Magnetic Material, Glass, Ceramicsw／Glass, Ceramics
Glass, Ceramics
DPG Wheel
MT Bond Wheel Series
A Bonded Grain Lapping Plate Friendly to People and Environment The "MDP Bond" series developed based on metal bond is employed in order to maintain good grain holding power and sharpness in bonded grain lapping. This plate solves problems (such as work environment and industrial wastes generation) in conventional lapping by use of loose abrasive grains and ensures high precision and high efficiency lapping. ・Reduce industrial waste dramatically. ・Clean operating environment. ・5 to 100 times faster grinding speed compared to loose abrasive lapping. ・Reduce maintenance costs with long lasting plate and gear. ・The conventional processes of grinding and lapping can be integrated. ■Features ・Highly precise and highly efficient thickness processing of Glass, Ceramics, Iron materials and Carbide ■Applications
A New Metal Bond Wheel Having Ultimate Sharpness
MT Bond is a new metal bond which is manufactured to reach optimum grinding ability, fusing the advantages of both resin bond and metal bond. The Diamond wheel efficiently grinds ceramic, carbide, cermet, and quartz, on the other hand, CBN wheel is for non-ferrous materials.
・Diamond-MT Bond Wheels : High efficiency machining of Ceramics, Carbide, Cermet and Quartz ・CBN-MT Bond Wheels : High efficiency machining of various ferrous materials ・Surface machining using cup type wheels and creep feed grinding, ideal for machining with the problem of sharpness of the wheel ■Applications ・High efficiency grinding of various materials realized. ■Features
■Cassette Plate
●Top Face
●Base
Mounting Hole
●Pellet Pattern Keeps High Accuracy Grinding ・Divisible cassette designed for pellet layout. ・Seams never interfere with the density of pellet distribution. ●Reduction of Replacing Process for Cassette Plate ・No detaching base plate. ・Divisible cassette fixed on base plate. ・Short dressing time (20 minutes : 9B, 1~2 hours : 16B). ■Merit of Cassette Plate
Diamond Pellet
Water Hole
・A concave part for grinding fluid is formed in the divisible cassette mounting face. ・A multiple number of water holes can be provided freely on the divisible cassette base plate. ●Free Layout of Coolant Hole for Top Plate
■MT Bond Wheel that Cuts Better than Resin
Wheel peripheral Speed : 1,600 m/min Feed Rate : 60 m/min D.O.C. : 1 mm/pass 1）Machine Horizontal Spindle Surface Grinding Machine 2）Workpiece Silicon Nitride 3）Grinding Conditions Comparison Against Resin Bond Wheel in Creep Feed Grinding ■MT Bond Wheel that has Fine Grains, yet Cuts Well
■Grinding Ability of each Grades MT Bond
Size
Max. Dia. (mm)
Min. Dia. (mm)
Comparison of Grinding Force Against Resin Bond Wheel
Comparison of Grinding Performance by MT Bonds
4B 5B 6B
299 389 380 650 637
117 213 148 384 218 360 274 346 270 294 458 554 660
Comparison Between Lapping and Fixed Grain Grinding (DPG)
Grinding Performance of DPG Wheel (MDP Bond)
1）Machine Horizontal Spindle Surface Grinding Machine 2）Workpiece Silicon Nitride 3）Grinding Conditions Wheel peripheral Speed: 1,760 m/min
Wheel peripheral Speed : 1,650 m/min Feed Rate : 10 m/min D.O.C. : 20 µm/pass 1）Machine Horizontal Spindle Surface Grinding Machine 2）Workpiece Silicon Nitride 3）Grinding Conditions
Grinding Rate (µm/min)
Surface Roughness (Ra µm)
6B/9B
Grinding Rate Grinding Ratio
(Index) 10
（µm/min）
（Ra µm）
Feed Rate : 10 m/min D.O.C. : 20 µm/pass
9B
0.25
100
12B 13B 15B 16B 18B 20B 24B 28B
1,058
8
0.2
950
80
1,022 1,127 1,260 1,355 1,592 1,864
6
0.15
Result
Result
60
The grinding force (normal force) is 40% lower than the resin bond wheel
MT Bond Wheel shows 20% lower grinding force than resin bond wheel with the same grit size. The finer grit produces a lower grinding force.
4
0.1
40
2
0.05
20
0
0
0
DPG
Lapping
MDP1 MDP2 MDP3 MDP4 MDP5
200 (N/mm)
(N/mm)
30 (N/mm)
Fn´
Ft´
Grinding Ratio
*Special sizes also available
400 150 200 250 300 350 100
50
EG Wheel
10 15 20 25
40
150
Approx. 40% Less
Good Surface Roughness, High Efficiency Grinding and Long Life
・Truing and dressing can be performed simultaneously by using an exclusive rotary dresser. ・Performing these operations on a machine provides very high accuracy (run-out shape etc.). ・Since cutting edges can be generated to a high level of accuracy good surface roughness high efficiency grinding and long life can be expected. ■Features ■Applications ・High efficiency and high quality processing of Ceramics and Carbide parts
30
100
20
The use of an exclusive diamond rotary dresser enables simple and easy truing with equipment and methods similar to those for CBN wheels and general grinding wheels and at the same time, dressing can be performed also. Furthermore, this epoch-making diamond wheel allows truing and dressing to be performed on a machine to ensure very high accuracy, enabling high precision grinding.
50
10
5 0
50
0
0
0
#140-MT
#800-MT #400-MT #230-MT #230-B
#140-B
MT50 MT40 MT30 MT20 MT10
□Example of Alumina Surface Grinding 1）Machine Horizontal Spindle Surface Grinding Machine 2）Wheel Specification ①EG Whee：l SD230J1-C2 ②Resin Bond Wheel : SDC230-B 3）Dresser Specification ①EG Wheel : Diamond Rotary Dresser (ALMT) ②Resin Bond Wheel : Brake Dresser 4）Workpiece Alumina Al 2 O 3 5）Conditions Material Removal Rate Z´＝0.7 mm 3 /min･s ■Machining Results
Low-Resistance Electroplated Wheels
Electroplated wheel with improved sharpness enables forming machining with reduced damage such as chipping and cracking to brittle materials such as ceramics and magnetic materials. ・A wide range of grinding requirements can be accommodated by the exclusive design of the base metal. ・Oil hole design allows coolant supply to the abrasive surface. ・Re-electroplating is also available. ■Features
■Comparison of Surface Roughness EG Wheel
■Manufacturable Ranges
・Building material panel grinding ・Magnetic material grinding ■Machining Results ・Form grinding of ceramics, magnetic materials, etc. ■Applications
Outer Diameter φ3〜750 mm T Size 3〜300 mm X Size 2〜15 mm Grit Size
Resin Bond Wheel
Rz(µm) Ra(µm)
1.2 0.1
3.0 4.0
SD（#80〜#3000）
Measurement Data
Surface roughness which is about 1/3 of that by the resin bond wheel is achieved.
Result
031
032
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