with multi-core fiber. At 10Tbps/mm2 @ < 0.5pJ/bit combined with excellent reliability over the industrial temperature range of -40°C to +150°C this new class of optical interconnects eliminates the inherent power, reach and interference limitations of electrical links in chip-to-chip communications.
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