Ultra-Precision Cutting Tools BL-UPC
□ Sharp Cutting Edge Equivalent to Single-Crystal Diamond
SUMIDIA TM Binderless (Nano-polycrystalline Diamond) Ultra-Precision Cutting Tool BL-UPC
50 μm
AL
Employs SUMIDIA TM Binderless on the cutting edge of UPC TM
□ Flank Wear Comparison of Machined Cemented Carbide
Achieves long tool life in mirror finish and fine machining of cemented carbides
■ Features of SUMIDIA TM Binderless ● Fine grains of a few dozen nanometres are firmly and directly bonded together without the use of a binder.
0.025 mm
● Harder than single-crystal diamond. ● No anisotropy or specific cleavage.
BL-UPC
No Large Chipping Found
■ BL-UPC Features ● Superior fracture and wear resistance
compared to single-/polycrystalline diamond. ● Sharp and precise cutting edge equivalent to UPC TM (single-crystal diamond). ● Free from uneven wear caused by crystal orientation, as it is not anisotropic. ■ Applications ・ Moulds for cemented carbide glass lenses ・ Large moulds for prism sheets and light guide plates ・ Glass lenses ・ Machining of other high-hardness and brittle materials
Wear Damage
Chipping
0.025 mm
UPC TM (Single-crystal Diamond)
Large Chipping Found
□ Comparison of Required Characteristics for Cutting Tool Materials
Diamond
Required Characteristics for Cutting Tool Materials
Sintered (Polycrystalline)
Nano- polycrystalline
Surface Roughness of Machined Cemented Carbide
Single-crystal
500 μm
◎
◎
◎
(1) High hardness
○
○
◎
(2) Hardness at high temperatures
△
○
×
(3) Suitable toughness
◎
○
◎
(4) High thermal diffusibility
◎
○
×
(5) Sharpness of cutting edge
Ra 3.5 nm
Finished Surface Roughness
"SUMIDIA TM " is a registered trademark of Sumitomo Electric Industries, Ltd.
AL7
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