Tuesday 24 th September – Morning Photonics Integration and digital silicon photonics Ovum The Market for High Speed Optical Communications Speaker: Lisa Huff, Principal Analyst, Optical Components Time: 10:20 In 2019, we are seeing the start of the adoption of 400G in data center networks while already shipping 400G/600G into telecom networks. Shipments to both will accelerate in 2020 and beyond fueled mainly by large cloud data center operators. Ovum will present market data to show the overall growth of this market and how optical integration and Silicon Photonics will become much larger contributors to it. Intel Integrated Silicon Photonics for Future Datacenter Applications Speaker: Thomas Liljeberg, General Manager, Integration for Intel Silicon Photonics Products Division Time: 10:55 The rapid growth in data center traffic is driving the need for increased performance and overall bandwidth of networking equipment, including optical interfaces and Ethernet switches, which are based on pluggable transceivers today. But looking just a few years ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. We will review motivation for integration and the enabling technology elements, and discuss how co-packaged Silicon Photonics enables higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance. Lightwave Logic Polymer modulators with >50GHz performance for power consumption reduction at 400, 800, and 1600 Gbaud aggregated datarates Speaker: Dr. Michael Lebby, CEO Lightwave Logic Time: 11:30 The talk will discuss how polymer-based high-speed modulators will meet the new challenges of 400, 800, and 1600 Gbaud datarates. Results will be shown for polymer modulator performance that exceeds 50 GHz bandwidth which will support 100 Gbps PAM4 signalling with minimal signal processing on both transmit and receive ends of the link. It will also discuss the potential to drive polymer modulator bandwidths in excess of 80 GHz which enables 200 Gbps PAM4 signalling or 100 Gbps NRZ on a single channel. Moreover, with higher performance active EO polymers, Lightwave Logic’s platform can provide a lower power consumption for systems through direct driving of modulators without the use of dedicated (and expensive) driver chips. This talk will also review the latest work in photonics roadmaps (IPSR – International Photonics Systems Roadmap process, 2019) that look out towards 1600 Gbps with polymer-based technologies.
Hewlett Packard Enterprise Innovative integrated photonics for green supercomputing Speakers: Di Liang, Senior Research Scientist Time: 12:05 The ending decade of 2010s is an era when cloud-driven data centers and photonic links, particularly silicon photonics, enable each other to scale. Same promise is hold to develop interconnect solutions with energy efficiency, large bandwidth, low latency, and affordable cost, etc. for next-generation high-performance computing. To fulfill this mission, innovative materials, device structures, link architecture and design mindset on top of our silicon photonic platform, namely a silicon-plus photonic integration, will be introduced. I will also elaborate our vision to build an open silicon photonics ecosystem to better prevail the technical challenges and create more business opportunities. Ciena Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems Speaker: Martin Guy, Senior Director Time: 12:40 Next-generation, high-capacity optical coherent transmission systems at 400G and above will demand different sets of requirements depending on the target applications. Long haul and ultra-long haul systems, such as submarine and inter-continental links, will have to be optimized for fiber capacity and reach. Shorter-reach applications, such as metro, DCI and 5G access links, will need low power and high- density, pluggable modules. From an optical components perspective, the right combination of photonic integration technologies will be mandatory to address all of the stringent requirements related to bandwidth, size, power and cost. In this presentation, we will review the opportunities associated with InP and Silicon Photonics optical material platforms and photonic packaging technologies to address the challenges of next-generation high-capacity optical coherent transmission systems. Acacia Communications Next Generation Coherent – Beyond transport networks Speaker: Tom Williams, Vice President of Marketing Time: 13:15 After initial adoption in long-haul transport applications, use of coherent technology has consistently progressed toward shorter reaches. Multi- haul solutions addressing network applications ranging from edge to submarine are available today, while standardized coherent interfaces in pluggable form factors are expected to drive wider deployment of IPoDWDM architectures and adoption of coherent in even shorter reach applications. At higher data rates, “coherent grey optics” will compete with direct detect in non-DWDM applications inside data centers. What are the advances necessary for widespread deployment of coherent in these high-volume applications and how will this impact future network architectures and development roadmaps?
20
Made with FlippingBook Learn more on our blog