Grinding Wheel for Wafer Thickness Processing VitaNova Series
Wheel Line up
Grit Size
#325
#600
#1000
#1500
#2000
#2400
#3000
#4000
#6000
#8000 #10000
High Grain Retention ▶ High Ef ciency, Long Life High Abrasive Grain Dispersion ▶ Low-Damage Processing
Grain Size
44 µm 30 µm 15 µm 10 µm 7 µm 5 µm 3 µm 2 µm 1 µm 0.5 µm 0.3 µm
Masspower I A (P.3)
Masspower II B (P.4)
SiC
Si (Single Side Surface Grinding)
VRS/VRA
Premium (P.5)
V-Heart (P.5) Cell ed (P.5)
Si (Double Disk Surface Grinding)
VRS/VRA
Premium
Masspower (P.6)
LT/LN
VRS/VRA
Masspower (P.6)
GaN
MT (Metal Bond)
VRS/VRA
Masspower (P.6)
Sapphire
VRS/VRA
Premium
GaAs/InP
VRS/VRA
Premium
Quartz/Glass
Premium
VRS/VRA
AlN
Masspower
Semiconductor Wafer Machining Process
Slicing
Ingot
End Face Machining / Orientation Flat Marking
Beveling
Notch Processing
Surface Grinding
CMP
Laser Slicing
Package
Molding
Bonding
Dicing
Back Grinding
BEOL (Back end of Line)
EPI
1
2
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