Optical Connections Magazine Autumn 2022

PRODUCT NEWS

The new Sticklers Pro 360™ Touchless Cleaner is the future of high-performance fibre optic end face cleaning. Unlike anything else in the industry, this groundbreaking tool stands out for its ability to quickly The game-changing Sticklers Pro 360™ Touchless Cleaner provides up to 2,700 contactless cleans per each hermetically sealed solvent cartridge; giving technicians the portability they want and the fibre cleanliness they demand, all at the lowest cost per clean. Sticklers Pro 360™ Touchless Cleaner face. Unlike click-to-clean tools, the Sticklers Pro360™ Touchless Cleaner makes no physical contact, yet thoroughly cleans the end face all the way to the ferrule edge. The connector is left perfectly clean and dry, with no contamination to migrate into the contact zone and block the optical signal. naval, and military applications. The Sticklers Pro 360™ Touchless Cleaner comes with rechargeable lithium-ion batteries and charging station, an AC power supply w/international adapter, a cleaning fluid cartridge, fixtures to clean 1.25mm, and 2.5mm connectors, and a rugged case for storage and transport.

and completely clean oils and dust across the entire end face of both male and female connector ends, with just the press of a button. A hand-held dispensing wand delivers a micro-dose of atomized cleaning fluid within a narrow column of pressurized air onto a fibre optic connector end

Compact enough to clip to a worker’s utility belt, the Sticklers Pro 360™ Touchless Cleaner travels anywhere you need high- performance end face cleaning. Use it for FTTH, FTTA and data centre applications as well on connectors used in aviation,

AssemblyLine – Automated die-level photonic device assembly

Optical Simulation for Design Innovation

AssemblyLine systems are fully automated ‘align-&- attach’ assembly systems for the production of optoelectronics and photonic devices. They uniquely combine high-precision optical alignment capability with epoxy-based attachment, eutectic die bonding and/ or laser-assisted soldering for all optical elements, waveguides, fiber types and die, chip or PIC hybridization tasks – all in an industry-proven design. These assembly systems are available as individual, versatile, and highly capable stand-alone cells, or as highly specific in- line process cells for insertion into existing production lines.

At COMSOL, we develop modeling software that drives new breakthroughs in many industries, including the optics

ground up. By utilizing state- of-the-art handling and feed in/out options, task-optimized Assemblyline and Testline systems can be combined in an extended line configuration for volume manufacturing. Optional, ML-based process monitoring hardware and software add-ons ensures minimal downtime. Highlights • Fully automated passive/ active photonic device assembly • Designed for all optical element, fiber, and chip assembly tasks • Applications in sensors & lidar, HPLDs, co-packaging, PIC assembly • Next-generation system platform is adaptable ‘From Lab to Fab’

efficient

products. In addition, this module includes specialized methods for the simulation of optically large devices and applications, such as fiber Bragg gratings, lens systems, fiber couplings, and laser beam delivery systems. The Wave Optics Module can be combined with the Ray Optics Module, a separate add-on module, for simultaneous full-wave and ray tracing simulations. The Ray Optics Module offers a ray tracing approach for modeling electromagnetic wave propagation where the waves are treated as rays that can be absorbed, reflected, or refracted. Additionally, this module supports structural- thermal-optical performance (STOP) analysis, which is important when analyzing optical systems that operate in harsh environments, like in space or underwater. A STOP analysis provides the most accurate way to capture environmental effects that a design can be subjected to.

and photonics industry. Our platform product, COMSOL Multiphysics®, provides an intuitive environment for creating physics-based models and simulation apps. There are also various add-on modules that can be used to expand the simulation platform for modeling applications of electromagnetics, wave optics, ray optics, and more. For example, using the Wave Optics Module add-on, engineers and scientists can study electromagnetic wave propagation and resonance effects in optical fibers, laser cavities, plasmonics, metamaterials, and other optical applications. By simulating and analyzing electromagnetic field distributions, power dissipation, reflection, and transmission coefficients in a given design, optical engineers can develop powerful and

Optional modules provide additional features, including automatic tool changing, wafer handling capability and Testline (test-&- qualify) functionality. ficonTEC’s next- generation system

architecture is designed to be production-line- capable from the

www.opticalconnectionsnews.com

39

ISSUE 30 | Q3 2022

Made with FlippingBook Ebook Creator