Signal - Board to board
HDB3 High Density HSB3 High Speed Amphenol Aerospace • 100,000 mating cycles • Operating Temperature of -65°C to 125°C
HDAS
HE8/127
Amphenol Socapex • Cost effective rugged connector for harsh environments • 6-tines starclip contact technology • Robust and simple design • High-density staggered grid • High-performance to extreme conditions
Amphenol Socapex • Proven legacy product, which meets various worldwide standard (M55302) • Various features, including a wide range of hardware and locking devices
• 36 unique keying combinations • HSB3 data rates up to 6.25 Gbps Connector Options: • HDB3 Mother Board Connector • HDB3 Daughter Board Connector • HDB3 I/O Connector • HDB3 Stacker Connector • HSB3 Mother Board Connector • HSB3 Daughter Board Connector
M55302 Low Mating Force (LMF) Rectangular Connectors Amphenol Aerospace • In service for over 25 years, with over 50 million brush contacts fielded • F-16 Falcon, F/A-22 Raptor, F-35 Lightning II, and many more applications. • 0.100 inch center to center, square grid contact spacing • Application flexibility (parallel boards, perpendicular boards, wire to board, end to end boards, card extenders) • 2, 3 and 4 row contact arrangements with 10 to 100 contacts per row in one contact per row increments • Military versions meet MIL-DTL-55302/166 through /172 • Termination versatility; straight & 90° PCB stud, wire wrap & crimp
SIHD/SIAL
Amphenol Socapex SIAL
• Modular PCB interconnect, which provides various combinations of both signal and HF contacts inserts • Lateral displacer 0.4mm SIHD • Monolithic staggered grid connector, with floating capability feature
Due to technical progress, all information provided is subject to change without prior notice Designed by Amphenol Socapex
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